JP2023116574A5 - - Google Patents
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- Publication number
- JP2023116574A5 JP2023116574A5 JP2023091529A JP2023091529A JP2023116574A5 JP 2023116574 A5 JP2023116574 A5 JP 2023116574A5 JP 2023091529 A JP2023091529 A JP 2023091529A JP 2023091529 A JP2023091529 A JP 2023091529A JP 2023116574 A5 JP2023116574 A5 JP 2023116574A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- encapsulating resin
- composition according
- group
- epoxy resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020200901 | 2020-12-03 | ||
| JP2020200901 | 2020-12-03 | ||
| JP2022549774A JP7681032B2 (ja) | 2020-12-03 | 2021-11-26 | 封止用樹脂組成物および半導体装置 |
| PCT/JP2021/043352 WO2022118749A1 (ja) | 2020-12-03 | 2021-11-26 | 封止用樹脂組成物および半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022549774A Division JP7681032B2 (ja) | 2020-12-03 | 2021-11-26 | 封止用樹脂組成物および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023116574A JP2023116574A (ja) | 2023-08-22 |
| JP2023116574A5 true JP2023116574A5 (https=) | 2025-08-06 |
Family
ID=81853884
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022549774A Active JP7681032B2 (ja) | 2020-12-03 | 2021-11-26 | 封止用樹脂組成物および半導体装置 |
| JP2023091529A Pending JP2023116574A (ja) | 2020-12-03 | 2023-06-02 | 封止用樹脂組成物および半導体装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022549774A Active JP7681032B2 (ja) | 2020-12-03 | 2021-11-26 | 封止用樹脂組成物および半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7681032B2 (https=) |
| KR (1) | KR20230112671A (https=) |
| CN (1) | CN116670821A (https=) |
| TW (1) | TW202231767A (https=) |
| WO (1) | WO2022118749A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225118A (ja) | 1985-07-25 | 1987-02-03 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JP5250801B2 (ja) | 2008-09-11 | 2013-07-31 | 日東電工株式会社 | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
| US8502399B2 (en) * | 2009-06-22 | 2013-08-06 | Sumitomo Bakelite Co., Ltd. | Resin composition for encapsulating semiconductor and semiconductor device |
| MY157584A (en) * | 2009-10-20 | 2016-06-30 | Sumitomo Bakelite Co | Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent |
| KR101748897B1 (ko) * | 2009-11-24 | 2017-06-19 | 스미토모 베이클리트 컴퍼니 리미티드 | 유동 특성 측정용 금형, 유동 특성 측정 방법, 반도체 봉지용 수지 조성물 및 반도체 장치의 제조 방법 |
| JP5301597B2 (ja) * | 2011-03-14 | 2013-09-25 | 株式会社日本触媒 | 硬化性樹脂組成物およびこれを用いた半導体装置 |
| WO2014203781A1 (ja) * | 2013-06-21 | 2014-12-24 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物および半導体装置 |
| JP6227954B2 (ja) * | 2013-09-26 | 2017-11-08 | 株式会社日本触媒 | 硬化性樹脂組成物及びその用途 |
| JP6794626B2 (ja) * | 2015-12-14 | 2020-12-02 | 住友ベークライト株式会社 | 封止用樹脂組成物、半導体装置および車載用電子制御ユニット |
| WO2019131379A1 (ja) * | 2017-12-25 | 2019-07-04 | 住友ベークライト株式会社 | 電子装置の製造方法 |
| CN110437764B (zh) * | 2019-08-16 | 2021-06-29 | 石家庄正旭环保建材有限公司 | 一种树脂改性淀粉粘合剂及其制备方法 |
| CN111423618B (zh) * | 2020-05-20 | 2021-07-06 | 中国科学技术大学 | 一种氮杂环芳香胺-金属离子络合物阻燃剂及其在制备阻燃环氧树脂中的应用 |
-
2021
- 2021-11-26 KR KR1020237020916A patent/KR20230112671A/ko active Pending
- 2021-11-26 WO PCT/JP2021/043352 patent/WO2022118749A1/ja not_active Ceased
- 2021-11-26 CN CN202180081746.8A patent/CN116670821A/zh active Pending
- 2021-11-26 JP JP2022549774A patent/JP7681032B2/ja active Active
- 2021-12-01 TW TW110144835A patent/TW202231767A/zh unknown
-
2023
- 2023-06-02 JP JP2023091529A patent/JP2023116574A/ja active Pending
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