JPWO2022270110A1 - - Google Patents
Info
- Publication number
- JPWO2022270110A1 JPWO2022270110A1 JP2023529614A JP2023529614A JPWO2022270110A1 JP WO2022270110 A1 JPWO2022270110 A1 JP WO2022270110A1 JP 2023529614 A JP2023529614 A JP 2023529614A JP 2023529614 A JP2023529614 A JP 2023529614A JP WO2022270110 A1 JPWO2022270110 A1 JP WO2022270110A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8067—Reflectors
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021105906 | 2021-06-25 | ||
| PCT/JP2022/015788 WO2022270110A1 (ja) | 2021-06-25 | 2022-03-30 | 撮像装置および電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022270110A1 true JPWO2022270110A1 (https=) | 2022-12-29 |
Family
ID=84545430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529614A Abandoned JPWO2022270110A1 (https=) | 2021-06-25 | 2022-03-30 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240304646A1 (https=) |
| EP (1) | EP4362099A4 (https=) |
| JP (1) | JPWO2022270110A1 (https=) |
| KR (1) | KR20240023514A (https=) |
| CN (1) | CN117296154A (https=) |
| WO (1) | WO2022270110A1 (https=) |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054365A (en) * | 1998-07-13 | 2000-04-25 | International Rectifier Corp. | Process for filling deep trenches with polysilicon and oxide |
| KR100764061B1 (ko) * | 2006-12-04 | 2007-10-08 | 삼성전자주식회사 | 이미지 센서 및 그 형성 방법 |
| JP6065448B2 (ja) * | 2012-08-03 | 2017-01-25 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
| TWI753351B (zh) * | 2013-11-29 | 2022-01-21 | 日商索尼半導體解決方案公司 | 攝像元件及電子機器 |
| KR102209097B1 (ko) * | 2014-02-27 | 2021-01-28 | 삼성전자주식회사 | 이미지 센서 및 이의 제조 방법 |
| US9786704B2 (en) * | 2015-09-10 | 2017-10-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMOS image sensor structure with crosstalk improvement |
| JPWO2017169314A1 (ja) * | 2016-03-31 | 2019-02-07 | ソニー株式会社 | 固体撮像素子、及び電子装置 |
| US11411030B2 (en) | 2017-02-17 | 2022-08-09 | Sony Semiconductor Solutions Corporation | Imaging element and electronic apparatus |
| JP6855287B2 (ja) * | 2017-03-08 | 2021-04-07 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、および電子機器 |
| JP7316764B2 (ja) * | 2017-05-29 | 2023-07-28 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
| DE102018124442A1 (de) * | 2017-11-15 | 2019-05-16 | Taiwan Semiconductor Manufacturing Co. Ltd. | Polarisatoren für Bildsensorvorrichtungen |
| KR102606735B1 (ko) * | 2018-06-19 | 2023-11-28 | 에스케이하이닉스 주식회사 | 반사 방지층 내에 매립된 그리드 패턴들을 갖는 이미지 센서 |
| KR102553314B1 (ko) * | 2018-08-29 | 2023-07-10 | 삼성전자주식회사 | 이미지 센서 |
| KR102589608B1 (ko) * | 2018-10-22 | 2023-10-16 | 삼성전자주식회사 | 이미지 센서 및 이의 제조 방법 |
| KR102634950B1 (ko) * | 2019-01-11 | 2024-02-07 | 삼성전자주식회사 | 이미지 센서 |
| US10998365B2 (en) * | 2019-01-30 | 2021-05-04 | Samsung Electronics Co., Ltd. | Image sensor |
| KR20210081892A (ko) * | 2019-12-24 | 2021-07-02 | 삼성전자주식회사 | 이미지 센서 및 그 제조방법 |
| US11367745B2 (en) * | 2020-08-20 | 2022-06-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and methods for sensing long wavelength light |
| US11955496B2 (en) * | 2020-09-29 | 2024-04-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Back-side deep trench isolation structure for image sensor |
| US11670662B2 (en) * | 2020-12-23 | 2023-06-06 | Omnivision Technologies, Inc. | Semiconductor substrate with passivated full deep-trench isolation and associated methods of manufacture |
-
2022
- 2022-03-30 KR KR1020237042725A patent/KR20240023514A/ko not_active Withdrawn
- 2022-03-30 JP JP2023529614A patent/JPWO2022270110A1/ja not_active Abandoned
- 2022-03-30 CN CN202280035036.6A patent/CN117296154A/zh not_active Withdrawn
- 2022-03-30 WO PCT/JP2022/015788 patent/WO2022270110A1/ja not_active Ceased
- 2022-03-30 EP EP22828029.3A patent/EP4362099A4/en active Pending
- 2022-03-30 US US18/570,793 patent/US20240304646A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN117296154A (zh) | 2023-12-26 |
| US20240304646A1 (en) | 2024-09-12 |
| WO2022270110A1 (ja) | 2022-12-29 |
| KR20240023514A (ko) | 2024-02-22 |
| EP4362099A1 (en) | 2024-05-01 |
| EP4362099A4 (en) | 2024-10-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250212 |
|
| A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20250430 |