JPWO2023048105A1 - - Google Patents
Info
- Publication number
- JPWO2023048105A1 JPWO2023048105A1 JP2023549535A JP2023549535A JPWO2023048105A1 JP WO2023048105 A1 JPWO2023048105 A1 JP WO2023048105A1 JP 2023549535 A JP2023549535 A JP 2023549535A JP 2023549535 A JP2023549535 A JP 2023549535A JP WO2023048105 A1 JPWO2023048105 A1 JP WO2023048105A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021153289 | 2021-09-21 | ||
| PCT/JP2022/034857 WO2023048105A1 (ja) | 2021-09-21 | 2022-09-16 | トランスチップ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023048105A1 true JPWO2023048105A1 (https=) | 2023-03-30 |
| JPWO2023048105A5 JPWO2023048105A5 (https=) | 2024-06-11 |
Family
ID=85719478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023549535A Pending JPWO2023048105A1 (https=) | 2021-09-21 | 2022-09-16 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240222353A1 (https=) |
| JP (1) | JPWO2023048105A1 (https=) |
| CN (1) | CN117957622A (https=) |
| DE (1) | DE112022004527T5 (https=) |
| WO (1) | WO2023048105A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12224103B2 (en) * | 2021-06-15 | 2025-02-11 | Intel Corporation | Angled inductor with small form factor |
| US20240038439A1 (en) * | 2022-07-28 | 2024-02-01 | Qualcomm Incorporated | Inductor packages employing wire bonds over a lead frame to form integrated inductor(s), and related integrated circuit (ic) packages and fabrication methods |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5284452A (en) * | 1975-12-31 | 1977-07-14 | Fujitsu Ltd | Method of manufacturing coil |
| JPH04354308A (ja) * | 1991-05-31 | 1992-12-08 | Sumitomo Electric Ind Ltd | トランス |
| KR100250225B1 (ko) * | 1996-11-19 | 2000-04-01 | 윤종용 | 집적회로용 인덕터 및 그 제조방법 |
| JP3527105B2 (ja) * | 1998-09-28 | 2004-05-17 | 富士通アクセス株式会社 | プリント基板 |
| FR2793943B1 (fr) * | 1999-05-18 | 2001-07-13 | Memscap | Micro-composants du type micro-inductance ou micro- transformateur, et procede de fabrication de tels micro- composants |
| JP2005347286A (ja) * | 2002-05-29 | 2005-12-15 | Ajinomoto Co Inc | コイル内蔵多層基板、半導体チップ、及びそれらの製造方法 |
| JP3800540B2 (ja) * | 2003-01-31 | 2006-07-26 | Ｔｄｋ株式会社 | インダクタンス素子の製造方法と積層電子部品と積層電子部品モジュ−ルとこれらの製造方法 |
| JP6841634B2 (ja) | 2016-11-08 | 2021-03-10 | ローム株式会社 | 電子部品 |
-
2022
- 2022-09-16 WO PCT/JP2022/034857 patent/WO2023048105A1/ja not_active Ceased
- 2022-09-16 CN CN202280062916.2A patent/CN117957622A/zh active Pending
- 2022-09-16 JP JP2023549535A patent/JPWO2023048105A1/ja active Pending
- 2022-09-16 DE DE112022004527.2T patent/DE112022004527T5/de active Pending
-
2024
- 2024-03-15 US US18/606,316 patent/US20240222353A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112022004527T5 (de) | 2024-09-12 |
| WO2023048105A1 (ja) | 2023-03-30 |
| US20240222353A1 (en) | 2024-07-04 |
| CN117957622A (zh) | 2024-04-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240227 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250909 |