JP7762140B2 - リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法 - Google Patents

リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法

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Publication number
JP7762140B2
JP7762140B2 JP2022510000A JP2022510000A JP7762140B2 JP 7762140 B2 JP7762140 B2 JP 7762140B2 JP 2022510000 A JP2022510000 A JP 2022510000A JP 2022510000 A JP2022510000 A JP 2022510000A JP 7762140 B2 JP7762140 B2 JP 7762140B2
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Japan
Prior art keywords
group
phosphorus
formula
phenoxy resin
resin
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JP2022510000A
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English (en)
Japanese (ja)
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JPWO2021193273A1 (https=
Inventor
圭太 秋葉
洋 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
JP2022510000A 2020-03-27 2021-03-17 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法 Active JP7762140B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020057699 2020-03-27
JP2020057699 2020-03-27
PCT/JP2021/010755 WO2021193273A1 (ja) 2020-03-27 2021-03-17 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法

Publications (2)

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JPWO2021193273A1 JPWO2021193273A1 (https=) 2021-09-30
JP7762140B2 true JP7762140B2 (ja) 2025-10-29

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JP2022510000A Active JP7762140B2 (ja) 2020-03-27 2021-03-17 リン含有フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有フェノキシ樹脂の製造方法

Country Status (3)

Country Link
JP (1) JP7762140B2 (https=)
TW (1) TW202142584A (https=)
WO (1) WO2021193273A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7733730B2 (ja) * 2021-06-04 2025-09-03 日鉄ケミカル＆マテリアル株式会社 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法
TW202344544A (zh) * 2022-03-03 2023-11-16 日商日鐵化學材料股份有限公司 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007177054A (ja) 2005-12-27 2007-07-12 Toto Kasei Co Ltd 新規熱可塑性ポリヒドロキシポリエーテル樹脂、及び、それを配合した樹脂組成物
WO2019065552A1 (ja) 2017-09-26 2019-04-04 日鉄ケミカル＆マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物
JP2019147863A (ja) 2018-02-26 2019-09-05 日鉄ケミカル＆マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007177054A (ja) 2005-12-27 2007-07-12 Toto Kasei Co Ltd 新規熱可塑性ポリヒドロキシポリエーテル樹脂、及び、それを配合した樹脂組成物
WO2019065552A1 (ja) 2017-09-26 2019-04-04 日鉄ケミカル＆マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物
JP2019147863A (ja) 2018-02-26 2019-09-05 日鉄ケミカル＆マテリアル株式会社 リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物

Also Published As

Publication number Publication date
WO2021193273A1 (ja) 2021-09-30
TW202142584A (zh) 2021-11-16
JPWO2021193273A1 (https=) 2021-09-30

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