JPWO2021141081A1 - - Google Patents

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Publication number
JPWO2021141081A1
JPWO2021141081A1 JP2021520631A JP2021520631A JPWO2021141081A1 JP WO2021141081 A1 JPWO2021141081 A1 JP WO2021141081A1 JP 2021520631 A JP2021520631 A JP 2021520631A JP 2021520631 A JP2021520631 A JP 2021520631A JP WO2021141081 A1 JPWO2021141081 A1 JP WO2021141081A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021520631A
Other versions
JP7015411B2 (ja
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Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021141081A1 publication Critical patent/JPWO2021141081A1/ja
Priority to JP2021190871A priority Critical patent/JP7235840B2/ja
Application granted granted Critical
Publication of JP7015411B2 publication Critical patent/JP7015411B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
JP2021520631A 2020-01-10 2021-01-07 圧電振動基板および圧電振動素子 Active JP7015411B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021190871A JP7235840B2 (ja) 2020-01-10 2021-11-25 圧電振動基板および圧電振動素子

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020003003 2020-01-10
JP2020003003 2020-01-10
PCT/JP2021/000351 WO2021141081A1 (ja) 2020-01-10 2021-01-07 圧電振動基板および圧電振動素子

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021190871A Division JP7235840B2 (ja) 2020-01-10 2021-11-25 圧電振動基板および圧電振動素子

Publications (2)

Publication Number Publication Date
JPWO2021141081A1 true JPWO2021141081A1 (ja) 2021-07-15
JP7015411B2 JP7015411B2 (ja) 2022-02-02

Family

ID=76788056

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021520631A Active JP7015411B2 (ja) 2020-01-10 2021-01-07 圧電振動基板および圧電振動素子
JP2021190871A Active JP7235840B2 (ja) 2020-01-10 2021-11-25 圧電振動基板および圧電振動素子

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021190871A Active JP7235840B2 (ja) 2020-01-10 2021-11-25 圧電振動基板および圧電振動素子

Country Status (7)

Country Link
US (1) US20220329230A1 (ja)
JP (2) JP7015411B2 (ja)
KR (1) KR20220110277A (ja)
CN (1) CN114868266A (ja)
DE (1) DE112021000498T5 (ja)
TW (1) TWI826762B (ja)
WO (1) WO2021141081A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023026888A1 (ja) * 2021-08-27 2023-03-02 日本碍子株式会社 複合基板および複合基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2182560A2 (en) * 2008-10-31 2010-05-05 Murata Manufacturing Co., Ltd Method for manufacturing piezoelectric device
WO2019054238A1 (ja) * 2017-09-15 2019-03-21 日本碍子株式会社 弾性波素子およびその製造方法
WO2019220713A1 (ja) * 2018-05-17 2019-11-21 日本碍子株式会社 圧電性単結晶基板と支持基板との接合体
WO2019244461A1 (ja) * 2018-06-22 2019-12-26 日本碍子株式会社 接合体および弾性波素子

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650553B2 (ja) * 2011-02-04 2015-01-07 太陽誘電株式会社 弾性波デバイスの製造方法
JP2014086400A (ja) 2012-10-26 2014-05-12 Mitsubishi Heavy Ind Ltd 高速原子ビーム源およびそれを用いた常温接合装置
KR101454519B1 (ko) 2012-12-28 2014-10-23 넥스콘 테크놀러지 주식회사 배터리 충방전 시 정전압 출력 장치
JP2014147054A (ja) * 2013-01-30 2014-08-14 Sumitomo Electric Ind Ltd 圧電基板及び弾性表面波素子
JP6111849B2 (ja) 2013-05-17 2017-04-12 コニカミノルタ株式会社 圧電デバイスの製造方法
JP2017135935A (ja) * 2016-01-29 2017-08-03 セイコーエプソン株式会社 圧電アクチュエーター、圧電モーター、ロボット、ハンドおよび送液ポンプ
KR102287005B1 (ko) * 2018-06-22 2021-08-09 엔지케이 인슐레이터 엘티디 접합체 및 탄성파 소자

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2182560A2 (en) * 2008-10-31 2010-05-05 Murata Manufacturing Co., Ltd Method for manufacturing piezoelectric device
US20100112233A1 (en) * 2008-10-31 2010-05-06 Murata Manufacturing Co., Ltd. Method for manufacturing piezoelectric device
JP2010109950A (ja) * 2008-10-31 2010-05-13 Murata Mfg Co Ltd 圧電デバイスの製造方法
WO2019054238A1 (ja) * 2017-09-15 2019-03-21 日本碍子株式会社 弾性波素子およびその製造方法
WO2019220713A1 (ja) * 2018-05-17 2019-11-21 日本碍子株式会社 圧電性単結晶基板と支持基板との接合体
WO2019244461A1 (ja) * 2018-06-22 2019-12-26 日本碍子株式会社 接合体および弾性波素子
US20210111698A1 (en) * 2018-06-22 2021-04-15 Ngk Insulators, Ltd. Bonded body and elastic wave element

Also Published As

Publication number Publication date
WO2021141081A1 (ja) 2021-07-15
CN114868266A (zh) 2022-08-05
US20220329230A1 (en) 2022-10-13
TW202141820A (zh) 2021-11-01
DE112021000498T5 (de) 2022-11-24
KR20220110277A (ko) 2022-08-05
JP7235840B2 (ja) 2023-03-08
TWI826762B (zh) 2023-12-21
JP2022022276A (ja) 2022-02-03
JP7015411B2 (ja) 2022-02-02

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