JPWO2023127525A5 - - Google Patents

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Publication number
JPWO2023127525A5
JPWO2023127525A5 JP2023570840A JP2023570840A JPWO2023127525A5 JP WO2023127525 A5 JPWO2023127525 A5 JP WO2023127525A5 JP 2023570840 A JP2023570840 A JP 2023570840A JP 2023570840 A JP2023570840 A JP 2023570840A JP WO2023127525 A5 JPWO2023127525 A5 JP WO2023127525A5
Authority
JP
Japan
Prior art keywords
ceramic substrate
bonding material
cooler
cooling
metallization layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023570840A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023127525A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/046219 external-priority patent/WO2023127525A1/ja
Publication of JPWO2023127525A1 publication Critical patent/JPWO2023127525A1/ja
Publication of JPWO2023127525A5 publication Critical patent/JPWO2023127525A5/ja
Pending legal-status Critical Current

Links

JP2023570840A 2021-12-28 2022-12-15 Pending JPWO2023127525A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021214784 2021-12-28
PCT/JP2022/046219 WO2023127525A1 (ja) 2021-12-28 2022-12-15 冷却器および電力変換装置

Publications (2)

Publication Number Publication Date
JPWO2023127525A1 JPWO2023127525A1 (https=) 2023-07-06
JPWO2023127525A5 true JPWO2023127525A5 (https=) 2024-08-21

Family

ID=86998770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570840A Pending JPWO2023127525A1 (https=) 2021-12-28 2022-12-15

Country Status (2)

Country Link
JP (1) JPWO2023127525A1 (https=)
WO (1) WO2023127525A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034289A1 (ja) * 2024-08-09 2026-02-12 ローム株式会社 半導体装置、半導体モジュールおよび車両

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6190250U (https=) * 1984-11-16 1986-06-12
JP3250187B2 (ja) * 1994-07-15 2002-01-28 三菱マテリアル株式会社 高放熱性セラミックパッケージ
US20030094273A1 (en) * 2001-11-21 2003-05-22 Toth Jerome E. Corrugated fin assembly
JP2003198171A (ja) * 2001-12-28 2003-07-11 Furukawa Electric Co Ltd:The ヒートシンクおよび放熱器
JP4052205B2 (ja) * 2003-08-22 2008-02-27 株式会社デンソー 電力変換装置
JP4729336B2 (ja) * 2005-04-27 2011-07-20 株式会社豊田自動織機 パワーモジュール用基板
JP2007173301A (ja) * 2005-12-19 2007-07-05 Sumitomo Electric Ind Ltd 半導体素子冷却用放熱器、半導体装置、半導体素子冷却用放熱器の製造方法
JP2008244394A (ja) * 2007-03-29 2008-10-09 Sumitomo Electric Ind Ltd 半導体装置
JP4996332B2 (ja) * 2007-05-17 2012-08-08 日立電線メクテック株式会社 ヒートシンク及びその製造方法
JP6546521B2 (ja) * 2015-12-11 2019-07-17 昭和電工株式会社 液冷式冷却装置
JP6708113B2 (ja) * 2016-12-19 2020-06-10 株式会社デンソー 積層型冷却器
JP7139656B2 (ja) * 2018-03-30 2022-09-21 日本電産株式会社 冷却装置

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