JPWO2023132246A5 - - Google Patents

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Publication number
JPWO2023132246A5
JPWO2023132246A5 JP2023572420A JP2023572420A JPWO2023132246A5 JP WO2023132246 A5 JPWO2023132246 A5 JP WO2023132246A5 JP 2023572420 A JP2023572420 A JP 2023572420A JP 2023572420 A JP2023572420 A JP 2023572420A JP WO2023132246 A5 JPWO2023132246 A5 JP WO2023132246A5
Authority
JP
Japan
Prior art keywords
resist pattern
copper foil
wall surface
hole
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023572420A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023132246A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/047157 external-priority patent/WO2023132246A1/ja
Publication of JPWO2023132246A1 publication Critical patent/JPWO2023132246A1/ja
Publication of JPWO2023132246A5 publication Critical patent/JPWO2023132246A5/ja
Pending legal-status Critical Current

Links

JP2023572420A 2022-01-04 2022-12-21 Pending JPWO2023132246A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022000261 2022-01-04
PCT/JP2022/047157 WO2023132246A1 (ja) 2022-01-04 2022-12-21 プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2023132246A1 JPWO2023132246A1 (https=) 2023-07-13
JPWO2023132246A5 true JPWO2023132246A5 (https=) 2024-09-17

Family

ID=87073533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023572420A Pending JPWO2023132246A1 (https=) 2022-01-04 2022-12-21

Country Status (5)

Country Link
US (1) US20250063661A1 (https=)
EP (1) EP4462965A4 (https=)
JP (1) JPWO2023132246A1 (https=)
CN (1) CN118511660A (https=)
WO (1) WO2023132246A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY144503A (en) * 1998-09-14 2011-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP2002026515A (ja) * 2000-07-07 2002-01-25 Toshiba Corp プリント配線板およびその製造方法
JP2003304067A (ja) * 2002-04-11 2003-10-24 Cmk Corp 多層プリント配線板とその製造方法
JP2004087550A (ja) 2002-08-23 2004-03-18 Toppan Printing Co Ltd プリント配線板
JP2007266606A (ja) * 2006-03-28 2007-10-11 Endicott Interconnect Technologies Inc 回路基板用のフルオロポリマー絶縁性組成物およびこれから成る回路基板
JP6350062B2 (ja) * 2013-10-09 2018-07-04 日立化成株式会社 多層配線基板の製造方法
JP6601814B2 (ja) * 2014-05-21 2019-11-06 住友電工プリントサーキット株式会社 プリント配線板及びプリント配線板の製造方法
JP7114893B2 (ja) 2017-12-14 2022-08-09 株式会社三洋物産 遊技機
WO2020145133A1 (ja) * 2019-01-11 2020-07-16 ダイキン工業株式会社 フッ素樹脂組成物、フッ素樹脂シート、積層体及び回路用基板

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