TW202142584A - 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法 - Google Patents

含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法 Download PDF

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Publication number
TW202142584A
TW202142584A TW110107117A TW110107117A TW202142584A TW 202142584 A TW202142584 A TW 202142584A TW 110107117 A TW110107117 A TW 110107117A TW 110107117 A TW110107117 A TW 110107117A TW 202142584 A TW202142584 A TW 202142584A
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TW
Taiwan
Prior art keywords
phosphorus
group
resin
formula
containing phenoxy
Prior art date
Application number
TW110107117A
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English (en)
Chinese (zh)
Inventor
秋葉圭太
佐藤洋
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日商日鐵化學材料股份有限公司
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Publication of TW202142584A publication Critical patent/TW202142584A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
TW110107117A 2020-03-27 2021-02-26 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法 TW202142584A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020057699 2020-03-27
JP2020-057699 2020-03-27

Publications (1)

Publication Number Publication Date
TW202142584A true TW202142584A (zh) 2021-11-16

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Family Applications (1)

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TW110107117A TW202142584A (zh) 2020-03-27 2021-02-26 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法

Country Status (3)

Country Link
JP (1) JP7762140B2 (https=)
TW (1) TW202142584A (https=)
WO (1) WO2021193273A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7733730B2 (ja) * 2021-06-04 2025-09-03 日鉄ケミカル&マテリアル株式会社 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法
TW202344544A (zh) * 2022-03-03 2023-11-16 日商日鐵化學材料股份有限公司 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4854296B2 (ja) * 2005-12-27 2012-01-18 新日鐵化学株式会社 新規熱可塑性ポリヒドロキシポリエーテル樹脂、及び、それを配合した樹脂組成物
WO2019065552A1 (ja) * 2017-09-26 2019-04-04 日鉄ケミカル&マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物
JP7055664B2 (ja) * 2018-02-26 2022-04-18 日鉄ケミカル&マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物

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WO2021193273A1 (ja) 2021-09-30
JP7762140B2 (ja) 2025-10-29
JPWO2021193273A1 (https=) 2021-09-30

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