JPWO2021187180A1 - - Google Patents
Info
- Publication number
- JPWO2021187180A1 JPWO2021187180A1 JP2022508221A JP2022508221A JPWO2021187180A1 JP WO2021187180 A1 JPWO2021187180 A1 JP WO2021187180A1 JP 2022508221 A JP2022508221 A JP 2022508221A JP 2022508221 A JP2022508221 A JP 2022508221A JP WO2021187180 A1 JPWO2021187180 A1 JP WO2021187180A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020048999 | 2020-03-19 | ||
| JP2020048999 | 2020-03-19 | ||
| PCT/JP2021/008848 WO2021187180A1 (ja) | 2020-03-19 | 2021-03-08 | フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びフェノキシ樹脂の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021187180A1 true JPWO2021187180A1 (https=) | 2021-09-23 |
| JPWO2021187180A5 JPWO2021187180A5 (https=) | 2022-11-18 |
| JP7733639B2 JP7733639B2 (ja) | 2025-09-03 |
Family
ID=77771846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022508221A Active JP7733639B2 (ja) | 2020-03-19 | 2021-03-08 | フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びフェノキシ樹脂の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7733639B2 (https=) |
| TW (1) | TW202142585A (https=) |
| WO (1) | WO2021187180A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7487326B2 (ja) * | 2020-09-30 | 2024-05-20 | 日鉄ケミカル＆マテリアル株式会社 | 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板 |
| JP7744150B2 (ja) * | 2021-03-26 | 2025-09-25 | 日鉄ケミカル＆マテリアル株式会社 | フェノキシ樹脂、その樹脂組成物、その硬化物及びその製造方法。 |
| JP7738061B2 (ja) * | 2021-06-04 | 2025-09-11 | 日鉄ケミカル＆マテリアル株式会社 | 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 |
| WO2023042650A1 (ja) * | 2021-09-14 | 2023-03-23 | 日鉄ケミカル＆マテリアル株式会社 | 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 |
| JPWO2023053875A1 (https=) * | 2021-09-29 | 2023-04-06 | ||
| TW202344544A (zh) * | 2022-03-03 | 2023-11-16 | 日商日鐵化學材料股份有限公司 | 環氧樹脂組成物、含強化纖維之環氧樹脂組成物、預浸體及使用該等之纖維強化塑膠、及熱塑性環氧樹脂 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122713A (ja) * | 1990-09-12 | 1992-04-23 | Hitachi Chem Co Ltd | 高分子量エポキシ樹脂の製造方法 |
| WO2005095517A1 (ja) * | 2004-03-30 | 2005-10-13 | Taiyo Ink Mfg. Co., Ltd. | 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板 |
| JP2007277333A (ja) * | 2006-04-04 | 2007-10-25 | Dainippon Ink & Chem Inc | 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔 |
| JP2008231428A (ja) * | 2008-04-03 | 2008-10-02 | Japan Epoxy Resin Kk | 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板 |
| JP2008239682A (ja) * | 2007-03-26 | 2008-10-09 | Dic Corp | 熱硬化性ポリウレタン樹脂組成物 |
| JP2012207066A (ja) * | 2011-03-29 | 2012-10-25 | Sekisui Chem Co Ltd | 熱硬化性樹脂材料及び多層基板 |
| JP2013185089A (ja) * | 2012-03-08 | 2013-09-19 | Sekisui Chem Co Ltd | 熱硬化性樹脂材料及び多層基板 |
| JP2016089165A (ja) * | 2014-10-29 | 2016-05-23 | 三菱化学株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法 |
| JP2020041048A (ja) * | 2018-09-10 | 2020-03-19 | 日立化成株式会社 | エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料 |
-
2021
- 2021-02-26 TW TW110106875A patent/TW202142585A/zh unknown
- 2021-03-08 WO PCT/JP2021/008848 patent/WO2021187180A1/ja not_active Ceased
- 2021-03-08 JP JP2022508221A patent/JP7733639B2/ja active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122713A (ja) * | 1990-09-12 | 1992-04-23 | Hitachi Chem Co Ltd | 高分子量エポキシ樹脂の製造方法 |
| WO2005095517A1 (ja) * | 2004-03-30 | 2005-10-13 | Taiyo Ink Mfg. Co., Ltd. | 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板 |
| JP2007277333A (ja) * | 2006-04-04 | 2007-10-25 | Dainippon Ink & Chem Inc | 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔 |
| JP2008239682A (ja) * | 2007-03-26 | 2008-10-09 | Dic Corp | 熱硬化性ポリウレタン樹脂組成物 |
| JP2008231428A (ja) * | 2008-04-03 | 2008-10-02 | Japan Epoxy Resin Kk | 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板 |
| JP2012207066A (ja) * | 2011-03-29 | 2012-10-25 | Sekisui Chem Co Ltd | 熱硬化性樹脂材料及び多層基板 |
| JP2013185089A (ja) * | 2012-03-08 | 2013-09-19 | Sekisui Chem Co Ltd | 熱硬化性樹脂材料及び多層基板 |
| JP2016089165A (ja) * | 2014-10-29 | 2016-05-23 | 三菱化学株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法 |
| JP2020041048A (ja) * | 2018-09-10 | 2020-03-19 | 日立化成株式会社 | エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7733639B2 (ja) | 2025-09-03 |
| TW202142585A (zh) | 2021-11-16 |
| WO2021187180A1 (ja) | 2021-09-23 |
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