TW202142584A - 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法 - Google Patents
含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法 Download PDFInfo
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- TW202142584A TW202142584A TW110107117A TW110107117A TW202142584A TW 202142584 A TW202142584 A TW 202142584A TW 110107117 A TW110107117 A TW 110107117A TW 110107117 A TW110107117 A TW 110107117A TW 202142584 A TW202142584 A TW 202142584A
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- TW
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- Prior art keywords
- phosphorus
- group
- resin
- formula
- containing phenoxy
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020057699 | 2020-03-27 | ||
| JP2020-057699 | 2020-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202142584A true TW202142584A (zh) | 2021-11-16 |
Family
ID=77892532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110107117A TW202142584A (zh) | 2020-03-27 | 2021-02-26 | 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7762140B2 (https=) |
| TW (1) | TW202142584A (https=) |
| WO (1) | WO2021193273A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7733730B2 (ja) * | 2021-06-04 | 2025-09-03 | 日鉄ケミカル&マテリアル株式会社 | リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法 |
| TW202344544A (zh) * | 2022-03-03 | 2023-11-16 | 日商日鐵化學材料股份有限公司 | 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4854296B2 (ja) * | 2005-12-27 | 2012-01-18 | 新日鐵化学株式会社 | 新規熱可塑性ポリヒドロキシポリエーテル樹脂、及び、それを配合した樹脂組成物 |
| WO2019065552A1 (ja) * | 2017-09-26 | 2019-04-04 | 日鉄ケミカル&マテリアル株式会社 | リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物 |
| JP7055664B2 (ja) * | 2018-02-26 | 2022-04-18 | 日鉄ケミカル&マテリアル株式会社 | リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物 |
-
2021
- 2021-02-26 TW TW110107117A patent/TW202142584A/zh unknown
- 2021-03-17 WO PCT/JP2021/010755 patent/WO2021193273A1/ja not_active Ceased
- 2021-03-17 JP JP2022510000A patent/JP7762140B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021193273A1 (ja) | 2021-09-30 |
| JP7762140B2 (ja) | 2025-10-29 |
| JPWO2021193273A1 (https=) | 2021-09-30 |
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