JPWO2023026888A1 - - Google Patents

Info

Publication number
JPWO2023026888A1
JPWO2023026888A1 JP2023543818A JP2023543818A JPWO2023026888A1 JP WO2023026888 A1 JPWO2023026888 A1 JP WO2023026888A1 JP 2023543818 A JP2023543818 A JP 2023543818A JP 2023543818 A JP2023543818 A JP 2023543818A JP WO2023026888 A1 JPWO2023026888 A1 JP WO2023026888A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023543818A
Other versions
JPWO2023026888A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023026888A1 publication Critical patent/JPWO2023026888A1/ja
Publication of JPWO2023026888A5 publication Critical patent/JPWO2023026888A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Laminated Bodies (AREA)
JP2023543818A 2021-08-27 2022-08-15 Pending JPWO2023026888A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021139135 2021-08-27
PCT/JP2022/030873 WO2023026888A1 (ja) 2021-08-27 2022-08-15 複合基板および複合基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023026888A1 true JPWO2023026888A1 (ja) 2023-03-02
JPWO2023026888A5 JPWO2023026888A5 (ja) 2024-05-02

Family

ID=85321925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023543818A Pending JPWO2023026888A1 (ja) 2021-08-27 2022-08-15

Country Status (5)

Country Link
JP (1) JPWO2023026888A1 (ja)
CN (1) CN117859417A (ja)
DE (1) DE112022003096T5 (ja)
TW (1) TW202316692A (ja)
WO (1) WO2023026888A1 (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088442A (ja) * 2005-08-23 2007-04-05 Canon Inc 圧電体素子、それを用いた液体吐出ヘッド、および液体吐出装置
JP4755919B2 (ja) * 2006-02-23 2011-08-24 富士フイルム株式会社 ジルコンチタン酸鉛系組成物とその製造方法、圧電体、及び圧電素子
JP2011251866A (ja) * 2010-06-01 2011-12-15 Ngk Insulators Ltd 圧電／電歪セラミックス焼結体及び圧電／電歪素子
JP5525351B2 (ja) 2010-06-29 2014-06-18 太平洋セメント株式会社 圧電発音体
JP5861404B2 (ja) * 2011-11-18 2016-02-16 コニカミノルタ株式会社 圧電素子およびその製造方法
JP2013128006A (ja) * 2011-12-16 2013-06-27 Ngk Insulators Ltd 圧電／電歪体膜の製造方法
JP2014086400A (ja) 2012-10-26 2014-05-12 Mitsubishi Heavy Ind Ltd 高速原子ビーム源およびそれを用いた常温接合装置
JP2014187094A (ja) * 2013-03-22 2014-10-02 Hitachi Metals Ltd 圧電体薄膜積層基板、圧電体薄膜素子、およびそれらの製造方法
JP2015216195A (ja) * 2014-05-09 2015-12-03 セイコーエプソン株式会社 超音波プローブ
JP6130085B1 (ja) 2015-09-11 2017-05-17 住友精密工業株式会社 圧電素子および圧電素子の製造方法
JP6703321B2 (ja) * 2017-11-22 2020-06-03 株式会社村田製作所 圧電デバイス及び圧電デバイスの製造方法
KR20220110277A (ko) * 2020-01-10 2022-08-05 엔지케이 인슐레이터 엘티디 압전 진동 기판 및 압전 진동 소자

Also Published As

Publication number Publication date
DE112022003096T5 (de) 2024-04-18
CN117859417A (zh) 2024-04-09
WO2023026888A1 (ja) 2023-03-02
TW202316692A (zh) 2023-04-16

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240208

A621 Written request for application examination

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Effective date: 20240208