JPWO2023153355A5 - - Google Patents

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JPWO2023153355A5
JPWO2023153355A5 JP2023580232A JP2023580232A JPWO2023153355A5 JP WO2023153355 A5 JPWO2023153355 A5 JP WO2023153355A5 JP 2023580232 A JP2023580232 A JP 2023580232A JP 2023580232 A JP2023580232 A JP 2023580232A JP WO2023153355 A5 JPWO2023153355 A5 JP WO2023153355A5
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JP
Japan
Prior art keywords
silica powder
spherical silica
particle size
content
cumulative value
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JP2023580232A
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English (en)
Japanese (ja)
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JPWO2023153355A1 (https=
JP7787916B2 (ja
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Priority claimed from PCT/JP2023/003765 external-priority patent/WO2023153355A1/ja
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Publication of JPWO2023153355A5 publication Critical patent/JPWO2023153355A5/ja
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JP2023580232A 2022-02-09 2023-02-06 球状シリカ粉末 Active JP7787916B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022018506 2022-02-09
JP2022018506 2022-02-09
PCT/JP2023/003765 WO2023153355A1 (ja) 2022-02-09 2023-02-06 球状シリカ粉末

Publications (3)

Publication Number Publication Date
JPWO2023153355A1 JPWO2023153355A1 (https=) 2023-08-17
JPWO2023153355A5 true JPWO2023153355A5 (https=) 2024-09-20
JP7787916B2 JP7787916B2 (ja) 2025-12-17

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ID=87564420

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JP2023580232A Active JP7787916B2 (ja) 2022-02-09 2023-02-06 球状シリカ粉末

Country Status (6)

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US (1) US20250033982A1 (https=)
EP (1) EP4464661A1 (https=)
JP (1) JP7787916B2 (https=)
KR (1) KR20240144977A (https=)
CN (1) CN118742513A (https=)
WO (1) WO2023153355A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3886262B2 (ja) 1998-09-10 2007-02-28 電気化学工業株式会社 球状シリカ粒子及びその製造方法
JP4030668B2 (ja) 1998-12-25 2008-01-09 株式会社トクヤマ 溶融球状シリカの製造方法
JP4605864B2 (ja) * 2000-07-25 2011-01-05 宇部日東化成株式会社 真球状シリカ粒子集合体の製造方法
JP4707186B2 (ja) 2005-10-03 2011-06-22 株式会社四国総合研究所 シリカ粉体の製法およびそれによって得られたシリカ粉体
JP6598719B2 (ja) 2016-03-30 2019-10-30 日揮触媒化成株式会社 シリカ系複合粒子分散液の製造方法
JP7020865B2 (ja) 2017-10-30 2022-02-16 日揮触媒化成株式会社 セリア系複合微粒子分散液、その製造方法及びセリア系複合微粒子分散液を含む研磨用砥粒分散液
JP7275100B2 (ja) 2018-03-01 2023-05-17 株式会社トクヤマ 溶融球状シリカ粉末およびその製造方法
JP7628401B2 (ja) 2020-07-15 2025-02-10 浜松ホトニクス株式会社 半導体部材の製造方法

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