JPWO2022255231A1 - - Google Patents

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Publication number
JPWO2022255231A1
JPWO2022255231A1 JP2023525777A JP2023525777A JPWO2022255231A1 JP WO2022255231 A1 JPWO2022255231 A1 JP WO2022255231A1 JP 2023525777 A JP2023525777 A JP 2023525777A JP 2023525777 A JP2023525777 A JP 2023525777A JP WO2022255231 A1 JPWO2022255231 A1 JP WO2022255231A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023525777A
Other languages
Japanese (ja)
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JP7738061B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2022255231A1 publication Critical patent/JPWO2022255231A1/ja
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Publication of JP7738061B2 publication Critical patent/JP7738061B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
JP2023525777A 2021-06-04 2022-05-26 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 Active JP7738061B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021094372 2021-06-04
JP2021094372 2021-06-04
PCT/JP2022/021654 WO2022255231A1 (ja) 2021-06-04 2022-05-26 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法

Publications (2)

Publication Number Publication Date
JPWO2022255231A1 true JPWO2022255231A1 (https=) 2022-12-08
JP7738061B2 JP7738061B2 (ja) 2025-09-11

Family

ID=84324381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525777A Active JP7738061B2 (ja) 2021-06-04 2022-05-26 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法

Country Status (3)

Country Link
JP (1) JP7738061B2 (https=)
TW (1) TW202248268A (https=)
WO (1) WO2022255231A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023042650A1 (ja) * 2021-09-14 2023-03-23 日鉄ケミカル＆マテリアル株式会社 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089165A (ja) * 2014-10-29 2016-05-23 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2017193649A (ja) * 2016-04-21 2017-10-26 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2019052278A (ja) * 2017-09-19 2019-04-04 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202142585A (zh) * 2020-03-19 2021-11-16 日商日鐵化學材料股份有限公司 苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及苯氧基樹脂的製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089165A (ja) * 2014-10-29 2016-05-23 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2017193649A (ja) * 2016-04-21 2017-10-26 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2019052278A (ja) * 2017-09-19 2019-04-04 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板

Also Published As

Publication number Publication date
JP7738061B2 (ja) 2025-09-11
TW202248268A (zh) 2022-12-16
WO2022255231A1 (ja) 2022-12-08

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