JPWO2023210727A5 - - Google Patents

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Publication number
JPWO2023210727A5
JPWO2023210727A5 JP2024518014A JP2024518014A JPWO2023210727A5 JP WO2023210727 A5 JPWO2023210727 A5 JP WO2023210727A5 JP 2024518014 A JP2024518014 A JP 2024518014A JP 2024518014 A JP2024518014 A JP 2024518014A JP WO2023210727 A5 JPWO2023210727 A5 JP WO2023210727A5
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JP
Japan
Prior art keywords
peak
recombination center
center density
semiconductor device
doping concentration
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JP2024518014A
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English (en)
Japanese (ja)
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JPWO2023210727A1 (https=
JP7782686B2 (ja
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Priority claimed from PCT/JP2023/016589 external-priority patent/WO2023210727A1/ja
Publication of JPWO2023210727A1 publication Critical patent/JPWO2023210727A1/ja
Publication of JPWO2023210727A5 publication Critical patent/JPWO2023210727A5/ja
Application granted granted Critical
Publication of JP7782686B2 publication Critical patent/JP7782686B2/ja
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JP2024518014A 2022-04-27 2023-04-27 半導体装置 Active JP7782686B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022073381 2022-04-27
JP2022073381 2022-04-27
PCT/JP2023/016589 WO2023210727A1 (ja) 2022-04-27 2023-04-27 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023210727A1 JPWO2023210727A1 (https=) 2023-11-02
JPWO2023210727A5 true JPWO2023210727A5 (https=) 2024-06-20
JP7782686B2 JP7782686B2 (ja) 2025-12-09

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ID=88518793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024518014A Active JP7782686B2 (ja) 2022-04-27 2023-04-27 半導体装置

Country Status (4)

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US (1) US20240266389A1 (https=)
JP (1) JP7782686B2 (https=)
CN (1) CN118056280A (https=)
WO (1) WO2023210727A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021145397A1 (ja) * 2020-01-17 2021-07-22 富士電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5817686B2 (ja) * 2011-11-30 2015-11-18 株式会社デンソー 半導体装置
JP5895950B2 (ja) 2014-01-20 2016-03-30 トヨタ自動車株式会社 半導体装置の製造方法
JP6787521B2 (ja) * 2018-02-16 2020-11-18 富士電機株式会社 半導体装置
WO2019181852A1 (ja) * 2018-03-19 2019-09-26 富士電機株式会社 半導体装置および半導体装置の製造方法
JP6958740B2 (ja) * 2018-08-14 2021-11-02 富士電機株式会社 半導体装置および製造方法

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