JPWO2022255122A1 - - Google Patents
Info
- Publication number
- JPWO2022255122A1 JPWO2022255122A1 JP2023525725A JP2023525725A JPWO2022255122A1 JP WO2022255122 A1 JPWO2022255122 A1 JP WO2022255122A1 JP 2023525725 A JP2023525725 A JP 2023525725A JP 2023525725 A JP2023525725 A JP 2023525725A JP WO2022255122 A1 JPWO2022255122 A1 JP WO2022255122A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021094424 | 2021-06-04 | ||
| JP2021094424 | 2021-06-04 | ||
| PCT/JP2022/020887 WO2022255122A1 (ja) | 2021-06-04 | 2022-05-19 | リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022255122A1 true JPWO2022255122A1 (https=) | 2022-12-08 |
| JPWO2022255122A5 JPWO2022255122A5 (https=) | 2024-02-01 |
| JP7733730B2 JP7733730B2 (ja) | 2025-09-03 |
Family
ID=84323263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023525725A Active JP7733730B2 (ja) | 2021-06-04 | 2022-05-19 | リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7733730B2 (https=) |
| TW (1) | TW202248266A (https=) |
| WO (1) | WO2022255122A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023042650A1 (ja) * | 2021-09-14 | 2023-03-23 | 日鉄ケミカル＆マテリアル株式会社 | 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10168287A (ja) * | 1996-12-06 | 1998-06-23 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| JP2000309623A (ja) * | 1990-05-01 | 2000-11-07 | Toto Kasei Co Ltd | リン含有難燃性エポキシ樹脂 |
| WO2021193273A1 (ja) * | 2020-03-27 | 2021-09-30 | 日鉄ケミカル＆マテリアル株式会社 | リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法 |
-
2022
- 2022-05-19 JP JP2023525725A patent/JP7733730B2/ja active Active
- 2022-05-19 WO PCT/JP2022/020887 patent/WO2022255122A1/ja not_active Ceased
- 2022-05-30 TW TW111120088A patent/TW202248266A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000309623A (ja) * | 1990-05-01 | 2000-11-07 | Toto Kasei Co Ltd | リン含有難燃性エポキシ樹脂 |
| JPH10168287A (ja) * | 1996-12-06 | 1998-06-23 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| WO2021193273A1 (ja) * | 2020-03-27 | 2021-09-30 | 日鉄ケミカル＆マテリアル株式会社 | リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7733730B2 (ja) | 2025-09-03 |
| WO2022255122A1 (ja) | 2022-12-08 |
| TW202248266A (zh) | 2022-12-16 |
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