JPWO2023095797A5 - - Google Patents
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- Publication number
- JPWO2023095797A5 JPWO2023095797A5 JP2023563703A JP2023563703A JPWO2023095797A5 JP WO2023095797 A5 JPWO2023095797 A5 JP WO2023095797A5 JP 2023563703 A JP2023563703 A JP 2023563703A JP 2023563703 A JP2023563703 A JP 2023563703A JP WO2023095797 A5 JPWO2023095797 A5 JP WO2023095797A5
- Authority
- JP
- Japan
- Prior art keywords
- holes
- ground pattern
- pattern
- main surface
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021190210 | 2021-11-24 | ||
| PCT/JP2022/043213 WO2023095797A1 (ja) | 2021-11-24 | 2022-11-22 | プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023095797A1 JPWO2023095797A1 (https=) | 2023-06-01 |
| JPWO2023095797A5 true JPWO2023095797A5 (https=) | 2024-08-14 |
Family
ID=86539491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023563703A Pending JPWO2023095797A1 (https=) | 2021-11-24 | 2022-11-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250016909A1 (https=) |
| JP (1) | JPWO2023095797A1 (https=) |
| CN (1) | CN118303138A (https=) |
| DE (1) | DE112022005583T5 (https=) |
| WO (1) | WO2023095797A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6133805A (en) * | 1996-10-31 | 2000-10-17 | The Whitaker Corporation | Isolation in multi-layer structures |
| JP2006024618A (ja) * | 2004-07-06 | 2006-01-26 | Toshiba Corp | 配線基板 |
| US11101533B2 (en) * | 2016-10-13 | 2021-08-24 | Win Semiconductors Corp. | Radio frequency device |
| JP2018200982A (ja) * | 2017-05-29 | 2018-12-20 | 東洋インキＳｃホールディングス株式会社 | フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器 |
| JP6732723B2 (ja) * | 2017-12-14 | 2020-07-29 | 日本メクトロン株式会社 | 高周波伝送用プリント配線板 |
| JP7597800B2 (ja) * | 2020-05-13 | 2024-12-10 | 住友電工プリントサーキット株式会社 | 高周波回路 |
| JP2021190210A (ja) | 2020-05-27 | 2021-12-13 | 矢崎総業株式会社 | 導体接続構造 |
-
2022
- 2022-11-22 DE DE112022005583.9T patent/DE112022005583T5/de active Pending
- 2022-11-22 WO PCT/JP2022/043213 patent/WO2023095797A1/ja not_active Ceased
- 2022-11-22 CN CN202280077681.4A patent/CN118303138A/zh active Pending
- 2022-11-22 US US18/711,596 patent/US20250016909A1/en active Pending
- 2022-11-22 JP JP2023563703A patent/JPWO2023095797A1/ja active Pending
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