WO2023182370A1 - 封止用エポキシ樹脂組成物、及び電子デバイス - Google Patents

封止用エポキシ樹脂組成物、及び電子デバイス Download PDF

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Publication number
WO2023182370A1
WO2023182370A1 PCT/JP2023/011275 JP2023011275W WO2023182370A1 WO 2023182370 A1 WO2023182370 A1 WO 2023182370A1 JP 2023011275 W JP2023011275 W JP 2023011275W WO 2023182370 A1 WO2023182370 A1 WO 2023182370A1
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Prior art keywords
epoxy resin
resin composition
sealing
group
less
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PCT/JP2023/011275
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English (en)
French (fr)
Japanese (ja)
Inventor
泰明 前田
和人 小川
央之 藤原
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to CN202380028791.6A priority Critical patent/CN118900868A/zh
Priority to JP2024509171A priority patent/JPWO2023182370A1/ja
Priority to KR1020247029430A priority patent/KR20240162491A/ko
Priority to US18/849,738 priority patent/US20250250458A1/en
Publication of WO2023182370A1 publication Critical patent/WO2023182370A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/69—Particle size larger than 1000 nm
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/68—Particle size between 100-1000 nm
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Definitions

  • the present disclosure relates to an epoxy resin composition for sealing and an electronic device.
  • the present invention relates to an epoxy resin composition for sealing and an electronic device including a sealing part made from the epoxy resin composition for sealing.
  • Patent Document 1 discloses an epoxy resin composition for sealing containing (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) a curing accelerator, and (D) The average particle size of the curing accelerator is 10 ⁇ m or less, and (D) the curing accelerator is selected from the group consisting of a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, and an adduct of a phosphonium compound and a silane compound. (Paragraph 0032 of Patent Document 1).
  • An object of the present disclosure is to provide an epoxy resin composition for sealing that has high storage stability and can increase the curing speed during curing, and an electronic device.
  • the epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D).
  • the curing accelerator (C) contains amidine silicate (C1) represented by the following formula (1).
  • R 1 and R 2 are each independently hydrogen or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and R 3 and R 4 are each independently a phenylene group or naphthylene.
  • R 5 is at least one group selected from the group consisting of a phenyl group, a functional group represented by the following formula (2), and a functional group represented by the following formula (3).
  • n is 3 or more and 8 or less.
  • An electronic device includes a semiconductor element and a sealing part that seals the semiconductor element.
  • the sealing portion is made of a cured product of the sealing epoxy resin composition.
  • FIG. 1 is a schematic cross-sectional view showing an electronic device according to an embodiment of the present disclosure.
  • Patent Document 1 International Publication No. 2012/1023366 describes a seal containing (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) a curing accelerator.
  • a stopper epoxy resin composition is disclosed.
  • the epoxy resin composition for sealing according to this embodiment contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D).
  • the curing accelerator (C) contains amidine silicate (C1) represented by the following formula (1).
  • the epoxy resin composition for sealing can be cured by the reaction between the epoxy resin (A) and the curing agent (B), and by containing the curing accelerator (C), the reaction can proceed more efficiently. I can do it.
  • the inorganic filler (D) can adjust the physical properties of the sealing part, such as the heat resistance, thermal conductivity, and linear expansion coefficient, of the sealing part produced from the sealing epoxy resin composition.
  • the epoxy resin composition for sealing contains the amidine silicate (C1) represented by formula (1) in the curing accelerator (C), so that the epoxy resin composition for sealing
  • the storage stability of the epoxy resin composition for sealing can be improved without impairing the curability when the composition is heated and cured.
  • the amidine silicate (C1) contained in the curing accelerator (C) is a curing accelerator consisting of an amidine cation and a silicate anion. While the amidine cation is relatively basic and can have high activity, the silicate Since the anion has a skeleton derived from dihydroxynaphthalene or catechol, it tends to have a high melting point.
  • amidine silicate (C1) tends to keep its activity low under temperature conditions such as room temperature, but its activity tends to increase under high temperature conditions, and in particular, it tends to increase its activity by heating to a temperature near its melting point.
  • amidine silicate (C1) can easily improve the storage stability of the epoxy resin composition for sealing, and can exhibit activity when heating and curing the epoxy resin composition for sealing. It is considered that a high curing rate of the epoxy resin composition for sealing can be easily obtained.
  • an epoxy resin composition for sealing that has high storage stability and can increase the curing speed during curing.
  • the epoxy resin composition for sealing of this embodiment can be suitably used for sealing electronic components such as semiconductor elements in electronic devices.
  • the epoxy resin composition for sealing of the present embodiment contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D). .
  • Epoxy resin (A) is a thermosetting component.
  • the epoxy resin (A) can be cured by reacting with the curing agent (B) when the epoxy resin (A) and the curing agent (B) are heated in the epoxy resin composition for sealing.
  • the epoxy resin (A) can impart heat resistance to the cured product of the epoxy resin composition for sealing.
  • the epoxy resin (A) contains at least one component selected from the group consisting of, for example, a glycidyl ether type epoxy resin, a glycidyl amine type epoxy resin, a glycidyl ester type epoxy resin, and an olefin oxidation type (alicyclic) epoxy resin. .
  • the epoxy resin includes, for example, an alkylphenol novolac type epoxy resin such as a phenol novolac type epoxy resin or a cresol novolac type epoxy resin; a naphthol novolak type epoxy resin; a phenol aralkyl type epoxy resin having a phenylene skeleton, a biphenylene skeleton, etc.; Biphenylaralkyl type epoxy resin; naphthol aralkyl type epoxy resin having a phenylene skeleton, biphenylene skeleton, etc.; polyfunctional type epoxy resin such as triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin; triphenylmethane type epoxy resin; Tetrakisphenol ethane type epoxy resin; dicyclopentadiene type epoxy resin; stilbene type epoxy resin; bisphenol type epoxy resin such as bisphenol A type epoxy resin and bisphenol F type epoxy resin; biphenyl type epoxy resin; naphthalene type epoxy resin; alicyclic
  • the components that can be contained in the epoxy resin (A) in the epoxy resin composition for sealing are not limited to those described above, and may contain resins other than those described above that have an epoxy group, and may contain resins that have an epoxy group.
  • the resin may be a monomer or a prepolymer.
  • the curing agent (B) is a compound that can react with the epoxy resin (A) in the epoxy resin composition for sealing.
  • the curing agent (B) contains, for example, a phenol compound. If the curing agent (B) contains a phenol compound, the epoxy resin (A) and the curing agent (B) can undergo a thermosetting reaction.
  • Phenol compounds include, for example, novolak-type resins such as phenol novolac resins, cresol novolak resins, and naphthol novolac resins; phenol aralkyl resins having a phenylene skeleton or biphenylene skeleton; aralkyl-type resins such as naphthol aralkyl resins having a phenylene skeleton or biphenylene skeleton; Polyfunctional phenol resins such as phenolmethane type resins; dicyclopentadiene type phenol resins such as dicyclopentadiene type phenol novolac resins and dicyclopentadiene type naphthol novolak resins; terpene-modified phenol resins; bisphenol types such as bisphenol A and bisphenol F It is preferable to contain at least one component selected from the group consisting of resin; and triazine-modified novolak resin.
  • novolak-type resins such as phenol novolac resins
  • the curing agent (B) is not limited to a phenol compound as long as it undergoes a thermosetting reaction with the epoxy resin (A).
  • the curing agent (B) may contain at least one component among a phenol compound, an acid anhydride, an imidazole compound, and an amine compound.
  • the amount of epoxy resin (A) per equivalent of curing agent (B) is 0.6 eq. Above 10 eq. It is preferable that it is below.
  • Epoxy resin (A) is 10 eq. If it is below, it is possible to realize good curability of the epoxy resin composition for sealing and good heat resistance and strength of the cured product. Moreover, the epoxy resin (A) was 0.6 eq. If it is above, high moisture resistance of the cured product can be realized.
  • the equivalent of the epoxy resin (A) to 1 equivalent of the curing agent (B) is 0.8 eq. Above 5 eq. It is more preferable if it is below.
  • the curing accelerator (C) is a compound that can accelerate the curing reaction between the epoxy resin (A) and the curing agent (B) in the epoxy resin composition for sealing.
  • the curing accelerator (C) contains amidine silicate (C1) represented by the following formula (1).
  • Amidine silicate (C1) has a cation part having an amidine skeleton and an anion part having a silicate skeleton.
  • the cation part has an imidazolium skeleton
  • the anion part has a silicate anion.
  • Amidine silicate (C1) can contribute to improving the storage stability of the epoxy resin composition for sealing and to improving the curing speed during curing.
  • the amidine silicate (C1) has excellent compatibility with the epoxy resin (A) and the curing agent (B). Therefore, even if the epoxy resin composition for sealing is prepared, it is difficult to aggregate, and thereby the dispersibility of the epoxy resin composition for sealing when melted can be improved.
  • Amidine silicate (C1) has a relatively high melting point. Therefore, it is easy to prepare the epoxy resin composition for sealing in a solid form at normal temperature (for example, room temperature, about 25° C.), and it is easy to improve the storage stability of the epoxy resin composition for sealing.
  • the cation moiety is highly basic, the activity tends to be high, but since the amidine silicate (C1) of this embodiment has a high melting point and is solid at room temperature, it is difficult to store the epoxy resin composition for sealing. Activity does not increase easily and storage stability is not affected.
  • the activity of amidine silicate (C1) is well exhibited, so that the epoxy resin composition for sealing can be cured in a relatively short time. I can do it.
  • the melting point of the amidine silicate (C1) is preferably 160°C or higher, more preferably 180°C or higher, and even more preferably 200°C or higher.
  • the upper limit of the melting point of the amidine silicate (C1) is not particularly limited, but is, for example, 300° C. or lower.
  • R 1 and R 2 are each independently hydrogen or an aliphatic hydrocarbon group having 1 or more and 5 or less carbon atoms.
  • R 1 and R 2 are each independently preferably an aliphatic hydrocarbon group having 1 or more and 20 or less carbon atoms, and more preferably an aliphatic hydrocarbon group having 1 or more and 10 or less carbon atoms.
  • the basicity of the cation moiety can be maintained at a good level without increasing it too much. Therefore, the fluidity of the epoxy resin composition for sealing during melting is less likely to be inhibited.
  • the amidine silicate (C1) may contain multiple types of compounds among the compounds represented by formula (1).
  • the amidine silicate (C1) may contain a compound that differs only in R 1 , may contain a plurality of compounds that differ only in R 2 , or may contain a plurality of compounds in which R 1 and R 2 are both different. May contain different compounds.
  • R 3 and R 4 are each independently a phenylene group or a naphthylene group, and R 5 is a phenyl group, or a group represented by the following formula (2). At least one group selected from the group consisting of:
  • the amidine silicate (C1) may contain multiple types of compounds among the compounds represented by formula (1).
  • the amidine silicate (C1) may contain a compound that differs only in R 3 , may contain a plurality of compounds that differ only in R 4 , or may contain a plurality of compounds in which R 3 and R 4 are both different. May contain different compounds.
  • R 5 is a side chain group having an ethylene chain bonded to a silicon atom
  • R 1 and R 2 are each independently a hydrocarbon group having 1 or 2 carbon atoms, and R 5 is a phenyl group or C 3 H 6 SH It is preferable that In this case, the storage stability of the epoxy resin composition for sealing can be further improved, and higher curability during curing can be achieved.
  • amidine silicate (C1) contains at least one selected from the group consisting of compounds represented by the following formulas (11), (12), and (13). In this case, the storage stability of the epoxy resin composition for sealing can be further improved, and higher curability during curing can be achieved.
  • the ratio of the curing accelerator (C) to a total of 100 parts by mass of the epoxy compound (A) and the curing agent (B) is preferably 1 part by mass or more and 35 parts by mass or less. . If it is 1 part by mass or more, it is easier to increase the curing speed during curing of the epoxy resin composition for sealing. If it is 35 parts by mass or less, higher storage stability of the epoxy resin composition for sealing can be easily maintained.
  • the ratio of the curing accelerator (C) to a total of 100 parts by mass of the epoxy compound (A) and the curing agent (B) is preferably 3 parts by mass or more and 25 parts by mass or less, and more preferably 3 parts by mass or more and 20 parts by mass or less. It is even more preferable.
  • the ratio of amidine silicate (C1) to 100 parts by mass of the total amount of epoxy resin (A) and curing agent (B) is preferably 1 part by mass or more and 35 parts by mass or less. If it is 1 part by mass or more, it is easy to further increase the curing speed during curing of the epoxy resin composition for sealing. If it is 35 parts by mass or less, even higher storage stability of the epoxy resin composition for sealing can be easily maintained.
  • the ratio of amidine silicate (C1) to 100 parts by mass of the total amount of epoxy resin (A) and curing agent (B) is more preferably 3 parts by mass or more and 25 parts by mass or less, and more preferably 3 parts by mass or more and 20 parts by mass. It is more preferable if it is below.
  • the epoxy resin composition for sealing contains an inorganic filler (D).
  • the inorganic filler (D) can improve the heat resistance and thermal conductivity of the sealing part 4.
  • the inorganic filler (B) can also lower the linear expansion coefficient of the sealing part 4.
  • the average particle size of the inorganic filler (D) is preferably 0.5 ⁇ m or more and 15 ⁇ m or less. In this case, the fluidity of the epoxy resin composition for sealing is not impaired and is easy to maintain.
  • the average particle diameter of the inorganic filler (D) in the present disclosure is a volume-based median diameter (D50).
  • the median diameter (D50) is calculated from the particle size distribution measured by laser diffraction/scattering method.
  • the particle size distribution can be measured, for example, by a laser diffraction particle size distribution measuring device, and examples of the laser diffraction particle size distribution measuring device include MT3300EX2 manufactured by Microtrac Bell Co., Ltd.
  • the inorganic filler (D) contains inorganic particles with a particle size of 0.1 ⁇ m or less, and the ratio of the inorganic particles to 100 parts by weight of the inorganic filler (D) is 0.1 parts by weight or more and 30 parts by weight or less. It is preferable that In this case, the fluidity of the epoxy resin composition for sealing during melting can be maintained better.
  • the lower limit of the particle size of the inorganic particles is not particularly limited. In the present disclosure, the proportion of inorganic particles having a particle size of 0.1 ⁇ m or less can be confirmed by measuring the frequency distribution of particle sizes of 0.1 ⁇ m or less using a laser diffraction particle size distribution analyzer. The measuring device may be the same as the device described above.
  • the inorganic filler (D) any appropriate material may be used within a range that does not impede the purpose of the present disclosure.
  • the inorganic filler (D) can contain at least one component selected from the group consisting of fused silica such as fused spherical silica, crystalline silica, alumina, aluminum nitride, and silicon nitride.
  • the ratio of the inorganic filler (D) to the total amount of the epoxy resin (A), the curing agent (B), the curing accelerator (C), and the inorganic filler (D) is 60 It is preferably at least 93% by mass. If the proportion of the inorganic filler (D) is 60% by mass or more, it is easier to maintain the fluidity of the epoxy resin composition for sealing when melting, and if the proportion of the inorganic filler (D) is 93% by mass or less, the epoxy resin composition for sealing It is easier to ensure the filling of objects.
  • the ratio of the inorganic filler (D) to the total amount of the epoxy resin (A), curing agent (B), curing accelerator (C), and inorganic filler (D) may be 60% by mass or more and 90% by mass or less.
  • the content is more preferably 65% by mass or more and 90% by mass or less.
  • the epoxy resin composition for sealing may further contain appropriate compounds, resins, additives, etc. in addition to the above.
  • additives include appropriate antifoaming agents, surface conditioning agents, coupling agents, fluxes, viscosity modifiers, leveling agents, low stress agents, pigments, and the like.
  • the epoxy resin composition for sealing preferably does not contain an organic solvent or has an organic solvent content of 0.5% by mass or less.
  • the epoxy resin composition for sealing is prepared by, for example, blending the components that can be included in the epoxy resin composition for sealing described above, blending them simultaneously or sequentially, and adding appropriate additives as necessary and mixing. So you get a mixture.
  • the constituent components may be mixed until sufficiently homogeneous using a mixer, blender, etc., then kneaded while heating using a kneader such as a hot roll or kneader, and then cooled to room temperature.
  • a kneaded product of an epoxy resin (A) and a curing accelerator (C) is prepared, and a curing agent (B) and an inorganic filler (D) are added to this kneaded product. May be mixed.
  • a disper, a planetary mixer, a ball mill, a three-roll mill, a bead mill, and the like can be used in appropriate combinations as necessary.
  • the inorganic filler (D) contains multiple types of raw materials with different average particle sizes, before mixing the inorganic filler (D) into the kneaded material, the multiple types of raw materials with different average particle sizes are prepared in advance.
  • An epoxy resin composition for sealing may be prepared by preparing an inorganic filler mixture in which the inorganic filler mixture is mixed, measuring the average particle size of the inorganic filler mixture, and then blending the mixture into the above-mentioned kneaded product.
  • the heating temperature and heating time in the case of heat treatment can be adjusted as appropriate.
  • the heating temperature at this time is preferably, for example, higher than the flow start temperature of the sealing epoxy resin composition and lower than the reaction start temperature between the epoxy resin (A) and the curing agent (B).
  • the heating temperature is preferably, for example, 90°C or more and 140°C or less.
  • the cooling method is not particularly limited and can be set as appropriate. In this embodiment, an epoxy resin composition for sealing that is solid at 25° C. is obtained.
  • a powdered epoxy resin composition for sealing may be produced by pulverizing the epoxy resin composition for sealing prepared by the above method.
  • a tablet-shaped epoxy resin composition for sealing may be manufactured by compressing a powdered epoxy resin composition for sealing.
  • the epoxy resin composition for sealing may have an appropriate shape.
  • the epoxy resin composition for sealing can be cured, for example, by heating to a temperature at which curing starts, thereby obtaining a cured product of the epoxy resin composition for sealing.
  • the epoxy resin composition for sealing has a high curing speed and is particularly excellent in curability.
  • Conditions for heating for curing such as heating temperature, heating time, maximum heating temperature, etc., depend on the type of epoxy resin (A), the type of curing agent (B), and the type of curing accelerator (C), It may be adjusted as appropriate depending on the characteristics of various components.
  • the epoxy resin composition for sealing is preferably solid at 25°C.
  • the epoxy resin composition for sealing can be prepared at room temperature (approximately 25° C.) and has excellent storage stability, so the composition is unlikely to change in the prepared state and is easy to handle.
  • the sealing part 4 can be produced by heating and melting the prepared and stored epoxy resin composition for sealing.
  • the time required for the epoxy resin composition for sealing to reach a torque value of 0.1 kgf cm measured at a temperature of 170°C for 1.67 mL of the epoxy resin composition for sealing is 30 seconds or more. It is preferable that it is 100 seconds or less.
  • the torque value was measured by using a Curelastometer 7P testing machine manufactured by JSR Corporation, setting the upper and lower surface temperatures of the mold of the testing machine to 170°C, and injecting 1.67 mL of the sample. Ru.
  • the time required for the torque value measured at a temperature of 170° C. for 1.67 mL of a sample to become 0.1 kgf ⁇ cm is also referred to as gel time.
  • the epoxy resin composition for sealing in the measurement of the torque value and gel time, 1.67 ml of the epoxy resin composition for sealing is used as a sample for measurement, but the epoxy resin composition for sealing when producing a cured product in the present disclosure It does not limit the amount of When the gel time is 30 seconds or more, it is easy to maintain good fluidity when producing the sealing part 4 from the sealing epoxy resin composition. When the gel time is 100 seconds or less, it is easy to maintain a good curing speed of the epoxy resin composition for sealing. The gel time is more preferably 40 seconds or more and 70 seconds or less.
  • the time for the curing rate to reach 90% or more is 200 seconds or less. It is preferable.
  • the epoxy resin composition for sealing has a higher curing speed and high curability.
  • the time for the curing rate to be 90% or more is preferably 180 seconds or less, and even more preferably 160 seconds or less.
  • the testing machine may be the same as the one that measured the torque value and gel time described above. Note that, as in the gel time measurement above, 1.67 ml of the epoxy resin composition for sealing is used as a sample for measurement, but in the present disclosure, the amount of the epoxy resin composition for sealing when producing a cured product is It is not a restriction.
  • the epoxy resin composition for sealing has a flow distance of 50 cm or more as measured by a spiral flow test method in accordance with ASTM D3123 under conditions of a mold temperature of 170°C, an injection pressure of 70 kg/cm 2 , and a molding time of 180 seconds. It is preferable that In this case, in producing the sealing part 4 from the sealing epoxy resin composition, it is easier to improve the filling property.
  • the flow distance is more preferably 100 cm or more, and even more preferably 150 cm or more. Note that the upper limit of the flow distance is not particularly limited and can be adjusted as appropriate.
  • the epoxy resin composition for sealing according to this embodiment has high potential.
  • “latent” means that the fluidity is less likely to decrease at a relatively low temperature, for example, room temperature (25° C.), and has fluidity even at a temperature up to the molding temperature.
  • the epoxy resin composition for sealing of this embodiment has high storage stability, has high latent properties, and has the property of being able to harden quickly after reaching the molding temperature.
  • the preferable characteristics of the epoxy resin composition for sealing described above can be realized by appropriately adjusting the components of the composition described above.
  • the physical properties of the epoxy resin composition for sealing are not limited to those described above.
  • the epoxy resin composition for sealing of this embodiment can be suitably used for producing the sealing part 4 in the electronic device 1.
  • the electronic device 1 includes a semiconductor element 3 and a sealing part 4 that seals the semiconductor element 3.
  • the sealing portion 4 is made of a cured product of the sealing epoxy resin composition described above (see FIG. 1). Examples of the electronic device 1 and its manufacturing method will be described below.
  • the electronic device 1 is an insertion type package such as Mini, D pack, D2 pack, To22O, To3P, dual inline package (DIP), or quad flat package (QFP), small outline package (SOP). , Small Outline J-Lead Package (SOJ), Plastic Ball Grid Array (PBGA), Fine Pitch Ball Grid Array (FBGA), Wafer Level Package (WLP), Panel Level Package (PLP), fan-out wafer-level package (FO-WLP), fan-out panel-level package (FO-PLP), lip-chip ball-grid array (FC-BGA), antenna-in-package ( This includes semiconductor devices in surface-mount packages such as AiP) and system-in-package (SiP).
  • FIG. 1 shows a cross-sectional view of an electronic device 1 in this embodiment.
  • This electronic device 1 includes a metal lead frame 2, a semiconductor element 3 mounted on the lead frame 2, a wire 5 that electrically connects the semiconductor element 3 and the lead frame 2, and a seal for sealing the semiconductor element 3. and a sealing part 4 for sealing.
  • the lead frame 2 includes a die pad 6, inner leads 21, and outer leads 22.
  • the lead frame 2 is made of copper or an iron alloy such as 42 alloy, for example.
  • the lead frame 2 preferably includes a main body 23 made of copper or an iron alloy such as 42 alloy, and a plating layer 24 covering the main body 23. In this case, corrosion of the lead frame 2 is suppressed.
  • the plating layer 24 contains at least one of silver, nickel, and palladium.
  • the plating layer 24 may contain only one metal among silver, nickel, and palladium, or may contain an alloy containing at least one metal among silver, nickel, and palladium.
  • the plating layer 24 may have a laminated structure, and specifically may have a laminated structure consisting of, for example, a palladium layer, a nickel layer, and a gold layer.
  • the thickness of the plating layer 24 is, for example, within a range of 1 to 20 ⁇ m, but is not particularly limited thereto.
  • the semiconductor element 3 is fixed onto the die pad 6 of the lead frame 2 with an appropriate die bonding material 7. As a result, the semiconductor element 3 is mounted on the lead frame 2.
  • the semiconductor element 3 is, for example, an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, a diode, or a solid-state image sensor.
  • the semiconductor element 50 may be a new power device such as SiC or GaN.
  • the wire 5 may be made of gold, but may also contain at least one of copper and silver.
  • the wire 5 may be made of silver or copper.
  • the wire 5 may be coated with a thin film of metal such as palladium.
  • the sealing portion 4 that seals the semiconductor element 3 is formed by molding the sealing epoxy resin composition.
  • the sealing part 4 also seals the wire 5.
  • the sealing part 4 also seals the die pad 6 and the inner leads 21, so the sealing part 4 is in contact with the lead frame 2, and if the lead frame 2 is provided with a plating layer 24, it is in contact with the plating layer 24. There is.
  • the sealing part 4 is produced by molding the sealing epoxy resin composition by a pressure molding method.
  • the pressure molding method is, for example, an injection molding method, a transfer molding method, or a compression molding method.
  • Conditions for molding the epoxy resin composition for sealing by a pressure molding method are appropriately set according to the composition of the epoxy resin composition for sealing.
  • the molding pressure is, for example, 3.0 MPa or more
  • the molding temperature is 120° C. or more.
  • the injection pressure of the epoxy resin composition for sealing into the mold is, for example, 3 MPa or more, and preferably 4 MPa or more and 710 MPa or less.
  • the heating temperature (mold temperature) is preferably 120°C or higher, and more preferably 160°C or higher and 190°C or lower.
  • the heating time is, for example, 30 seconds or more and 300 seconds or less, and more preferably 60 seconds or more and 180 seconds or less.
  • post-curing is performed by heating the sealing part 4 while the mold is closed, and then the mold is opened and an electron beam is applied.
  • the device 1 is removed.
  • the heating conditions for post-curing are, for example, a heating time of 160° C. or more and 190° C. or less, and a heating time of 2 hours or more and 8 hours or less.
  • the electronic device 1 including the sealing part 4 made from the sealing epoxy resin composition is obtained.
  • the method for manufacturing the electronic device 1 is not limited to the above method, and the electronic device 1 may be filled with the epoxy resin composition for sealing described above to seal electronic components such as the semiconductor element 3. It's fine if you can.
  • the epoxy resin composition for sealing of the first embodiment contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D).
  • the curing accelerator (C) contains amidine silicate (C1) represented by the following formula (1).
  • R 1 and R 2 are each independently hydrogen or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and R 3 and R 4 are each independently a phenylene group or naphthylene.
  • R 5 is at least one group selected from the group consisting of a phenyl group and a group represented by the following formula (2).
  • n 3 or more and 8 or less
  • an epoxy resin composition for sealing that has high storage stability and can increase the curing speed during curing.
  • the R 1 and the R 2 are each independently a hydrocarbon group having 1 or 2 carbon atoms.
  • the R 5 is a phenyl group or C 3 H 6 SH.
  • the storage stability of the epoxy resin composition for sealing can be further improved, and higher curability during curing can be achieved.
  • the amidine silicate (C1) is a compound represented by the following formula (11) or a compound represented by the formula (12). , and at least one selected from the group consisting of compounds represented by formula (13).
  • the storage stability of the epoxy resin composition for sealing can be further improved, and higher curability during curing can be achieved.
  • the epoxy resin composition for sealing in any one of the first to third aspects, is cured based on a total of 100 parts by mass of the epoxy resin (A) and the curing agent (B).
  • the proportion of the accelerator (C) is 1 part by mass or more and 35 parts by mass or less.
  • the epoxy resin composition for sealing according to the fifth aspect is the epoxy resin composition according to any one of the first to fourth aspects, comprising the epoxy resin (A), the curing agent (B), and the curing accelerator (C).
  • the ratio of the inorganic filler (D) to the total amount of the inorganic filler (D) and the inorganic filler (D) is 60% by mass or more and 93% by mass or less.
  • the average particle size of the inorganic filler (D) is 0.5 ⁇ m or more and 15 ⁇ m or less.
  • the fluidity of the epoxy resin composition for sealing is not likely to be impaired and it is easy to maintain it in good condition.
  • the inorganic filler (D) includes inorganic particles having a particle size of 0.1 ⁇ m or less.
  • the ratio of the inorganic particles to 100 parts by mass of the inorganic filler (D) is 0.1 parts by mass or more and 30 parts by mass or less.
  • the fluidity of the epoxy resin composition for sealing during melting can be maintained better.
  • the epoxy resin composition for sealing of the eighth aspect is solid at 25° C. in any one of the first to seventh aspects.
  • the epoxy resin composition for sealing can be prepared at room temperature (approximately 25° C.) and has excellent storage stability, so the composition is unlikely to change in the prepared state and is easy to handle. .
  • the epoxy resin composition for sealing according to the ninth aspect is the epoxy resin composition for sealing according to any one of the first to eighth aspects, in which 1.67 ml of the epoxy resin composition for sealing is measured at a temperature of 170°C.
  • the time required for the torque value to reach 0.98N is 30 seconds or more and 100 seconds or less.
  • the torque value of 1.67 ml of the epoxy resin composition for sealing is measured at a temperature of 170°C.
  • T 300s is the torque value after 300 seconds from the start of measurement
  • T n is the torque value at an arbitrary time after the start of measurement.
  • the time for which the curing rate is 90% or more is 200 seconds or less.
  • the epoxy resin composition for sealing can further increase the curing speed and have high curability.
  • the epoxy resin composition for sealing according to the eleventh aspect in any one of the first to tenth aspects, has a mold temperature of 170° C. and an injection pressure of 686.5 N/m in a spiral flow test method according to ASTM D3123.
  • the flow distance under the conditions of cm 2 and molding time of 180 seconds is 50 cm or more.
  • the electronic device (1) of the twelfth aspect includes a semiconductor element and a sealing part that seals the semiconductor element.
  • the sealing portion is made of a cured product of any one of the first to eleventh sealing epoxy resin compositions.
  • Silica 1 Denki Kagaku Kogyo Co., Ltd.
  • Product name: FB300MDC spherical silica. Average particle size: 5.0 ⁇ m, content of particles with a particle size of 0.1 ⁇ m or less: 1.8%).
  • Silica 2 Denki Kagaku Kogyo Co., Ltd.
  • product name: SFP10MK spherical silica. Average particle size: 0.8 ⁇ m, content of particles with a particle size of 0.1 ⁇ m or less: 7.8%).
  • Silica 3 manufactured by Tokuyama Co., Ltd.
  • Product name: SS01 spherical silica.
  • Fine filling rate ratio of fine particles of 0.1 ⁇ m or less in the inorganic filler
  • the average particle diameter was calculated by measuring the volume-based particle size distribution of the inorganic filler mixture using a laser diffraction/scattering particle size distribution analyzer. In addition, the percentage of the filling rate of particles of 0.1 ⁇ m or less was calculated from the particle size distribution, and this was defined as the "fine filling rate.” The results are shown in Table 1. In Table 1, "average particle diameter D50 of the entire inorganic filler (D)" is the average particle diameter (median diameter D50) of the inorganic filler mixture.
  • the resin composition was melt-kneaded at a temperature of 170° C., and a sheet was produced from the resin composition after melt-kneading. A piece having a thickness of 1 mm and a width of 150 cm was cut out from the obtained sheet, and its cross section was visually confirmed. Subsequently, the above-mentioned sheet was molded using a hand press machine using a tablet mold having a diameter of 13 mm at a molding pressure of 50 MPa to produce a tablet-shaped test piece (thickness 20 mm, diameter 13 mm).
  • a tablet-shaped test piece was cut, and its cross section was observed using a VHX-6000 device manufactured by Keyence Corporation, and the number of white dots with a diameter or longest side length of 100 ⁇ m or more on the cross section was counted.
  • Table 1 shows the number of white dots obtained.
  • "10 ⁇ " in Table 1 indicates that the number of white points is 10 or more. It can be judged that the smaller the number of the white dots, the higher the dispersibility during melting.
  • the curing rate was calculated from the torque curve based on the torque value obtained by measurement.
  • the curing rate can be calculated based on the following formula, where the torque value [kgf ⁇ cm] at an arbitrary time is expressed as T n and the torque value [kgf ⁇ cm] after 300 seconds is expressed as T 300s . Note that the torque value at 300 seconds was taken as 100%.
  • Curing rate (%) at any time T n /T 300s ⁇ 100
  • the time when the curing rate first reached 90% was defined as "90% curing time [sec]", and the results are shown in Table 1. If the 90% curing time is 200 seconds or less, it can be determined that the curing speed is high.

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JP2018203916A (ja) * 2017-06-07 2018-12-27 サンアプロ株式会社 エポキシ樹脂組成物
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