JPWO2022264985A5 - - Google Patents
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- Publication number
- JPWO2022264985A5 JPWO2022264985A5 JP2023509476A JP2023509476A JPWO2022264985A5 JP WO2022264985 A5 JPWO2022264985 A5 JP WO2022264985A5 JP 2023509476 A JP2023509476 A JP 2023509476A JP 2023509476 A JP2023509476 A JP 2023509476A JP WO2022264985 A5 JPWO2022264985 A5 JP WO2022264985A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- formula
- carbon atoms
- following formula
- hydrogen atom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000004432 carbon atom Chemical group C* 0.000 claims 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 11
- 150000001875 compounds Chemical class 0.000 claims 10
- 239000011342 resin composition Substances 0.000 claims 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 125000000217 alkyl group Chemical group 0.000 claims 4
- -1 bismaleimide compound Chemical class 0.000 claims 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 4
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims 3
- 125000004450 alkenylene group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 2
- SSENHTOBLYRWKU-UHFFFAOYSA-N 1-(2-phenylethyl)imidazole Chemical compound C=1C=CC=CC=1CCN1C=CN=C1 SSENHTOBLYRWKU-UHFFFAOYSA-N 0.000 claims 1
- OWSXDWUAPKBLOI-UHFFFAOYSA-N 1-[2,6-di(propan-2-yl)phenyl]imidazole Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N1C=NC=C1 OWSXDWUAPKBLOI-UHFFFAOYSA-N 0.000 claims 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 claims 1
- NPZDCTUDQYGYQD-UHFFFAOYSA-N 1-tritylimidazole Chemical compound C1=NC=CN1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 NPZDCTUDQYGYQD-UHFFFAOYSA-N 0.000 claims 1
- YQYLLBSWWRWWAY-UHFFFAOYSA-N 1-tritylimidazole-4-carbaldehyde Chemical compound C1=NC(C=O)=CN1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 YQYLLBSWWRWWAY-UHFFFAOYSA-N 0.000 claims 1
- XFIJCEYDSGZRHB-UHFFFAOYSA-N 10-imidazol-1-yldecan-1-ol Chemical compound OCCCCCCCCCCN1C=CN=C1 XFIJCEYDSGZRHB-UHFFFAOYSA-N 0.000 claims 1
- RNIPJYFZGXJSDD-UHFFFAOYSA-N 2,4,5-triphenyl-1h-imidazole Chemical compound C1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 RNIPJYFZGXJSDD-UHFFFAOYSA-N 0.000 claims 1
- FHHCKYIBYRNHOZ-UHFFFAOYSA-N 2,5-diphenyl-1h-imidazole Chemical compound C=1N=C(C=2C=CC=CC=2)NC=1C1=CC=CC=C1 FHHCKYIBYRNHOZ-UHFFFAOYSA-N 0.000 claims 1
- NSWNXQGJAPQOID-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-diphenyl-1h-imidazole Chemical compound ClC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NSWNXQGJAPQOID-UHFFFAOYSA-N 0.000 claims 1
- NJXBHEMXPUMJRO-UHFFFAOYSA-N 2-(4-chlorophenyl)-4,5-diphenyl-1h-imidazole Chemical compound C1=CC(Cl)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NJXBHEMXPUMJRO-UHFFFAOYSA-N 0.000 claims 1
- NSXOBUOVKKFIHN-UHFFFAOYSA-N 2-(4-fluorophenyl)-4,5-diphenyl-1h-imidazole Chemical compound C1=CC(F)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NSXOBUOVKKFIHN-UHFFFAOYSA-N 0.000 claims 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 claims 1
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 claims 1
- KGOZFYOJDPVGMV-UHFFFAOYSA-N 4-(4,5-diphenyl-1h-imidazol-2-yl)benzonitrile Chemical compound C1=CC(C#N)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 KGOZFYOJDPVGMV-UHFFFAOYSA-N 0.000 claims 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 claims 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 claims 1
- 125000003172 aldehyde group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- JMBUODONIOAHPZ-UHFFFAOYSA-N chembl390388 Chemical compound C1=CC(O)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 JMBUODONIOAHPZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims 1
- 238000000016 photochemical curing Methods 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 125000000547 substituted alkyl group Chemical group 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021099115 | 2021-06-15 | ||
| JP2021099115 | 2021-06-15 | ||
| PCT/JP2022/023706 WO2022264985A1 (ja) | 2021-06-15 | 2022-06-14 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264985A1 JPWO2022264985A1 (https=) | 2022-12-22 |
| JPWO2022264985A5 true JPWO2022264985A5 (https=) | 2023-05-31 |
| JP7302760B2 JP7302760B2 (ja) | 2023-07-04 |
Family
ID=84526486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023509476A Active JP7302760B2 (ja) | 2021-06-15 | 2022-06-14 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12221523B2 (https=) |
| EP (1) | EP4321541B1 (https=) |
| JP (1) | JP7302760B2 (https=) |
| KR (1) | KR102646474B1 (https=) |
| CN (1) | CN117529509B (https=) |
| TW (1) | TWI836473B (https=) |
| WO (1) | WO2022264985A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024154780A1 (ja) * | 2023-01-19 | 2024-07-25 | 株式会社レゾナック | 感光性樹脂組成物、硬化物、及び半導体素子 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0912712A (ja) | 1995-06-27 | 1997-01-14 | Lion Corp | ダイマージアミン由来のポリアミド樹脂及び該ポリアミドを含有する合成樹脂製光学用材料 |
| WO2009069688A1 (ja) * | 2007-11-30 | 2009-06-04 | Mitsui Chemicals, Inc. | ポリイミド系複合材料およびそのフィルム |
| US20120077401A1 (en) | 2009-03-27 | 2012-03-29 | Tomohiko Kotake | Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin film |
| JP6379697B2 (ja) | 2014-06-05 | 2018-08-29 | Dic株式会社 | 硬化性樹脂組成物、硬化物および硬化剤 |
| TWI899456B (zh) | 2016-09-26 | 2025-10-01 | 日商力森諾科股份有限公司 | 樹脂組成物、半導體用配線層積層體及半導體裝置 |
| JP7442255B2 (ja) * | 2016-12-06 | 2024-03-04 | 三菱瓦斯化学株式会社 | 電子材料用樹脂組成物 |
| CN110637256B (zh) * | 2017-05-15 | 2024-01-09 | 三菱瓦斯化学株式会社 | 光刻用膜形成材料、光刻用膜形成用组合物、光刻用下层膜及图案形成方法 |
| JP7434727B2 (ja) * | 2019-05-31 | 2024-02-21 | 株式会社レゾナック | 接着剤組成物、積層体及び接着シート |
| WO2020262577A1 (ja) * | 2019-06-28 | 2020-12-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置 |
| EP3992221A4 (en) * | 2019-06-28 | 2023-06-21 | Mitsubishi Gas Chemical Company, Inc. | RESIN COMPOSITION, RESIN FILM, LAYER PRODUCT, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE WITH RESIN COMPOSITION LAYER FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR DEVICE |
| EP3950334B1 (en) * | 2019-06-28 | 2023-08-16 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
| CN113646393B (zh) * | 2019-06-28 | 2023-09-19 | 三菱瓦斯化学株式会社 | 树脂组合物、树脂片、多层印刷电路板和半导体装置 |
| JP7016485B2 (ja) | 2019-12-11 | 2022-02-07 | 三菱瓦斯化学株式会社 | 化合物及びその製造方法、樹脂組成物、樹脂シート、多層プリント配線板、並びに半導体装置 |
| CN114787276B (zh) | 2019-12-11 | 2023-03-21 | 三菱瓦斯化学株式会社 | 树脂组合物、树脂片、多层印刷电路板及半导体装置 |
| JP7367972B2 (ja) | 2019-12-20 | 2023-10-24 | 株式会社不二工機 | パイロット弁 |
-
2022
- 2022-06-14 KR KR1020237028144A patent/KR102646474B1/ko active Active
- 2022-06-14 CN CN202280043127.4A patent/CN117529509B/zh active Active
- 2022-06-14 JP JP2023509476A patent/JP7302760B2/ja active Active
- 2022-06-14 TW TW111121934A patent/TWI836473B/zh active
- 2022-06-14 WO PCT/JP2022/023706 patent/WO2022264985A1/ja not_active Ceased
- 2022-06-14 US US18/570,322 patent/US12221523B2/en active Active
- 2022-06-14 EP EP22824974.4A patent/EP4321541B1/en active Active
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