JPWO2023145365A5 - - Google Patents
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- Publication number
- JPWO2023145365A5 JPWO2023145365A5 JP2023576723A JP2023576723A JPWO2023145365A5 JP WO2023145365 A5 JPWO2023145365 A5 JP WO2023145365A5 JP 2023576723 A JP2023576723 A JP 2023576723A JP 2023576723 A JP2023576723 A JP 2023576723A JP WO2023145365 A5 JPWO2023145365 A5 JP WO2023145365A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- main surface
- wiring portion
- electronic component
- forming step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 239000003990 capacitor Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022012344 | 2022-01-28 | ||
| PCT/JP2022/047990 WO2023145365A1 (ja) | 2022-01-28 | 2022-12-26 | 電子部品および電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023145365A1 JPWO2023145365A1 (https=) | 2023-08-03 |
| JPWO2023145365A5 true JPWO2023145365A5 (https=) | 2024-10-08 |
Family
ID=87471160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023576723A Pending JPWO2023145365A1 (https=) | 2022-01-28 | 2022-12-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240379290A1 (https=) |
| JP (1) | JPWO2023145365A1 (https=) |
| CN (1) | CN118591851A (https=) |
| DE (1) | DE112022006189T5 (https=) |
| WO (1) | WO2023145365A1 (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5672678B2 (ja) * | 2009-08-21 | 2015-02-18 | Tdk株式会社 | 電子部品及びその製造方法 |
| JP7323343B2 (ja) * | 2019-06-17 | 2023-08-08 | ローム株式会社 | チップ部品 |
-
2022
- 2022-12-26 DE DE112022006189.8T patent/DE112022006189T5/de active Pending
- 2022-12-26 WO PCT/JP2022/047990 patent/WO2023145365A1/ja not_active Ceased
- 2022-12-26 CN CN202280089958.5A patent/CN118591851A/zh active Pending
- 2022-12-26 JP JP2023576723A patent/JPWO2023145365A1/ja active Pending
-
2024
- 2024-07-23 US US18/781,390 patent/US20240379290A1/en active Pending
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