JPWO2023127525A1 - - Google Patents
Info
- Publication number
- JPWO2023127525A1 JPWO2023127525A1 JP2023570840A JP2023570840A JPWO2023127525A1 JP WO2023127525 A1 JPWO2023127525 A1 JP WO2023127525A1 JP 2023570840 A JP2023570840 A JP 2023570840A JP 2023570840 A JP2023570840 A JP 2023570840A JP WO2023127525 A1 JPWO2023127525 A1 JP WO2023127525A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021214784 | 2021-12-28 | ||
| PCT/JP2022/046219 WO2023127525A1 (ja) | 2021-12-28 | 2022-12-15 | 冷却器および電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023127525A1 true JPWO2023127525A1 (https=) | 2023-07-06 |
| JPWO2023127525A5 JPWO2023127525A5 (https=) | 2024-08-21 |
Family
ID=86998770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023570840A Pending JPWO2023127525A1 (https=) | 2021-12-28 | 2022-12-15 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023127525A1 (https=) |
| WO (1) | WO2023127525A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026034289A1 (ja) * | 2024-08-09 | 2026-02-12 | ローム株式会社 | 半導体装置、半導体モジュールおよび車両 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0883867A (ja) * | 1994-07-15 | 1996-03-26 | Mitsubishi Materials Corp | 高放熱性セラミックパッケージ |
| US20030094273A1 (en) * | 2001-11-21 | 2003-05-22 | Toth Jerome E. | Corrugated fin assembly |
| JP2005073373A (ja) * | 2003-08-22 | 2005-03-17 | Denso Corp | 電力変換装置 |
| JP2007173301A (ja) * | 2005-12-19 | 2007-07-05 | Sumitomo Electric Ind Ltd | 半導体素子冷却用放熱器、半導体装置、半導体素子冷却用放熱器の製造方法 |
| JP2008288369A (ja) * | 2007-05-17 | 2008-11-27 | Hitachi Densen Mekutekku Kk | ヒートシンク及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190250U (https=) * | 1984-11-16 | 1986-06-12 | ||
| JP2003198171A (ja) * | 2001-12-28 | 2003-07-11 | Furukawa Electric Co Ltd:The | ヒートシンクおよび放熱器 |
| JP4729336B2 (ja) * | 2005-04-27 | 2011-07-20 | 株式会社豊田自動織機 | パワーモジュール用基板 |
| JP2008244394A (ja) * | 2007-03-29 | 2008-10-09 | Sumitomo Electric Ind Ltd | 半導体装置 |
| JP6546521B2 (ja) * | 2015-12-11 | 2019-07-17 | 昭和電工株式会社 | 液冷式冷却装置 |
| JP6708113B2 (ja) * | 2016-12-19 | 2020-06-10 | 株式会社デンソー | 積層型冷却器 |
| JP7139656B2 (ja) * | 2018-03-30 | 2022-09-21 | 日本電産株式会社 | 冷却装置 |
-
2022
- 2022-12-15 WO PCT/JP2022/046219 patent/WO2023127525A1/ja not_active Ceased
- 2022-12-15 JP JP2023570840A patent/JPWO2023127525A1/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0883867A (ja) * | 1994-07-15 | 1996-03-26 | Mitsubishi Materials Corp | 高放熱性セラミックパッケージ |
| US20030094273A1 (en) * | 2001-11-21 | 2003-05-22 | Toth Jerome E. | Corrugated fin assembly |
| JP2005073373A (ja) * | 2003-08-22 | 2005-03-17 | Denso Corp | 電力変換装置 |
| JP2007173301A (ja) * | 2005-12-19 | 2007-07-05 | Sumitomo Electric Ind Ltd | 半導体素子冷却用放熱器、半導体装置、半導体素子冷却用放熱器の製造方法 |
| JP2008288369A (ja) * | 2007-05-17 | 2008-11-27 | Hitachi Densen Mekutekku Kk | ヒートシンク及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023127525A1 (ja) | 2023-07-06 |
Similar Documents
Legal Events
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