JPWO2023054389A5 - - Google Patents
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- Publication number
- JPWO2023054389A5 JPWO2023054389A5 JP2023551549A JP2023551549A JPWO2023054389A5 JP WO2023054389 A5 JPWO2023054389 A5 JP WO2023054389A5 JP 2023551549 A JP2023551549 A JP 2023551549A JP 2023551549 A JP2023551549 A JP 2023551549A JP WO2023054389 A5 JPWO2023054389 A5 JP WO2023054389A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring
- semiconductor device
- semiconductor element
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021162803 | 2021-10-01 | ||
| PCT/JP2022/036006 WO2023054389A1 (ja) | 2021-10-01 | 2022-09-27 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054389A1 JPWO2023054389A1 (https=) | 2023-04-06 |
| JPWO2023054389A5 true JPWO2023054389A5 (https=) | 2024-06-21 |
Family
ID=85782765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551549A Pending JPWO2023054389A1 (https=) | 2021-10-01 | 2022-09-27 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240234233A1 (https=) |
| JP (1) | JPWO2023054389A1 (https=) |
| CN (1) | CN118160086A (https=) |
| DE (1) | DE112022004729T5 (https=) |
| WO (1) | WO2023054389A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3608542B2 (ja) * | 2001-10-22 | 2005-01-12 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP7179526B2 (ja) * | 2018-08-10 | 2022-11-29 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2021086848A (ja) * | 2019-11-25 | 2021-06-03 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-09-27 JP JP2023551549A patent/JPWO2023054389A1/ja active Pending
- 2022-09-27 DE DE112022004729.1T patent/DE112022004729T5/de active Pending
- 2022-09-27 CN CN202280065664.9A patent/CN118160086A/zh active Pending
- 2022-09-27 WO PCT/JP2022/036006 patent/WO2023054389A1/ja not_active Ceased
-
2024
- 2024-03-26 US US18/616,773 patent/US20240234233A1/en active Pending
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