JPWO2022239620A1 - - Google Patents
Info
- Publication number
- JPWO2022239620A1 JPWO2022239620A1 JP2023520948A JP2023520948A JPWO2022239620A1 JP WO2022239620 A1 JPWO2022239620 A1 JP WO2022239620A1 JP 2023520948 A JP2023520948 A JP 2023520948A JP 2023520948 A JP2023520948 A JP 2023520948A JP WO2022239620 A1 JPWO2022239620 A1 JP WO2022239620A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/17—Containers or parts thereof characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021081690 | 2021-05-13 | ||
| PCT/JP2022/018467 WO2022239620A1 (ja) | 2021-05-13 | 2022-04-21 | パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022239620A1 true JPWO2022239620A1 (https=) | 2022-11-17 |
| JPWO2022239620A5 JPWO2022239620A5 (https=) | 2024-02-15 |
Family
ID=84029566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023520948A Pending JPWO2022239620A1 (https=) | 2021-05-13 | 2022-04-21 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240072010A1 (https=) |
| JP (1) | JPWO2022239620A1 (https=) |
| WO (1) | WO2022239620A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6815486B2 (en) * | 2002-04-12 | 2004-11-09 | Dow Corning Corporation | Thermally conductive phase change materials and methods for their preparation and use |
| US7360586B2 (en) * | 2003-07-31 | 2008-04-22 | Fujitsu Limited | Wrap around heat sink apparatus and method |
| US20050088092A1 (en) * | 2003-10-17 | 2005-04-28 | Myoung-Kon Kim | Plasma display apparatus |
| JP2006294740A (ja) * | 2005-04-07 | 2006-10-26 | Denso Corp | 電子装置 |
| US7449775B1 (en) * | 2006-05-22 | 2008-11-11 | Sun Microsystems, Inc. | Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
| JP2007329204A (ja) * | 2006-06-06 | 2007-12-20 | Otsuka Denki Kk | 熱拡散装置および電子機器 |
| JP2008218669A (ja) * | 2007-03-02 | 2008-09-18 | Nec Electronics Corp | 半導体装置 |
| JP5246133B2 (ja) * | 2009-10-29 | 2013-07-24 | 富士通株式会社 | 半導体モジュール |
| JP5799541B2 (ja) * | 2011-03-25 | 2015-10-28 | 株式会社ソシオネクスト | 半導体装置及びその製造方法 |
| JP5898919B2 (ja) * | 2011-10-31 | 2016-04-06 | 新光電気工業株式会社 | 半導体装置 |
| US10375859B2 (en) * | 2013-06-26 | 2019-08-06 | Molex, Llc | Ganged shielding cage with thermal passages |
| US12394679B2 (en) * | 2019-09-30 | 2025-08-19 | Kyocera Corporation | Lid body, electronic component accommodation package, and electronic device |
| US11330738B1 (en) * | 2020-12-23 | 2022-05-10 | Xilinx, Inc. | Force balanced package mounting |
-
2022
- 2022-04-21 JP JP2023520948A patent/JPWO2022239620A1/ja active Pending
- 2022-04-21 WO PCT/JP2022/018467 patent/WO2022239620A1/ja not_active Ceased
-
2023
- 2023-11-08 US US18/504,850 patent/US20240072010A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022239620A1 (ja) | 2022-11-17 |
| US20240072010A1 (en) | 2024-02-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231107 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250303 |