JPWO2023166827A5 - - Google Patents

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Publication number
JPWO2023166827A5
JPWO2023166827A5 JP2024504375A JP2024504375A JPWO2023166827A5 JP WO2023166827 A5 JPWO2023166827 A5 JP WO2023166827A5 JP 2024504375 A JP2024504375 A JP 2024504375A JP 2024504375 A JP2024504375 A JP 2024504375A JP WO2023166827 A5 JPWO2023166827 A5 JP WO2023166827A5
Authority
JP
Japan
Prior art keywords
interlayer insulating
insulating layer
conductive layer
semiconductor device
buried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024504375A
Other languages
English (en)
Japanese (ja)
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JPWO2023166827A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/047319 external-priority patent/WO2023166827A1/ja
Publication of JPWO2023166827A1 publication Critical patent/JPWO2023166827A1/ja
Publication of JPWO2023166827A5 publication Critical patent/JPWO2023166827A5/ja
Pending legal-status Critical Current

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JP2024504375A 2022-03-04 2022-12-22 Pending JPWO2023166827A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022033875 2022-03-04
PCT/JP2022/047319 WO2023166827A1 (ja) 2022-03-04 2022-12-22 半導体装置および半導体モジュール

Publications (2)

Publication Number Publication Date
JPWO2023166827A1 JPWO2023166827A1 (https=) 2023-09-07
JPWO2023166827A5 true JPWO2023166827A5 (https=) 2024-11-11

Family

ID=87883674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024504375A Pending JPWO2023166827A1 (https=) 2022-03-04 2022-12-22

Country Status (4)

Country Link
US (1) US20240421049A1 (https=)
JP (1) JPWO2023166827A1 (https=)
CN (1) CN118511281A (https=)
WO (1) WO2023166827A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12464761B2 (en) * 2022-11-30 2025-11-04 Texas Instruments Incorporated LOCOS fillet for drain reduced breakdown in high voltage transistors
JP2024136863A (ja) * 2023-03-24 2024-10-04 株式会社東芝 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227238A (ja) * 2007-03-14 2008-09-25 Toyota Central R&D Labs Inc 半導体装置
US9129819B2 (en) * 2011-08-05 2015-09-08 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
JP5686203B2 (ja) * 2012-03-22 2015-03-18 トヨタ自動車株式会社 半導体装置
JP2013179327A (ja) * 2013-04-23 2013-09-09 Mitsubishi Electric Corp 半導体装置
JP6287958B2 (ja) * 2015-05-27 2018-03-07 トヨタ自動車株式会社 半導体装置

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