JPWO2022239620A5 - - Google Patents

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Publication number
JPWO2022239620A5
JPWO2022239620A5 JP2023520948A JP2023520948A JPWO2022239620A5 JP WO2022239620 A5 JPWO2022239620 A5 JP WO2022239620A5 JP 2023520948 A JP2023520948 A JP 2023520948A JP 2023520948 A JP2023520948 A JP 2023520948A JP WO2022239620 A5 JPWO2022239620 A5 JP WO2022239620A5
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JP
Japan
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package according
plate
package
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width
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023520948A
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English (en)
Japanese (ja)
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JPWO2022239620A1 (https=
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Priority claimed from PCT/JP2022/018467 external-priority patent/WO2022239620A1/ja
Publication of JPWO2022239620A1 publication Critical patent/JPWO2022239620A1/ja
Publication of JPWO2022239620A5 publication Critical patent/JPWO2022239620A5/ja
Pending legal-status Critical Current

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JP2023520948A 2021-05-13 2022-04-21 Pending JPWO2022239620A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021081690 2021-05-13
PCT/JP2022/018467 WO2022239620A1 (ja) 2021-05-13 2022-04-21 パッケージ

Publications (2)

Publication Number Publication Date
JPWO2022239620A1 JPWO2022239620A1 (https=) 2022-11-17
JPWO2022239620A5 true JPWO2022239620A5 (https=) 2024-02-15

Family

ID=84029566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023520948A Pending JPWO2022239620A1 (https=) 2021-05-13 2022-04-21

Country Status (3)

Country Link
US (1) US20240072010A1 (https=)
JP (1) JPWO2022239620A1 (https=)
WO (1) WO2022239620A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6815486B2 (en) * 2002-04-12 2004-11-09 Dow Corning Corporation Thermally conductive phase change materials and methods for their preparation and use
US7360586B2 (en) * 2003-07-31 2008-04-22 Fujitsu Limited Wrap around heat sink apparatus and method
US20050088092A1 (en) * 2003-10-17 2005-04-28 Myoung-Kon Kim Plasma display apparatus
JP2006294740A (ja) * 2005-04-07 2006-10-26 Denso Corp 電子装置
US7449775B1 (en) * 2006-05-22 2008-11-11 Sun Microsystems, Inc. Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion
JP2007329204A (ja) * 2006-06-06 2007-12-20 Otsuka Denki Kk 熱拡散装置および電子機器
JP2008218669A (ja) * 2007-03-02 2008-09-18 Nec Electronics Corp 半導体装置
JP5246133B2 (ja) * 2009-10-29 2013-07-24 富士通株式会社 半導体モジュール
JP5799541B2 (ja) * 2011-03-25 2015-10-28 株式会社ソシオネクスト 半導体装置及びその製造方法
JP5898919B2 (ja) * 2011-10-31 2016-04-06 新光電気工業株式会社 半導体装置
US10375859B2 (en) * 2013-06-26 2019-08-06 Molex, Llc Ganged shielding cage with thermal passages
US12394679B2 (en) * 2019-09-30 2025-08-19 Kyocera Corporation Lid body, electronic component accommodation package, and electronic device
US11330738B1 (en) * 2020-12-23 2022-05-10 Xilinx, Inc. Force balanced package mounting

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