JPWO2023132231A5 - - Google Patents

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Publication number
JPWO2023132231A5
JPWO2023132231A5 JP2023572410A JP2023572410A JPWO2023132231A5 JP WO2023132231 A5 JPWO2023132231 A5 JP WO2023132231A5 JP 2023572410 A JP2023572410 A JP 2023572410A JP 2023572410 A JP2023572410 A JP 2023572410A JP WO2023132231 A5 JPWO2023132231 A5 JP WO2023132231A5
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JP
Japan
Prior art keywords
insulating film
organic insulating
opening
bump
width
Prior art date
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Application number
JP2023572410A
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English (en)
Japanese (ja)
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JP7835231B2 (ja
JPWO2023132231A1 (https=
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Priority claimed from PCT/JP2022/046893 external-priority patent/WO2023132231A1/ja
Publication of JPWO2023132231A1 publication Critical patent/JPWO2023132231A1/ja
Publication of JPWO2023132231A5 publication Critical patent/JPWO2023132231A5/ja
Application granted granted Critical
Publication of JP7835231B2 publication Critical patent/JP7835231B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023572410A 2022-01-07 2022-12-20 半導体装置 Active JP7835231B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022001851 2022-01-07
JP2022001851 2022-01-07
PCT/JP2022/046893 WO2023132231A1 (ja) 2022-01-07 2022-12-20 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023132231A1 JPWO2023132231A1 (https=) 2023-07-13
JPWO2023132231A5 true JPWO2023132231A5 (https=) 2024-07-24
JP7835231B2 JP7835231B2 (ja) 2026-03-25

Family

ID=87073603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023572410A Active JP7835231B2 (ja) 2022-01-07 2022-12-20 半導体装置

Country Status (4)

Country Link
US (1) US20240347494A1 (https=)
JP (1) JP7835231B2 (https=)
TW (1) TWI878768B (https=)
WO (1) WO2023132231A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261111A (ja) * 2001-03-06 2002-09-13 Texas Instr Japan Ltd 半導体装置及びバンプ形成方法
JP2003037129A (ja) * 2001-07-25 2003-02-07 Rohm Co Ltd 半導体装置およびその製造方法
JP2005268374A (ja) * 2004-03-17 2005-09-29 Sony Corp 半導体素子とその製造方法、及び半導体装置
JP4574393B2 (ja) * 2005-02-24 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2009064812A (ja) * 2007-09-04 2009-03-26 Panasonic Corp 半導体装置の電極構造およびその関連技術
JP6780933B2 (ja) * 2015-12-18 2020-11-04 新光電気工業株式会社 端子構造、端子構造の製造方法、及び配線基板
JP2019057616A (ja) * 2017-09-21 2019-04-11 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2019075536A (ja) * 2017-10-11 2019-05-16 株式会社村田製作所 パワーアンプモジュール
JP2020048184A (ja) * 2018-09-14 2020-03-26 株式会社村田製作所 高周波電力増幅器及び電力増幅モジュール
TWI754997B (zh) * 2019-07-31 2022-02-11 日商村田製作所股份有限公司 半導體裝置及高頻模組
JP2021197474A (ja) * 2020-06-16 2021-12-27 株式会社村田製作所 半導体装置
JP2021197473A (ja) * 2020-06-16 2021-12-27 株式会社村田製作所 半導体装置

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