JPWO2023090252A1 - - Google Patents
Info
- Publication number
- JPWO2023090252A1 JPWO2023090252A1 JP2023561562A JP2023561562A JPWO2023090252A1 JP WO2023090252 A1 JPWO2023090252 A1 JP WO2023090252A1 JP 2023561562 A JP2023561562 A JP 2023561562A JP 2023561562 A JP2023561562 A JP 2023561562A JP WO2023090252 A1 JPWO2023090252 A1 JP WO2023090252A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32146—Amplitude modulation, includes pulsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/327—Arrangements for generating the plasma
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021188307 | 2021-11-19 | ||
| JP2021188307 | 2021-11-19 | ||
| PCT/JP2022/041958 WO2023090252A1 (ja) | 2021-11-19 | 2022-11-10 | プラズマ処理装置、制御方法、電源システム、プログラム、及び記憶媒体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023090252A1 true JPWO2023090252A1 (https=) | 2023-05-25 |
| JPWO2023090252A5 JPWO2023090252A5 (https=) | 2024-12-11 |
| JP7646868B2 JP7646868B2 (ja) | 2025-03-17 |
Family
ID=86396974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023561562A Active JP7646868B2 (ja) | 2021-11-19 | 2022-11-10 | プラズマ処理装置、制御方法、電源システム、プログラム、及び記憶媒体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240304418A1 (https=) |
| JP (1) | JP7646868B2 (https=) |
| KR (1) | KR20240101830A (https=) |
| CN (1) | CN118303135A (https=) |
| TW (1) | TW202336803A (https=) |
| WO (1) | WO2023090252A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102786710B1 (ko) * | 2021-01-29 | 2025-03-25 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 소스 고주파 전력의 소스 주파수를 제어하는 방법 |
| US20250087462A1 (en) * | 2023-09-08 | 2025-03-13 | Applied Materials, Inc. | Radio-frequency (rf) matching network and tuning technique |
| WO2025211081A1 (ja) * | 2024-04-03 | 2025-10-09 | 東京エレクトロン株式会社 | プラズマ処理装置、電源システム、及び制御方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH114406A (ja) * | 1997-06-13 | 1999-01-06 | Canon Inc | 画像処理装置、画像メモリの読み出し方法及びコンピュータ読み取り可能な記録媒体 |
| JP2005020414A (ja) * | 2003-06-26 | 2005-01-20 | Matsushita Electric Ind Co Ltd | クロック信号発生回路、受信装置、および受信方法 |
| JP2012503431A (ja) * | 2008-09-19 | 2012-02-02 | アルテラ コーポレイション | 分数クロック信号を生成するための技術 |
| JP2015076287A (ja) * | 2013-10-09 | 2015-04-20 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2015185698A (ja) * | 2014-03-25 | 2015-10-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP2016027667A (ja) * | 2015-10-01 | 2016-02-18 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5319150B2 (ja) | 2008-03-31 | 2013-10-16 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法及びコンピュータ読み取り可能な記憶媒体 |
-
2022
- 2022-11-07 TW TW111142392A patent/TW202336803A/zh unknown
- 2022-11-10 CN CN202280074743.6A patent/CN118303135A/zh active Pending
- 2022-11-10 KR KR1020247018962A patent/KR20240101830A/ko active Pending
- 2022-11-10 JP JP2023561562A patent/JP7646868B2/ja active Active
- 2022-11-10 WO PCT/JP2022/041958 patent/WO2023090252A1/ja not_active Ceased
-
2024
- 2024-05-16 US US18/665,826 patent/US20240304418A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH114406A (ja) * | 1997-06-13 | 1999-01-06 | Canon Inc | 画像処理装置、画像メモリの読み出し方法及びコンピュータ読み取り可能な記録媒体 |
| JP2005020414A (ja) * | 2003-06-26 | 2005-01-20 | Matsushita Electric Ind Co Ltd | クロック信号発生回路、受信装置、および受信方法 |
| JP2012503431A (ja) * | 2008-09-19 | 2012-02-02 | アルテラ コーポレイション | 分数クロック信号を生成するための技術 |
| JP2015076287A (ja) * | 2013-10-09 | 2015-04-20 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2015185698A (ja) * | 2014-03-25 | 2015-10-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP2016027667A (ja) * | 2015-10-01 | 2016-02-18 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240101830A (ko) | 2024-07-02 |
| US20240304418A1 (en) | 2024-09-12 |
| TW202336803A (zh) | 2023-09-16 |
| CN118303135A (zh) | 2024-07-05 |
| WO2023090252A1 (ja) | 2023-05-25 |
| JP7646868B2 (ja) | 2025-03-17 |
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