JPWO2023182370A5 - - Google Patents

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Publication number
JPWO2023182370A5
JPWO2023182370A5 JP2024509171A JP2024509171A JPWO2023182370A5 JP WO2023182370 A5 JPWO2023182370 A5 JP WO2023182370A5 JP 2024509171 A JP2024509171 A JP 2024509171A JP 2024509171 A JP2024509171 A JP 2024509171A JP WO2023182370 A5 JPWO2023182370 A5 JP WO2023182370A5
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JP
Japan
Prior art keywords
epoxy resin
resin composition
composition according
group
encapsulating epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024509171A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023182370A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/011275 external-priority patent/WO2023182370A1/ja
Publication of JPWO2023182370A1 publication Critical patent/JPWO2023182370A1/ja
Publication of JPWO2023182370A5 publication Critical patent/JPWO2023182370A5/ja
Pending legal-status Critical Current

Links

JP2024509171A 2022-03-25 2023-03-22 Pending JPWO2023182370A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022050783 2022-03-25
PCT/JP2023/011275 WO2023182370A1 (ja) 2022-03-25 2023-03-22 封止用エポキシ樹脂組成物、及び電子デバイス

Publications (2)

Publication Number Publication Date
JPWO2023182370A1 JPWO2023182370A1 (https=) 2023-09-28
JPWO2023182370A5 true JPWO2023182370A5 (https=) 2024-12-02

Family

ID=88101569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509171A Pending JPWO2023182370A1 (https=) 2022-03-25 2023-03-22

Country Status (6)

Country Link
US (1) US20250250458A1 (https=)
JP (1) JPWO2023182370A1 (https=)
KR (1) KR20240162491A (https=)
CN (1) CN118900868A (https=)
TW (1) TW202348718A (https=)
WO (1) WO2023182370A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025110106A1 (ja) * 2023-11-20 2025-05-30 パナソニックＩｐマネジメント株式会社 樹脂組成物及び半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012102336A1 (ja) 2011-01-28 2012-08-02 住友ベークライト株式会社 封止用エポキシ樹脂組成物及び電子部品装置
JP2014070035A (ja) * 2012-09-28 2014-04-21 Tottori Univ イオン液体およびそれを用いたリチウム二次電池用電解質並びにリチウム二次電池用電解液
CN109072045A (zh) * 2016-05-10 2018-12-21 东洋合成工业株式会社 碱产生剂、试剂、有机盐、组合物、元件的制造方法、固化膜和元件
JP6917707B2 (ja) * 2016-12-27 2021-08-11 サンアプロ株式会社 エポキシ樹脂硬化促進剤
JP2018203916A (ja) * 2017-06-07 2018-12-27 サンアプロ株式会社 エポキシ樹脂組成物
WO2020054356A1 (ja) * 2018-09-13 2020-03-19 サンアプロ株式会社 エポキシ樹脂硬化促進剤及びエポキシ樹脂組成物

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