WO2022255231A1 - 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 - Google Patents

変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 Download PDF

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WO2022255231A1
WO2022255231A1 PCT/JP2022/021654 JP2022021654W WO2022255231A1 WO 2022255231 A1 WO2022255231 A1 WO 2022255231A1 JP 2022021654 W JP2022021654 W JP 2022021654W WO 2022255231 A1 WO2022255231 A1 WO 2022255231A1
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epoxy resin
modified epoxy
resin
resin composition
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French (fr)
Japanese (ja)
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圭太 秋葉
洋 佐藤
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention provides a modified epoxy resin having excellent dielectric properties, thermal conductivity and fluidity, a resin composition containing this modified epoxy resin and a curing agent, a cured product thereof having excellent dielectric properties and thermal conductivity, and the resin.
  • the present invention relates to laminates for electric/electronic circuits using the composition.
  • Epoxy resins have excellent heat resistance, adhesiveness, chemical resistance, water resistance, mechanical strength, electrical properties, etc., so they are widely used in fields such as paints, civil engineering, adhesion, and electrical material applications. Film formability is imparted by increasing the molecular weight by various methods.
  • the high molecular weight epoxy resins are called phenoxy resins.
  • bisphenol A type phenoxy resins are mainly used as base resins for paint varnishes, base resins for film molding, or added to epoxy resin varnishes to adjust fluidity, improve toughness when cured, and improve adhesiveness. Used for improvement purposes. Further, those having a phosphorus atom or a bromine atom in the skeleton are used as flame retardants blended in epoxy resin compositions and thermoplastic resins.
  • Epoxy resins which are used as electrical materials such as laminates for electrical and electronic circuits, are required to have solvent solubility and resin compatibility in addition to heat resistance.
  • the miniaturization and performance enhancement of information equipment have progressed rapidly, and along with this, materials used in the fields of semiconductors and electronic components are required to have higher performance than ever before, especially thinner substrates. And excellent dielectric properties and thermal conductivity are required along with high functionality.
  • Patent Document 1 discloses that a phenoxy resin obtained by reacting a difunctional epoxy resin and a diester compound and a cured product thereof have excellent dielectric properties, but the thermal conductivity is still insufficient.
  • Patent Document 2 discloses a method for improving both dielectric properties and thermal conductivity by introducing a rigid site such as a biphenyl structure into the main skeleton and converting the side chain hydroxyl groups of the phenoxy resin into esters. exemplified.
  • a rigid site such as a biphenyl structure
  • the fluidity of the phenoxy resin is significantly deteriorated, so that impregnation failure occurs when impregnating glass cloth or the like with the phenoxy resin composition.
  • the present inventors have made intensive studies on epoxy resins, and have found that epoxy resins having a specific structure are excellent in dielectric properties, thermal conductivity and fluidity.
  • the inventors have found that a cured product obtained by curing the composition has excellent dielectric properties and thermal conductivity, and completed the present invention.
  • the present invention is represented by the following formula (1) and has an epoxy equivalent of 250 to 50,000 g/eq. is a modified epoxy resin.
  • X is a divalent group and has at least a phenylene group and a biphenylene group, or a naphthylene group and a biphenylene group.
  • the phenylene group, biphenylene group, and naphthylene group may each have a substituent on each aromatic ring.
  • Y is independently a hydrogen atom, an acyl group having 2 to 20 carbon atoms, or a glycidyl group.
  • Z is an acyl group having 2 to 20 carbon atoms or a hydrogen atom, and 5 mol % or more is the acyl group.
  • n is the average number of repetitions and is 1 or more and 500 or less.
  • the present invention is a resin composition containing the above modified epoxy resin and a curing agent.
  • the resin composition preferably contains 0.1 to 100 parts by mass of a curing agent as a solid content with respect to 100 parts by mass of the solid content of the modified epoxy resin.
  • curing agents to be incorporated in the above resin composition include acrylic acid ester resins, melamine resins, urea resins, phenol resins, acid anhydrides, amine compounds, imidazole compounds, amide compounds, cationic polymerization initiators, organic There is at least one selected from the group consisting of phosphines, polyisocyanate compounds, blocked isocyanate compounds, carbodiimide compounds and active ester curing agents.
  • the present invention also provides a cured product obtained by curing the above resin composition. Further, the present invention is a laminate for electric/electronic circuits using the above resin composition.
  • the present invention also provides a method for producing a modified epoxy resin, characterized by reacting a bifunctional epoxy resin represented by the following formula (5) with a compound represented by the following formula (6).
  • X 1 and X 2 are divalent groups, and X 1 and/or X 2 include a phenylene group and a biphenylene group, or a naphthylene group and a biphenylene group.
  • the phenylene group, biphenylene group, and naphthylene group may each have a substituent on each aromatic ring.
  • G is a glycidyl group.
  • Q is independently an acyl group having 2 to 20 carbon atoms or a hydrogen atom, and 5 mol % or more is the above acyl group.
  • the compound represented by formula (6) is a compound in which at least one of Q is an acyl group, or a mixture of a compound in which at least one of Q is an acyl group and a compound in which both of Q are hydrogen atoms, good too.
  • m is the average value of the number of repetitions, and is 0 or more and 6 or less.
  • X is a divalent group and includes phenylene and biphenylene groups or naphthylene and biphenylene groups.
  • the phenylene group, biphenylene group, and naphthylene group may each have a substituent on each aromatic ring.
  • L is independently a hydrogen atom or a glycidyl group.
  • T is an acyl group having 2 to 20 carbon atoms.
  • n is the average number of repetitions and is 1 or more and 500 or less.
  • a modified epoxy resin with excellent dielectric properties, thermal conductivity and fluidity.
  • a resin composition using this modified epoxy resin can provide a cured product having excellent dielectric properties and thermal conductivity.
  • FIG. 1 is a GPC chart of the modified epoxy resin of Example 1.
  • FIG. 1 is an IR chart of the modified epoxy resin of Example 1.
  • FIG. 2 is a GPC chart of the modified epoxy resin of Example 7.
  • FIG. 4 is an IR chart of the modified epoxy resin of Example 7.
  • FIG. 2 is a GPC chart of the modified epoxy resin of Example 8.
  • FIG. 4 is an IR chart of the modified epoxy resin of Example 8.
  • FIG. 1 is a GPC chart of the modified epoxy resin of Example 1.
  • FIG. 1 is an IR chart of the modified epoxy resin of Example 1.
  • FIG. 2 is a GPC chart of the modified epoxy resin of Example 7.
  • FIG. 4 is an IR chart of the modified epoxy resin of Example 8.
  • FIG. 1 is a GPC chart of the modified epoxy resin of Example 1.
  • FIG. 1 is an IR chart of the modified epoxy resin of Example 1.
  • FIG. 2 is a GPC chart of the modified epoxy resin of Example 7.
  • FIG. 4 is an IR chart of the modified epoxy resin
  • the modified epoxy resin of the present invention is represented by the above formula (1), is an epoxy resin having an epoxy equivalent (g/eq.) of 250 to 50,000, and contains a phenylene group and a biphenylene group, or a naphthylene group and a biphenylene group. and further have a structure in which some or all of the hydrogen atoms in the hydroxyl groups are substituted (modified) with acyl groups (Z). If the epoxy equivalent is within the above range, the modified epoxy resin can participate in the curing reaction and be incorporated into the crosslinked structure.
  • the epoxy equivalent is preferably 400 to 40,000, more preferably 600 to 30,000, even more preferably 700 to 20,000.
  • the epoxy equivalent is higher, 5,000 to 50,000, more preferably 8,000 to 49,000, and still more preferably 9,000 to 9,000. 48,000.
  • good impregnability etc. are required for substrate applications in which a base material is impregnated for use. 000, more preferably 270 to 3,000.
  • the weight average molecular weight (Mw) of the modified epoxy resin of the present invention is preferably 1,000 or more and 200,000 or less.
  • Mw is preferably 1,000 or more and 200,000 or less.
  • Mw is preferably 5,000 or more, more preferably 10,000 or more, and even more preferably 15,000 or more.
  • Mw is more preferably 160,000 or less, even more preferably 120,000 or less, and particularly preferably 80,000 or less.
  • Mw may be 10,000 or less, more preferably 5,000 or less.
  • the Mw of the modified epoxy resin can be measured by the gel permeation chromatography method (GPC method) described in Examples.
  • the modified epoxy resin of the present invention has a structure in which the hydrogen atoms in the hydroxyl groups are substituted (modified) with acyl groups, so that it becomes low in polarity and has excellent dielectric properties, low hygroscopicity, solvent solubility, Better resin compatibility. Moreover, by having a phenylene group and a biphenylene group, or a naphthylene group and a biphenylene group, excellent effects in thermal conductivity and fluidity can be obtained.
  • the phenylene group, biphenylene group, and naphthylene group may each have a substituent on each aromatic ring.
  • the modified epoxy resin of the present invention can be advantageously obtained by the production method of the present invention.
  • the modified epoxy resin obtained by the production method of the present invention is sometimes referred to as the "modified epoxy resin of the present invention”
  • the cured product obtained by curing the resin composition of the present invention is referred to as the "cured product of the present invention.
  • the method for producing the modified epoxy resin of the present invention may be referred to as the “production method of the present invention”.
  • X is a divalent group
  • a divalent group (X 1 ) consisting of a phenylene group and/or a naphthylene group and a divalent group (X 2 ) consisting of a biphenylene group are essential.
  • the molar ratio of the group (X 1 ) to the group (X 2 ) is preferably 1/9 to 9/1, more preferably 2/8 to 8/2, still more preferably 3/7 to 7/3, and 4/ 6 to 6/4 is particularly preferred.
  • the total of the group (X 1 ) and the group (X 2 ) is preferably 1 mol% or more, more preferably 10 mol% or more, still more preferably 30 mol% or more, and 50 mol % or more is particularly preferred.
  • the phenylene group, naphthylene group (X 1 ), and biphenylene group (X 2 ) may be unsubstituted or may have a substituent on each aromatic ring.
  • the number of substituents is preferably 0 to 2 in the phenylene group, 0 to 2 in each benzene ring in the biphenylene group, and 0 to 4 in the naphthylene group.
  • substituents include alkyl groups having 1 to 12 carbon atoms, alkoxy groups having 1 to 12 carbon atoms, aryl groups having 6 to 12 carbon atoms, aralkyl groups having 7 to 13 carbon atoms, and aryloxy groups having 6 to 12 carbon atoms.
  • an aralkyloxy group having 7 to 13 carbon atoms an alkenyl group having 2 to 12 carbon atoms, or an alkynyl group having 2 to 12 carbon atoms.
  • the phenylene group, biphenylene group and naphthylene group are preferably unsubstituted or substituted with an alkyl group having 1 to 4 carbon atoms, more preferably unsubstituted or substituted with a methyl group. This is because if the substituent has a large number of carbon atoms, the heat resistance may decrease.
  • a phenylene group is represented by the following formula (2)
  • a naphthylene group is represented by the following formula (3)
  • a biphenylene group is represented by the following formula (4).
  • R is a substituent
  • i and k are integers from 0 to 4
  • j is an integer from 0 to 6.
  • the alkyl group having 1 to 12 carbon atoms may be linear, branched or cyclic, and examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, t-butyl group, n-pentyl group, isopentyl group, neopentyl group, t-pentyl group, cyclopentyl group, n-hexyl group, isohexyl group, cyclohexyl group, n-heptyl group, cycloheptyl group, methylcyclohexyl group, n- octyl group, cyclooctyl group, n-nonyl group, 3,3,5-trimethylcyclohexyl group, n-decyl group, cyclodecyl group, n-undecyl group, n-dodecy
  • the alkoxy group having 1 to 12 carbon atoms may be linear, branched or cyclic, and examples thereof include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy and sec-butoxy. , t-butoxy group, n-pentoxy group, isopentoxy group, neopentoxy group, t-pentoxy group, cyclopentoxy group, n-hexyloxy group, isohexyloxy group, cyclohexyloxy group, n-heptoxy group, cycloheptoxy group, methylcyclohexyloxy group, n-octyloxy group, cyclooctyloxy group, n-nonyloxy group, 3,3,5-trimethylcyclohexyloxy group, n-decyloxy group, cyclodecyloxy group, n-undecyloxy group, n-dodecyloxy group, cycl
  • aralkyloxy groups having 7 to 13 carbon atoms include benzyloxy, methylbenzyloxy, dimethylbenzyloxy, trimethylbenzyloxy, phenethyloxy, 1-phenylethyloxy, and 2-phenylisopropyloxy groups. , a naphthylmethyloxy group, and the like.
  • alkynyl groups having 2 to 12 carbon atoms examples include ethynyl, 1-propynyl, 2-propynyl, 1-butynyl, 2-butynyl, 3-butynyl, 1,3-butandienyl and phenylethynyl. groups, naphthylethynyl groups, and the like.
  • the divalent group other than the phenylene group, naphthylene group and biphenylene group is preferably a divalent hydrocarbon group or -O-, -CO-, -S-, -COO-, -SO It is a hydrocarbon group which may have a group such as -, -SO 2 -.
  • These divalent groups include, for example, an aromatic skeleton representing a residual skeleton obtained by removing two hydroxyl groups from an aromatic diol compound, an aliphatic skeleton representing a residual skeleton obtained by removing two hydroxyl groups from an aliphatic diol compound, and an alicyclic skeleton representing a residual skeleton obtained by removing two hydroxyl groups from an alicyclic diol compound.
  • These groups are the residual skeleton obtained by removing two glycidyloxy groups from a bifunctional epoxy resin (diglycidyl ether compound), the residual skeleton obtained by removing two ester structures from a diester compound, and the two hydroxyl groups removed from a bifunctional phenol compound. It is derived from the residual skeleton.
  • the aromatic skeleton having a structure obtained by removing two hydroxyl groups from an aromatic diol compound includes bisphenol A, bisphenolacetophenone, bisphenol AF, bisphenol AD, bisphenol B, bisphenol BP, bisphenol C, bisphenol E, bisphenol F, bisphenol G, bisphenol M, bisphenol S, bisphenol P, bisphenol PH, bisphenol trimethylcyclohexane and bisphenol type optionally having an alkyl group having 1 to 10 carbon atoms as a substituent such as bisphenol trimethylcyclohexane and bisphenol cyclohexane, hydroquinone, Benzene types such as dihydroxyphenyls optionally having an unsubstituted or C 1-10 alkyl group such as resorcinol and catechol as a substituent, or unsubstituted or substituted C 1-10 alkyl groups Naphthalene types such as dihydroxynaphthalenes which may have as a group, biphenyl types such as dihydroxybipheny
  • aliphatic skeleton examples include alkylene glycol skeletons such as ethylene glycol, propylene glycol and butylene glycol.
  • alicyclic skeleton examples include hydrogenated bisphenol skeletons such as hydrogenated bisphenol A, hydrogenated bisphenol F, and hydrogenated bisphenolacetophenone.
  • the hydrocarbon group having 1 to 19 carbon atoms represented by R includes an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, or 7 to 13 carbon atoms. is preferred.
  • aryl group having 6 to 12 carbon atoms examples include phenyl group, tolyl group, ethylphenyl group, xylyl group, n-propylphenyl group, isopropylphenyl group, mesityl group, naphthyl group, methylnaphthyl group and the like.
  • the aralkyl group having 7 to 13 carbon atoms includes, for example, benzyl group, methylbenzyl group, dimethylbenzyl group, trimethylbenzyl group, phenethyl group, 2-phenylisopropyl group, naphthylmethyl group and the like.
  • an acyl group having a hydrocarbon group of 1 to 7 carbon atoms is more preferable, an acetyl group, propanoyl group, butanoyl group, benzoyl group and methylbenzoyl group are more preferable, and an acetyl group and benzoyl group are particularly preferable.
  • Z is an acyl group having 2 to 20 carbon atoms (hereinafter sometimes simply referred to as "acyl group”) or a hydrogen atom. At least 5 mol % of Z are acyl groups and the rest are hydrogen atoms.
  • the acyl group content (mol %) in all Z in formula (1) is also referred to as an acylation rate.
  • the acylation rate is preferably 10 mol% or more, more preferably 50 mol% or more, even more preferably 70 mol% or more, and even more preferably 90 mol% or more.
  • there is no upper limit for the acylation rate and it may be 100%, but it is about 95% in terms of reactivity.
  • the modified epoxy resin of the present invention does not contain secondary hydroxyl groups, and the dielectric properties can be further improved. Improvements in solubility and moisture resistance can also be expected.
  • the modified epoxy of the present invention is used as long as it does not greatly affect other physical properties such as moisture resistance.
  • a suitable amount of secondary hydroxyl groups can be intentionally present in the resin.
  • Specific examples of acyl groups are the same as those exemplified for Y above, and preferred acyl groups are also the same.
  • n is the number of repetitions and the average value. Its value ranges from 1 to 500. From the viewpoint of fluidity and handleability, it is preferably 1 or more and 400 or less, more preferably 1 or more and 300 or less. The n number can be calculated from the number average molecular weight (Mn) obtained by the GPC method.
  • the modified epoxy resin of the present invention is obtained by acylating some or all of the secondary hydroxyl groups, and can be obtained by various methods.
  • a preferable manufacturing method includes, for example, the following manufacturing method. (A); A manufacturing method of reacting a bifunctional epoxy resin represented by the above formula (5) with a diester compound represented by the above formula (6). Hereinafter, this method may be referred to as manufacturing method (A).
  • an acid component acylating agent
  • this method may be referred to as manufacturing method (B).
  • the modified epoxy resins obtained by production methods (A) and (B) are the modified epoxy resins of the present invention and are represented by the same formula (1).
  • the production method (A) is a method of reacting a bifunctional epoxy resin represented by formula (5) with a diester compound represented by formula (6).
  • G is a glycidyl group
  • m is the number of repetitions
  • the average value thereof is 0 or more and 6 or less, preferably 0 or more and 3 or less.
  • Q is independently an acyl group having 2 to 20 carbon atoms or a hydrogen atom, and can be defined in the same manner as above.
  • 5 mol % or more of Q are acyl groups having 2 to 20 carbon atoms, and the rest are hydrogen atoms.
  • the diester compound represented by formula (6) includes a diester compound in which both Q are acyl groups, a monoester compound in which one is an acyl group and the other is a hydrogen atom, and a monoester compound in which both are hydrogen atoms. It is selected from functional phenolic compounds and may be a diester or monoester compound or a mixture comprising diester and/or monoester compounds.
  • the diester compound is preferably a diester compound in which both Q are acyl groups or a diester compound (mixture) as a main component (50 mol % or more). As the amount of monoester compound and bifunctional phenol compound increases, the acylation rate decreases.
  • the phenylene group and biphenylene group, or the naphthylene group and biphenylene group are more preferably 10 mol%. Above, more preferably 20 mol % or more, particularly preferably 40 mol % or more.
  • the modified epoxy resin of the present invention necessarily contains a phenylene group and a biphenylene group, or a naphthylene group and a biphenylene group. It may be contained in either the functional epoxy resin and/or the diester compound represented by formula (6), and the proportion thereof is not limited.
  • the bifunctional epoxy resin used in the production method (A) of the present invention is an epoxy resin represented by the above formula (5). and an epoxy resin obtained by reacting in the presence of an alkali metal compound.
  • X 1 is the same as X 1 in formula (5) above.
  • Epihalohydrin includes, for example, epichlorohydrin and epibromohydrin.
  • alkali metal compounds include alkali metal hydroxides such as sodium hydroxide, lithium hydroxide and potassium hydroxide; alkali metal salts such as sodium carbonate, sodium bicarbonate, sodium chloride, lithium chloride and potassium chloride;
  • alkali metal alkoxides such as sodium methoxide and sodium ethoxide, alkali metal salts of organic acids such as sodium acetate and sodium stearate, alkali metal phenoxides, sodium hydride and lithium hydride.
  • the molar amount is 0.80 to 1.20 times, preferably 0.85 to 1.05 times the functional group in the bifunctional phenol compound.
  • a mole of alkali metal compound is used. If it is less than this, the amount of residual hydrolyzable chlorine may increase.
  • Alkali metal compounds are used in the form of aqueous solutions, alcoholic solutions or solids.
  • epihalohydrin is used with respect to the bifunctional phenol compound.
  • epihalohydrin is used in an amount of 1.5 to 15 times mol, preferably 2 to 10 times mol, more preferably 5 to 8 times mol, per 1 mol of the functional group in the bifunctional phenol compound. If it is more than this, the production efficiency will be lowered, and if it is less than this, the amount of high molecular weight epoxy resin produced will increase, and it may not be suitable as a raw material.
  • the epoxidation reaction is usually carried out at a temperature of 120°C or less. If the temperature is high during the reaction, the amount of so-called hardly hydrolyzable chlorine may increase, making it difficult to achieve a high degree of purification.
  • the temperature is preferably 100° C. or lower, more preferably 85° C. or lower.
  • m is usually greater than 0.
  • the epoxy resin produced by a known method is highly purified by techniques such as distillation and crystallization, or the bifunctional phenol compound is allylated and then the olefin portion is oxidized. There is a method to epoxidize with
  • the diester compound of formula (6) used in the production method (A) of the present invention is, for example, the above bifunctional phenol compound, an acid anhydride of an organic acid, a halide of an organic acid, or a compound with an organic acid. It is obtained by acylation in a condensation reaction.
  • the amounts of the bifunctional epoxy resin and the diester compound of formula (6) to be used need to be appropriately changed depending on the epoxy equivalent weight of the desired modified epoxy resin.
  • the total amount of hydroxyl groups is preferably 0.3 to 1.0 equivalents. With this equivalent ratio, it becomes easier to proceed with the increase in molecular weight while having an epoxy group at the molecular terminal. It is also possible to replace part of the diester compound of formula (6) with the above bifunctional phenol compound. Accordingly, as described above, the physical properties can be finely adjusted by allowing an appropriate amount of secondary hydroxyl groups to exist in the modified epoxy resin of the present invention. In the production method (A), a polymerization reaction and an esterification reaction of secondary hydroxyl groups occur to increase Mw and produce a modified epoxy resin.
  • a catalyst may be used, and any catalyst may be used as long as it has a catalytic ability to promote the reaction between the epoxy group and the ester group.
  • examples thereof include tertiary amines, cyclic amines, imidazole compounds, organophosphorus compounds, quaternary ammonium salts and the like.
  • these catalysts may be used alone or in combination of two or more.
  • cyclic amines examples include 1,4-diazabicyclo[2,2,2]octane (DABCO), 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), 1,5-diazabicyclo[ 4,3,0]nonene-5 (DBN), N-methylmorpholine, pyridine, N,N-dimethylaminopyridine (DMAP) and the like.
  • DABCO 1,4-diazabicyclo[2,2,2]octane
  • DBU 1,8-diazabicyclo[5,4,0]undecene-7
  • DBN 1,5-diazabicyclo[ 4,3,0]nonene-5
  • N-methylmorpholine pyridine
  • DMAP N,N-dimethylaminopyridine
  • organic phosphorus compounds include tri-n-propylphosphine, tri-n-butylphosphine, diphenylmethylphosphine, triphenylphosphine, tris(p-tolyl)phosphine, tricyclohexylphosphine, tri(t-butyl)phosphine, Phosphines such as tris(p-methoxyphenyl)phosphine, paramethylphosphine, 1,2-bis(dimethylphosphino)ethane, 1,4-bis(diphenylphosphino)butane, tetramethylphosphonium bromide, tetramethylphosphonium Iodide, tetramethylphosphonium hydroxide, tetrabutylphosphonium hydroxide, trimethylcyclohexylphosphonium chloride, trimethylcyclohexylphosphonium bromide, trimethylbenzylphosphonium chloride, trimethylbenzylphosphonium bro
  • quaternary ammonium salts include tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium hydroxide, triethylmethylammonium chloride, tetraethylammonium chloride, tetraethylammonium bromide, tetraethylammonium iodide, tetrapropylammonium bromide, tetramethylammonium bromide, propylammonium hydroxide, tetrabutylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium iodide, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium hydroxide, benzyltributylammonium chloride, phenyltrimethylammonium chloride and the like. .
  • a solvent for the reaction may be used, and any solvent that dissolves the modified epoxy resin may be used.
  • any solvent that dissolves the modified epoxy resin may be used. Examples thereof include aromatic solvents, ketone solvents, amide solvents, glycol ether solvents, ester solvents and the like. Also, these solvents may be used alone or in combination of two or more.
  • aromatic solvents examples include benzene, toluene, and xylene.
  • Ketone solvents include, for example, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, 2-heptanone, 4-heptanone, 2-octanone, cyclohexanone, acetylacetone, dioxane, diisobutyl ketone, isophorone, methylcyclohexanone, acetophenone, and the like. be done.
  • amide solvents include formamide, N-methylformamide, N,N-dimethylformamide (DMF), acetamide, N-methylacetamide, N,N-dimethylacetamide, 2-pyrrolidone, N-methylpyrrolidone and the like. be done.
  • glycol ether solvents include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether and ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether and diethylene glycol mono-n.
  • Diethylene glycol monoalkyl ethers such as butyl ether, propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol Ethylene glycol dialkyl ethers such as dibutyl ether, polyethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol dibutyl ether, and propylene glycol dimethyl ether , propylene glycol diethyl ether, propylene glycol dibutyl ether and other propylene glycol dialkyl ethers, dipropylene glycol dimethyl ether, dipropylene
  • ester solvents include methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, benzyl acetate, ethyl propionate, ethyl butyrate, butyl butyrate, valerolactone and butyrolactone.
  • solvents include, for example, dimethylsulfoxide, sulfolane, N-methyl-2-pyrrolidone, and the like.
  • the solid content concentration during the reaction is preferably 35 to 95% by mass. More preferably 50 to 90% by mass, still more preferably 70 to 90% by mass. If a highly viscous product is produced during the reaction, additional solvent may be added to continue the reaction. After completion of the reaction, the solvent can be removed or added as necessary.
  • the reaction temperature is within a temperature range that does not decompose the catalyst used. If the reaction temperature is too high, the catalyst may decompose to stop the reaction, or the resulting modified epoxy resin may deteriorate. If the reaction temperature is too low, the reaction may not proceed sufficiently and the desired molecular weight may not be obtained. Therefore, the reaction temperature is preferably 50 to 230°C, more preferably 120 to 200°C.
  • the reaction time is usually 1 to 12 hours, preferably 3 to 10 hours.
  • the reaction temperature can be ensured by using an autoclave to carry out the reaction under high pressure. When the heat of reaction needs to be removed, it is usually carried out by evaporation/condensation/reflux of the solvent used by the heat of reaction, indirect cooling, or a combination thereof.
  • the production method (B) of the present invention comprises the epoxy resin (a) represented by the formula (7) and an acid component (acyl agent), preferably, 0.05 mol or more and 2.0 mol or less of the acid anhydride represented by the formula (8) is reacted with 1 mol of the alcoholic hydroxyl equivalent of the epoxy resin. , an epoxy equivalent of 250 to 50,000 g/eq.
  • This is a method for obtaining the modified epoxy resin represented by the formula (1), that is, the modified epoxy resin of the present invention.
  • the raw material epoxy resin (a) represented by formula (7) essentially contains a phenylene group and a biphenylene group, or a naphthylene group and a biphenylene group in X in the above formula (7).
  • n in Equation (7) is the number of repetitions and the average value. Its value ranges from 1 to 500. From the viewpoint of fluidity and handleability, it is preferably 1 or more and 400 or less, more preferably 1 or more and 300 or less.
  • the n number can be calculated from the number average molecular weight (Mn) obtained by the GPC method.
  • This epoxy resin (a) can be obtained by a conventionally known method.
  • bifunctional phenol compound (a) For example, it is produced by reacting a bifunctional phenol compound having a phenylene group and a biphenylene group or a naphthylene group and a biphenylene group (sometimes referred to as a "bifunctional phenol compound (a)") with epihalohydrin in the presence of an alkali metal compound. (hereinafter referred to as "one-step method”), or a bifunctional epoxy resin and a bifunctional epoxy resin having a phenylene group and a biphenylene group, or a naphthylene group and a biphenylene group in at least one of the bifunctional epoxy resin and the bifunctional phenol compound. and a phenol compound in the presence of a catalyst (hereinafter referred to as "two-step method”).
  • the epoxy resin (a) may be obtained by any manufacturing method.
  • the molar ratio of epihalohydrin and the bifunctional phenol compound charged in the one-step method and the molar ratio of the bifunctional epoxy resin and the bifunctional phenol compound charged in the two-step method are appropriately adjusted. By doing so, it is possible to manufacture products within the desired range.
  • Bifunctional phenol compounds (a) used in the production of the one-step and two-step methods include, for example, hydroquinone and 4,4'-dihydroxybiphenyl, or 1,6'-dihydroxynaphthalene and 4,4'-dihydroxybiphenyl etc.
  • bifunctional phenol compounds may be used in combination as long as the object of the present invention is not impaired.
  • Bifunctional phenol compounds that may be used in combination include, for example, bisphenols such as bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol E, bisphenol C, bisphenolacetophenone, bisphenolfluorene, dihydroxybiphenyl ether, and dihydroxybiphenylthioether; Biphenols such as 4,4'-biphenol and 2,4'-biphenol, dihydroxynaphthalene, hydroquinone, catechol, resorcin, 1,1-bi-2-naphthol, 10-(2,5-dihydroxyphenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ), 10-(2,7-dihydroxynaphthyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene- 10-oxide (DOPO-N
  • the one-stage method will be described.
  • the bifunctional phenol compound (a) and epihalohydrin are reacted in the presence of an alkali metal compound in a non-reactive solvent to consume the epihalohydrin and conduct a condensation reaction to form the epoxy resin (a).
  • an alkali metal compound in a non-reactive solvent to consume the epihalohydrin and conduct a condensation reaction to form the epoxy resin (a).
  • the alkali metal compound include those similar to those used in the production of the bifunctional epoxy resin represented by the above formula (5) used in the production method (A) of the present invention.
  • the weight-average molecular weight and epoxy equivalent of the epoxy resin (a) can be set within the desired range by appropriately adjusting the charged molar ratio of the bifunctional phenol compound and the epihalohydrin.
  • the weight average molecular weight of the epoxy resin (a) is 10,000 or more
  • epihalohydrin is added in an amount of 0.985 to 1.015 mol, preferably 0.99 mol, per 1 mol of the bifunctional phenol compound (a). It may be adjusted to ⁇ 1.012 mol, more preferably 0.995 to 1.01 mol.
  • the epoxy equivalent of the epoxy resin (a) was set to 5,000 g/eq.
  • epihalohydrin may be adjusted to 1.015 to 8 mol, preferably 1.05 to 6 mol, more preferably 1.1 to 5 mol, per 1 mol of the bifunctional phenol compound (a). .
  • the number of moles of the bifunctional phenol compound (a) used as a raw material is preferably 1 mol% or more, more preferably 10 mol% or more, still more preferably 20 mol% or more, and 40 mol% of all the bifunctional phenol compounds.
  • the above are particularly preferred. Outside this range, the modified epoxy resin of the present invention may have poor heat resistance.
  • the reaction temperature is usually preferably from 20 to 200°C, more preferably from 30 to 170°C, even more preferably from 40 to 150°C, particularly preferably from 50 to 100°C, when the reaction is carried out under normal pressure.
  • the temperature is preferably 20 to 100°C, more preferably 30 to 90°C, even more preferably 35 to 80°C. If the reaction temperature is within this range, side reactions are less likely to occur and the reaction is likely to proceed.
  • the reaction pressure is usually normal pressure. When the heat of reaction needs to be removed, it is usually carried out by evaporation/condensation/reflux of the solvent used, indirect cooling, or a combination thereof.
  • alcohols such as ethanol, isopropyl alcohol, and butyl alcohol can be used in addition to the reaction solvents exemplified in the production method (A) of the present invention. Only one type may be used, or two or more types may be used in combination.
  • the two-step method As the bifunctional epoxy resin used as the raw material epoxy resin for the two-step method, the same bifunctional epoxy resin represented by the above formula (5) used in the production method (A) of the present invention is used.
  • the bifunctional epoxy resin represented by the above formula (5) is preferable as the bifunctional epoxy resin used as the raw material of the two-step method, but other bifunctional epoxy resins may be used in combination as long as the object of the present invention is not impaired.
  • Examples of bifunctional epoxy resins that can be used in combination include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol acetophenone type epoxy resin, diphenyl sulfide type epoxy resin, and diphenyl ether type epoxy resin.
  • epoxy resins biphenol-type epoxy resins, diphenyldicyclopentadiene-type epoxy resins, alkylene glycol-type epoxy resins, aliphatic cyclic epoxy resins, and the like. These epoxy resins may be substituted with substituents having no adverse effects, such as alkyl groups and aryl groups. These epoxy resins may be used in combination of multiple types.
  • a catalyst can be used, and any compound can be used as long as it has a catalytic ability to promote the reaction between the epoxy group and the phenolic hydroxyl group.
  • the same catalyst as exemplified in the production method (A) of the present invention can be used.
  • Alkali metal compounds used in the production of bifunctional epoxy resins represented by the above formula (5) can also be used. These catalysts may be used alone or in combination of two or more. Also, the amount used is the same as the amount used as an example in the production method (A) of the present invention.
  • a solvent may be used, and any solvent may be used as long as it dissolves the epoxy resin and does not adversely affect the reaction.
  • any solvent may be used as long as it dissolves the epoxy resin and does not adversely affect the reaction.
  • examples thereof include the same solvents as those exemplified in the production method (A) of the present invention. These solvents may be used alone or in combination of two or more.
  • the amount of the solvent to be used can be appropriately selected according to the reaction conditions.
  • the solid content concentration is preferably 35 to 95% by mass.
  • the solvent can be added during the reaction to continue the reaction. After completion of the reaction, the solvent can be removed by distillation or the like, if necessary, or can be further added.
  • the reaction temperature is within a temperature range that does not decompose the catalyst used. If the reaction temperature is too high, the catalyst may decompose to stop the reaction, or the resulting epoxy resin may deteriorate. If the reaction temperature is too low, the reaction may not proceed sufficiently and the desired molecular weight may not be obtained. Therefore, the reaction temperature is preferably 50 to 230°C, more preferably 100 to 210°C, even more preferably 120 to 200°C.
  • the reaction time is usually 1 to 12 hours, preferably 3 to 10 hours.
  • the reaction temperature can be ensured by using an autoclave to carry out the reaction under high pressure. When the heat of reaction needs to be removed, it is usually carried out by evaporation/condensation/reflux of the solvent used by the heat of reaction, indirect cooling, or a combination thereof.
  • the modified epoxy resin of the present invention is obtained by acylating the hydroxyl groups in the epoxy resin (a) represented by the above formula (7) thus obtained.
  • Acylation may be performed not only by direct esterification, but also by methods such as transesterification.
  • Examples of acid components used for the acylation include acetic acid, propionic acid, butyric acid, isobutyric acid, pentanoic acid, octanoic acid, caprylic acid, lauric acid, stearic acid, oleic acid, benzoic acid, t-butylbenzoic acid, Organic acids such as hexahydrobenzoic acid, phenoxyacetic acid, acrylic acid and methacrylic acid, acid anhydrides of organic acids, halides of organic acids, esters of organic acids, and the like can be used. Among these, acid anhydrides of organic acids are preferred.
  • Acid anhydrides of organic acids include, for example, acetic anhydride, benzoic anhydride, and phenoxyacetic anhydride.
  • esterified organic acids include methyl acetate, ethyl acetate, butyl acetate, methyl benzoate, and ethyl benzoate.
  • Halides of organic acids include, for example, acetic acid chloride, benzoic acid chloride, phenoxyacetic acid chloride and the like.
  • Compounds used for esterification include halides of organic acids such as acetic acid chloride, benzoic acid chloride and phenoxyacetic acid chloride, acid halides such as acetic anhydride, benzoic acid anhydride and phenoxyacetic acid anhydride, and acid anhydrides of organic acids.
  • Acid anhydrides such as acetic anhydride and benzoic anhydride are more preferable in the sense that washing with water after esterification is not required and contamination of halogen, which is disliked in electronic materials, is avoided.
  • the epoxy resin (a) is reacted with an acid component such as the above organic acid, an acid anhydride of an organic acid, a halide of an organic acid, or an esterified product of an organic acid used for esterifying the hydroxyl group of the epoxy resin (a).
  • the charging ratio at the time may be the same charging ratio as the target esterification ratio, or if the reactivity is low, the acid component is charged in excess with respect to the hydroxyl groups, reacted to the target esterification ratio, and then The acid component of the reaction may be removed.
  • acid catalysts such as p-toluenesulfonic acid and phosphoric acid
  • various esters such as metal catalysts such as tetraisopropyl titanate, tetrabutyl titanate, dibutyltin oxide, dioctyltin oxide, and zinc chloride.
  • metal catalysts such as tetraisopropyl titanate, tetrabutyl titanate, dibutyltin oxide, dioctyltin oxide, and zinc chloride.
  • the temperature is preferably 100 to 250°C, more preferably 130 to 230°C, in a nitrogen atmosphere.
  • the resulting acid can be removed by filtering the salt after neutralization using a basic compound, or by washing with water after neutralization using a basic compound.
  • a method of washing with water without neutralization, or a method of removing by distillation, adsorption, or the like may be used, or both methods may be used.
  • removing an acid having a boiling point lower than that of the reaction solvent it is preferably removed by distillation.
  • esterification catalysts such as organometallic catalysts such as antimony, acid catalysts such as hydrochloric acid, sulfuric acid, phosphoric acid and sulfonic acid, and basic catalysts such as lithium hydroxide and sodium hydroxide.
  • a reaction solvent may be used, and any solvent that dissolves the epoxy resin may be used.
  • any solvent that dissolves the epoxy resin may be used.
  • examples thereof include the solvents exemplified in the production method (A) of the present invention. These solvents may be the same as those used in the preparation of the epoxy resin (a), or may be different. Moreover, you may use only 1 type and may use it in combination of 2 or more types.
  • the solid content concentration during the reaction is also the same as in production method (A), preferably 35 to 95% by mass, more preferably 50 to 90% by mass, still more preferably 70 to 90% by mass.
  • the resin composition of the present invention is a resin composition containing at least the modified epoxy resin of the present invention and a curing agent.
  • various additives such as epoxy resins, inorganic fillers, coupling agents, antioxidants, and the like can be appropriately blended into the resin composition of the present invention, if necessary.
  • the resin composition of the present invention provides a cured product that satisfactorily satisfies various physical properties required for various uses.
  • a resin composition can be prepared by blending a curing agent with the modified epoxy resin of the present invention.
  • the curing agent refers to a substance that contributes to the cross-linking reaction and/or chain extension reaction with the modified epoxy resin.
  • a substance is usually called a "curing accelerator", it is regarded as a curing agent as long as it contributes to the cross-linking reaction and/or chain lengthening reaction of the modified epoxy resin.
  • the content of the curing agent in the resin composition of the present invention is preferably 0.1 to 100 parts by mass in terms of solid content with respect to 100 parts by mass of the solid content of the modified epoxy resin of the present invention. Further, it is more preferably 0.5 to 80 parts by mass, and still more preferably 1 to 50 parts by mass. In addition, in a resin composition, it is the amount of a non volatile matter (solid content).
  • solid content means components excluding solvent, and includes not only solid modified epoxy resins and other epoxy resins, but also semi-solid and viscous liquid substances.
  • the curing agent used in the resin composition of the present invention is not particularly limited, and all those generally known as epoxy resin curing agents can be used. Phenolic resins, amide-based compounds, imidazole-based compounds, and active ester-based curing agents are preferred from the viewpoint of enhancing heat resistance. These curing agents may be used alone or in combination of two or more.
  • phenol resins include bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, 1,4-bis(4-hydroxyphenoxy)benzene, 1,3-bis(4- hydroxyphenoxy)benzene, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10- (2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolak, p-cresol novolak, xylenol novolak, poly-p-hydroxystyrene, hydroquinone, resorcino
  • amide-based compounds include dicyandiamide and its derivatives, and polyamide resins.
  • imidazole compounds include 2-phenylimidazole, 2-ethyl-4(5)-methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenyl imidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4 -diamino-6-[2′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-ethyl-4′-methylimidazolyl-(1′)]- ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')
  • Active ester-based curing agents include, for example, phenol esters, thiophenol esters, N-hydroxyamine esters, esters of heterocyclic hydroxy compounds, and the like, which have two or more highly reactive ester groups per molecule. Compounds are preferred, and phenol esters obtained by reacting a carboxylic acid compound with an aromatic compound having a phenolic hydroxyl group are more preferred. Specific examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.
  • aromatic compounds having a phenolic hydroxyl group examples include catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucine, benzenetriol, dicyclopentadienyl diphenol, phenol novolak, and the like.
  • the resin composition of the present invention can contain epoxy resins other than the modified epoxy resin of the present invention. By using other epoxy resins, it is possible to compensate for insufficient physical properties and improve various physical properties.
  • the epoxy resin preferably has two or more epoxy groups in the molecule, more preferably three or more epoxy groups. Examples thereof include polyglycidyl ether compounds, polyglycidylamine compounds, polyglycidyl ester compounds, alicyclic epoxy compounds, and other modified epoxy resins. These epoxy resins may be used alone, or two or more of the same epoxy resins may be used in combination, or different epoxy resins may be used in combination.
  • polyglycidyl ether compounds include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, bisphenol Z type epoxy resin, bisphenol fluorene type epoxy resin, and diphenyl sulfide type epoxy resin.
  • diphenyl ether type epoxy resin diphenyl ether type epoxy resin, naphthalene type epoxy resin, hydroquinone type epoxy resin, resorcinol type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, alkyl novolak type epoxy resin, styrenated phenol novolak type epoxy resin, bisphenol novolak type epoxy resins, naphthol novolak type epoxy resins, phenol aralkyl type epoxy resins, ⁇ -naphthol aralkyl type epoxy resins, naphthalenediol aralkyl type epoxy resins, ⁇ -naphthol aralkyl type epoxy resins, biphenyl aralkyl phenol type epoxy resins, biphenyl type epoxy resins, biphenyl type epoxy resins, Various epoxy resins such as triphenylmethane type epoxy resin, dicyclopentadiene type epoxy resin, alkylene glycol type epoxy resin, and
  • polyglycidylamine compounds include diaminodiphenylmethane-type epoxy resins, meta-xylenediamine-type epoxy resins, 1,3-bisaminomethylcyclohexane-type epoxy resins, isocyanurate-type epoxy resins, aniline-type epoxy resins, hydantoin-type epoxy resins, Aminophenol-type epoxy resins and the like are included.
  • polyglycidyl ester compounds include dimer acid type epoxy resins, hexahydrophthalic acid type epoxy resins, and trimellitic acid type epoxy resins.
  • Alicyclic epoxy compounds include aliphatic cyclic epoxy resins such as Celoxide 2021 (manufactured by Daicel Chemical Industries, Ltd.).
  • modified epoxy resins include, for example, urethane-modified epoxy resins, oxazolidone ring-containing epoxy resins, epoxy-modified polybutadiene rubber derivatives, carboxyl group-terminated butadiene nitrile rubber (CTBN)-modified epoxy resins, polyvinylarene polyoxides (e.g., divinylbenzene di oxide, trivinylnaphthalene trioxide, etc.), phenoxy resins, and the like.
  • CBN butadiene nitrile rubber
  • the amount of the modified epoxy resin in the total components of the modified epoxy resin and the epoxy resin as a solid content is preferably It is 1 to 99% by mass, more preferably 50% by mass or more, and still more preferably 80% by mass or more.
  • the above-mentioned curing agent is added in an amount of 0.5 parts by weight as a solid content to a total of 100 parts by mass of the solid content of the modified epoxy resin and the other epoxy resins. It preferably contains 1 to 100 parts by mass, more preferably 0.5 to 80 parts by mass, and still more preferably 1 to 50 parts by mass.
  • a solvent or reactive diluent may be added to the resin composition of the present invention in order to appropriately adjust the viscosity of the resin composition during handling during coating film formation.
  • the solvent or reactive diluent is used to ensure handleability and workability in molding the resin composition, and there is no particular limitation on the amount used.
  • the term “solvent” and the above-mentioned “solvent” are used separately depending on the mode of use, but the same type or different types may be used independently.
  • Examples of the solvent that the resin composition of the present invention may contain include ketones such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone and cyclohexanone, esters such as ethyl acetate, ethers such as ethylene glycol monomethyl ether, N, Examples include amides such as N-dimethylformamide and N,N-dimethylacetamide, alcohols such as methanol and ethanol, alkanes such as hexane and cyclohexane, and aromatics such as toluene and xylene.
  • the solvents listed above may be used alone, or two or more of them may be mixed and used in any combination and ratio.
  • reactive diluents include monofunctional glycidyl ethers such as allyl glycidyl ether, bifunctional glycidyl ethers such as propylene glycol diglycidyl ether, polyfunctional glycidyl ethers such as trimethylolpropane polyglycidyl ether, and glycidyl esters. , and glycidylamines.
  • solvents or reactive diluents are preferably used at a non-volatile content of 90% by mass or less, and the appropriate type and amount to be used are appropriately selected depending on the application.
  • a polar solvent having a boiling point of 160° C. or less such as methyl ethyl ketone, acetone, or 1-methoxy-2-propanol, is preferred, and the amount used is preferably 40 to 80% by mass in terms of non-volatile matter.
  • ketones for adhesive film applications, for example, it is preferable to use ketones, acetic esters, carbitols, aromatic hydrocarbons, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc., and the amount used is nonvolatile is preferably 30 to 60% by mass.
  • a curing accelerator or catalyst may be used in the resin composition of the present invention, if necessary.
  • curing accelerators or catalysts include imidazole compounds, tertiary amines, phosphorus compounds such as phosphines, metal compounds, Lewis acids, and amine complex salts. These may be used alone or in combination of two or more.
  • the amount of the curing accelerator or catalyst to be blended may be appropriately selected according to the purpose of use. be done. It is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 8 parts by mass, still more preferably 0.1 to 5 parts by mass, and particularly preferably 0.1 to 1.0 parts by mass.
  • the curing temperature can be lowered and the curing time can be shortened.
  • various known flame retardants can be used for the purpose of improving the flame retardancy of the cured product to the extent that the reliability is not lowered.
  • Usable flame retardants include, for example, halogen flame retardants, phosphorus flame retardants, nitrogen flame retardants, silicone flame retardants, inorganic flame retardants, and organic metal salt flame retardants. From an environmental point of view, halogen-free flame retardants are preferred, and phosphorus-based flame retardants are particularly preferred. These flame retardants may be used alone, or two or more flame retardants of the same type may be used in combination, or flame retardants of different types may be used in combination.
  • the resin composition of the present invention may contain components other than those listed above (which may be referred to as "other components" in the present invention) for the purpose of further improving its functionality.
  • Such other components include fillers, thermoplastic resins, thermosetting resins, photocurable resins, UV inhibitors, antioxidants, coupling agents, plasticizers, fluxes, thixotropic agents, and smoothing agents. , coloring agents, pigments, dispersants, emulsifiers, elasticity reducing agents, release agents, antifoaming agents, ion trapping agents and the like.
  • fillers include fused silica, crystalline silica, alumina, silicon nitride, boron nitride, aluminum nitride, aluminum hydroxide, calcium hydroxide, magnesium hydroxide, boehmite, talc, mica, clay, calcium carbonate, magnesium carbonate, Barium carbonate, zinc oxide, titanium oxide, magnesium oxide, magnesium silicate, calcium silicate, zirconium silicate, barium sulfate, inorganic fillers such as carbon, carbon fiber, glass fiber, alumina fiber, silica alumina fiber, silicon carbide
  • fibrous fillers such as fibers, polyester fibers, cellulose fibers, aramid fibers and ceramic fibers, and fine particle rubbers.
  • thermoplastic resin other than the modified epoxy resin of the present invention may be used in combination with the resin composition of the present invention.
  • thermoplastic resins include modified epoxy resins other than the present invention, phenoxy resins, polyurethane resins, polyester resins, polyethylene resins, polypropylene resins, polystyrene resins, ABS resins, AS resins, vinyl chloride resins, polyvinyl acetate resins, polyvinyl Methyl methacrylate resin, polycarbonate resin, polyacetal resin, cyclic polyolefin resin, polyamide resin, thermoplastic polyimide resin, polyamideimide resin, polytetrafluoroethylene resin, polyetherimide resin, polyphenylene ether resin, modified polyphenylene ether resin, polyether sulfone resins, polysulfone resins, polyetheretherketone resins, polyphenylene sulfide resins, polyvinyl formal resins, and the like. Modified epoxy resins and phenoxy resins other than those
  • ingredients include organic pigments such as quinacridone-based, azo-based, and phthalocyanine-based pigments, inorganic pigments such as titanium oxide, metal foil-like pigments, and rust-preventive pigments, and ultraviolet-absorbing pigments such as hindered amine-based, benzotriazole-based, and benzophenone-based pigments.
  • antioxidants such as hindered phenol, phosphorus, sulfur, and hydrazide
  • release agents such as stearic acid, palmitic acid, zinc stearate, and calcium stearate; leveling agents; rheology control agents; and additives such as anti-cratering agents, anti-foaming agents, and the like.
  • each known component can be used without limitation.
  • the blending amount of these other components is preferably in the range of 0.01 to 20% by mass based on the total solid content in the resin composition.
  • the resin composition of the present invention is obtained by uniformly mixing the above components.
  • a resin composition containing a modified epoxy resin, a curing agent, and optionally various components can be easily cured by a conventionally known method.
  • This cured product has an excellent balance of low hygroscopicity, dielectric properties, heat resistance, adhesion, etc., and exhibits good cured physical properties.
  • the term "curing" as used herein means intentionally curing the resin composition with heat and/or light, and the degree of curing may be controlled according to desired physical properties and applications.
  • the degree of progress may be complete curing or semi-curing, and is not particularly limited, but the reaction rate of the curing reaction between the epoxy group and the curing agent is usually 5 to 95%.
  • a cured product can be obtained from the resin composition of the present invention by curing in the same manner as for known epoxy resin compositions.
  • a method for obtaining a cured product the same methods as those for known epoxy resin compositions can be used, such as casting, injection, potting, dipping, drip coating, transfer molding, compression molding, resin sheets, resins, etc.
  • a method of forming a laminated plate by laminating a laminated copper foil, prepreg, or the like and curing under heat and pressure is preferably used.
  • the curing temperature at that time is usually in the range of 80 to 300° C., and the curing time is usually about 10 to 360 minutes. This heating is preferably performed in a two-step process of primary heating at 80 to 180° C.
  • the sheet-shaped substrate inorganic fibers such as glass, and woven or non-woven fabrics of organic fibers such as polyester, polyamine, polyacryl, polyimide, Kevlar, cellulose, etc. can be used, but are not limited thereto. do not have.
  • the method for producing a prepreg from the resin composition and base material of the present invention is not particularly limited. After impregnation, the resin composition is semi-cured (to B-stage) by heating and drying. For example, it can be heated and dried at 100 to 200° C. for 1 to 40 minutes.
  • the amount of the resin composition in the prepreg is preferably 30 to 80% by mass.
  • a method of manufacturing a laminate using prepregs and insulating adhesive sheets will be described.
  • one or more prepregs are laminated, metal foil is placed on one side or both sides to form a laminate, and this laminate is heated and pressed to be laminated and integrated. do.
  • the metal foil copper, aluminum, brass, nickel, or the like can be used alone, as an alloy, or as a composite metal foil.
  • the conditions for heating and pressurizing the laminate may be appropriately adjusted so as to cure the resin composition, but if the pressure applied is too low, air bubbles will remain inside the resulting laminate. However, since the electrical characteristics may deteriorate, it is desirable to apply pressure under conditions that satisfy moldability.
  • the temperature can be set to 160 to 220° C., the pressure to 49 to 490 N/cm 2 (5 to 50 kgf/cm 2 ), and the heating time to 40 to 240 minutes.
  • a multi-layer board can be produced by using the single-layer laminate board thus obtained as an inner layer material.
  • a circuit is formed on the laminate by an additive method, a subtractive method, or the like, and the surface of the formed circuit is treated with an acid solution for blackening to obtain an inner layer material.
  • An insulating layer is formed on one or both sides of the inner layer material with a prepreg or an insulating adhesive sheet, and a conductor layer is formed on the surface of the insulating layer to form a multilayer board.
  • the insulating adhesive sheet is used to form the insulating layer
  • the insulating adhesive sheet is arranged on the circuit-forming surface of a plurality of inner layer materials to form a laminate.
  • a laminate is formed by placing an insulating adhesive sheet between the circuit forming surface of the inner layer material and the metal foil. Then, this laminate is heated and pressurized for integral molding, thereby forming a cured product of the insulating adhesive sheet as an insulating layer and forming a multi-layered inner layer material.
  • the inner layer material and the metal foil which is the conductor layer, are formed as an insulating layer by curing an insulating adhesive sheet.
  • the metal foil the same one as that used for the laminate used as the inner layer material can be used.
  • the heat and pressure molding can be performed under the same conditions as the molding of the inner layer material.
  • the above resin composition is preferably applied to a thickness of 5 to 100 ⁇ m for the circuit forming surface resin of the outermost layer of the inner layer material, and then the thickness is 100 to 200 ⁇ m. It is dried by heating at °C for 1 to 90 minutes to form a sheet. It is formed by a method generally called a casting method. It is desirable that the thickness after drying is 5 to 80 ⁇ m.
  • a printed wiring board can be formed by forming via holes and circuits on the surface of the multilayer laminate thus formed by an additive method or a subtractive method. Furthermore, by repeating the above-described method using this printed wiring board as an inner layer material, a laminate having more layers can be formed.
  • the insulating layer with prepreg When forming the insulating layer with prepreg, one or more prepreg layers are placed on the circuit forming surface of the inner layer material, and a metal foil is placed on the outer side to form a laminate. . By heating and pressurizing this laminate to integrally mold it, the cured prepreg is formed as an insulating layer, and the metal foil on the outside thereof is formed as a conductor layer.
  • the metal foil the same one as that used for the laminate used as the inner layer material can also be used. Further, the heat and pressure molding can be performed under the same conditions as the molding of the inner layer material.
  • a printed wiring board can be molded by forming via holes and circuits on the surface of the multilayer laminate thus molded by an additive method or a subtractive method. Further, by repeating the above-described method using this printed wiring board as an inner layer material, a multilayer board having more layers can be formed.
  • the cured product and laminate for electrical/electronic circuits obtained from the resin composition of the present invention have excellent dielectric properties and thermal conductivity.
  • Weight average molecular weight (Mw) and number average molecular weight (Mn) Obtained by GPC measurement. Specifically, a column (TSKgel SuperH-H, SuperH2000, SuperHM-H, SuperHM-H, manufactured by Tosoh Corporation) is used in series with the main body HLC8320GPC (manufactured by Tosoh Corporation), and the column temperature is The temperature was brought to 40°C. Tetrahydrofuran (THF) was used as an eluent at a flow rate of 1.0 mL/min, and a differential refractive index detector was used as a detector.
  • THF Tetrahydrofuran
  • non-volatile content solid content
  • Dielectric properties Film-like samples were measured by the cavity resonator perturbation method, and plate-like samples were measured by the capacitance method. Examples 1 to 6, 8 to 16 and Comparative Examples 1 to 4 were evaluated by the dielectric loss tangent measured at 1 GHz by the cavity resonator perturbation method. Specifically, using a PNA network analyzer N5230A (manufactured by Agilent Technologies) and a cavity resonator CP431 (manufactured by Kanto Denshi Applied Development Co., Ltd.), the width The measurement was performed using a test piece of 1.5 mm ⁇ 80 mm length ⁇ 150 ⁇ m thickness.
  • Examples 17-18 and Comparative Examples 5-6 were evaluated by the dielectric loss tangent measured at 1 GHz by the capacitance method. Specifically, in accordance with the IPC-TM-650 2.5.5.9 standard, using a material analyzer (manufactured by AGILENT Technologies), under a measurement environment of room temperature 23 ° C. and humidity 50% RH, 30 mm square ⁇ Measurements were carried out using 1 mm thick specimens.
  • a material analyzer manufactured by AGILENT Technologies
  • E1 acetic anhydride (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
  • E2 Benzoic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.)
  • Synthesis example 2 100 parts of bifunctional phenol compound C3, 128 parts of acid anhydride E1, and 99 parts of pyridine are added to a glass reaction vessel equipped with a stirring device, thermometer, nitrogen gas introduction device, cooling tube, and dropping device at room temperature. The temperature was raised to 60° C. while stirring while flowing nitrogen gas, and the reaction was carried out for 2 hours. After that, it was dried under reduced pressure for 2 hours at 150° C. and 1.3 kPa (10 torr) to obtain 153 parts of a diester compound B2.
  • Examples 2-9, Comparative Examples 1-2 A resin varnish was obtained in the same manner as in Example 1 according to the amount (parts) of each raw material charged and the reaction time shown in Table 1.
  • the "molar ratio" in the table represents the molar ratio of the bifunctional epoxy resin to the diester compound and the bifunctional phenol compound.
  • Example 10 100 parts of the resin varnish (HR1) obtained in Comparative Example 1 (40 parts in terms of solid content) and 600 parts of the reaction solvent S1 were blended, heated to 100° C., and 4 parts of the acid anhydride E1 were added for 4 hours. reacted. The resulting resin varnish was added to methanol, and the precipitated insoluble matter was filtered off, and the filtrate was dried in a vacuum dryer under conditions of 150° C. and 0.4 kPa (3 torr) for 1 hour to obtain a modified epoxy resin. rice field. 21 parts of diluting solvent S1 and 42 parts of S2 were added to the obtained modified epoxy resin and uniformly dissolved to obtain a resin varnish (R10) having a non-volatile content of 40%.
  • Example 11 A resin varnish (R11) was obtained in the same manner as in Example 10 except that 18 parts of acid anhydride E1, 25 parts of dilution solvent S1 and 51 parts of S2 were used.
  • Example 17 250 parts of the modified epoxy resin varnish (R7) obtained in Example 7 (solid content: 100 parts), 25.6 parts of the curing agent H1 and 0.3 parts of H2 were blended, MEK, propylene glycol monomethyl ether, N , and N-dimethylformamide to obtain a resin composition varnish.
  • a glass cloth WEA 7628 XS13, manufactured by Nitto Boseki Co., Ltd., 0.18 mm thick was impregnated with the obtained resin composition varnish. The impregnated glass cloth was dried in a hot air circulating oven at 150° C. for 9 minutes to obtain a prepreg.
  • the obtained prepreg was loosened and passed through a 100 mesh sieve to obtain prepreg powder.
  • the obtained prepreg powder was placed in a fluororesin mold and vacuum pressed at 2 MPa under temperature conditions of 130° C. ⁇ 15 minutes+190° C. ⁇ 80 minutes to obtain a test piece of 30 mm square ⁇ 1 mm thickness.
  • the dielectric properties and thermal conductivity of the test piece were measured, respectively, and the results are shown in Table 4.
  • Comparative example 5 A prepreg and a test piece were obtained in the same manner as in Example 17, except that 100 parts of A5 was used instead of 250 parts of modified epoxy resin varnish (solid content: 100 parts). The same test as in Example 17 was conducted, and the results are shown in Table 4.
  • Comparative example 6 A prepreg and a test piece were obtained in the same manner as in Example 17, except that 100 parts of A6 was used instead of 250 parts of modified epoxy resin varnish (solid content: 100 parts). The same test as in Example 17 was conducted, and the results are shown in Table 4.
  • the modified epoxy resin of the present invention has excellent dielectric properties, thermal conductivity and fluidity. Moreover, as can be seen from Tables 3 and 4, the cured products made from the resin composition of the present invention are also excellent in dielectric properties and thermal conductivity.
  • the modified epoxy resin and resin composition of the present invention can be applied to various fields such as adhesives, paints, construction materials for civil engineering, and insulating materials for electrical and electronic parts. It is useful as a lamination material, a sealing material, and the like.
  • the phenoxy resin of the present invention and the resin composition containing the same can be used for multilayer printed wiring boards, laminates for electric and electronic circuits such as capacitors, adhesives such as film adhesives and liquid adhesives, semiconductor sealing materials, and underfills. materials, inter-chip fill materials for 3D-LSI, insulating sheets, prepregs, heat dissipation substrates, and the like.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
PCT/JP2022/021654 2021-06-04 2022-05-26 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 Ceased WO2022255231A1 (ja)

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JP2017193649A (ja) * 2016-04-21 2017-10-26 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2019052278A (ja) * 2017-09-19 2019-04-04 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板
WO2021187180A1 (ja) * 2020-03-19 2021-09-23 日鉄ケミカル＆マテリアル株式会社 フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びフェノキシ樹脂の製造方法

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JP2016089165A (ja) * 2014-10-29 2016-05-23 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2017193649A (ja) * 2016-04-21 2017-10-26 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
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JPWO2023042650A1 (https=) * 2021-09-14 2023-03-23
JP7824306B2 (ja) 2021-09-14 2026-03-04 日鉄ケミカル＆マテリアル株式会社 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法

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