JP7733730B2 - リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法 - Google Patents

リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法

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Publication number
JP7733730B2
JP7733730B2 JP2023525725A JP2023525725A JP7733730B2 JP 7733730 B2 JP7733730 B2 JP 7733730B2 JP 2023525725 A JP2023525725 A JP 2023525725A JP 2023525725 A JP2023525725 A JP 2023525725A JP 7733730 B2 JP7733730 B2 JP 7733730B2
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JP
Japan
Prior art keywords
phosphorus
epoxy resin
group
modified epoxy
containing modified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023525725A
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English (en)
Japanese (ja)
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JPWO2022255122A1 (https=
JPWO2022255122A5 (https=
Inventor
圭太 秋葉
洋 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical and Materials Co Ltd
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Application filed by Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Steel Chemical and Materials Co Ltd
Publication of JPWO2022255122A1 publication Critical patent/JPWO2022255122A1/ja
Publication of JPWO2022255122A5 publication Critical patent/JPWO2022255122A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
JP2023525725A 2021-06-04 2022-05-19 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法 Active JP7733730B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021094424 2021-06-04
JP2021094424 2021-06-04
PCT/JP2022/020887 WO2022255122A1 (ja) 2021-06-04 2022-05-19 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022255122A1 JPWO2022255122A1 (https=) 2022-12-08
JPWO2022255122A5 JPWO2022255122A5 (https=) 2024-02-01
JP7733730B2 true JP7733730B2 (ja) 2025-09-03

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JP2023525725A Active JP7733730B2 (ja) 2021-06-04 2022-05-19 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法

Country Status (3)

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JP (1) JP7733730B2 (https=)
TW (1) TW202248266A (https=)
WO (1) WO2022255122A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023042650A1 (ja) * 2021-09-14 2023-03-23 日鉄ケミカル＆マテリアル株式会社 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309623A (ja) 1990-05-01 2000-11-07 Toto Kasei Co Ltd リン含有難燃性エポキシ樹脂
WO2021193273A1 (ja) 2020-03-27 2021-09-30 日鉄ケミカル＆マテリアル株式会社 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168287A (ja) * 1996-12-06 1998-06-23 Dainippon Ink & Chem Inc エポキシ樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309623A (ja) 1990-05-01 2000-11-07 Toto Kasei Co Ltd リン含有難燃性エポキシ樹脂
WO2021193273A1 (ja) 2020-03-27 2021-09-30 日鉄ケミカル＆マテリアル株式会社 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法

Also Published As

Publication number Publication date
WO2022255122A1 (ja) 2022-12-08
TW202248266A (zh) 2022-12-16
JPWO2022255122A1 (https=) 2022-12-08

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