JPWO2021193273A1 - - Google Patents

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Publication number
JPWO2021193273A1
JPWO2021193273A1 JP2022510000A JP2022510000A JPWO2021193273A1 JP WO2021193273 A1 JPWO2021193273 A1 JP WO2021193273A1 JP 2022510000 A JP2022510000 A JP 2022510000A JP 2022510000 A JP2022510000 A JP 2022510000A JP WO2021193273 A1 JPWO2021193273 A1 JP WO2021193273A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022510000A
Other languages
Japanese (ja)
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JP7762140B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021193273A1 publication Critical patent/JPWO2021193273A1/ja
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Publication of JP7762140B2 publication Critical patent/JP7762140B2/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
JP2022510000A 2020-03-27 2021-03-17 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法 Active JP7762140B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020057699 2020-03-27
JP2020057699 2020-03-27
PCT/JP2021/010755 WO2021193273A1 (ja) 2020-03-27 2021-03-17 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021193273A1 true JPWO2021193273A1 (https=) 2021-09-30
JP7762140B2 JP7762140B2 (ja) 2025-10-29

Family

ID=77892532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022510000A Active JP7762140B2 (ja) 2020-03-27 2021-03-17 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法

Country Status (3)

Country Link
JP (1) JP7762140B2 (https=)
TW (1) TW202142584A (https=)
WO (1) WO2021193273A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7733730B2 (ja) * 2021-06-04 2025-09-03 日鉄ケミカル&マテリアル株式会社 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法
TW202344544A (zh) * 2022-03-03 2023-11-16 日商日鐵化學材料股份有限公司 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007177054A (ja) * 2005-12-27 2007-07-12 Toto Kasei Co Ltd 新規熱可塑性ポリヒドロキシポリエーテル樹脂、及び、それを配合した樹脂組成物
WO2019065552A1 (ja) * 2017-09-26 2019-04-04 日鉄ケミカル&マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物
JP2019147863A (ja) * 2018-02-26 2019-09-05 日鉄ケミカル&マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007177054A (ja) * 2005-12-27 2007-07-12 Toto Kasei Co Ltd 新規熱可塑性ポリヒドロキシポリエーテル樹脂、及び、それを配合した樹脂組成物
WO2019065552A1 (ja) * 2017-09-26 2019-04-04 日鉄ケミカル&マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物
JP2019147863A (ja) * 2018-02-26 2019-09-05 日鉄ケミカル&マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物

Also Published As

Publication number Publication date
WO2021193273A1 (ja) 2021-09-30
TW202142584A (zh) 2021-11-16
JP7762140B2 (ja) 2025-10-29

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