JPWO2022235914A5 - - Google Patents
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- Publication number
- JPWO2022235914A5 JPWO2022235914A5 JP2023568590A JP2023568590A JPWO2022235914A5 JP WO2022235914 A5 JPWO2022235914 A5 JP WO2022235914A5 JP 2023568590 A JP2023568590 A JP 2023568590A JP 2023568590 A JP2023568590 A JP 2023568590A JP WO2022235914 A5 JPWO2022235914 A5 JP WO2022235914A5
- Authority
- JP
- Japan
- Prior art keywords
- coating
- insulator
- flange
- package assembly
- microelectronic package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 64
- 238000000576 coating method Methods 0.000 claims description 64
- 239000012212 insulator Substances 0.000 claims description 44
- 239000000956 alloy Substances 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 26
- 238000004377 microelectronic Methods 0.000 claims description 24
- 238000000151 deposition Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 10
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 10
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 238000005234 chemical deposition Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- 229910017315 Mo—Cu Inorganic materials 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 2
- MKPXGEVFQSIKGE-UHFFFAOYSA-N [Mg].[Si] Chemical compound [Mg].[Si] MKPXGEVFQSIKGE-UHFFFAOYSA-N 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 claims 1
- 229910015363 Au—Sn Inorganic materials 0.000 claims 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163185768P | 2021-05-07 | 2021-05-07 | |
| US63/185,768 | 2021-05-07 | ||
| PCT/US2022/027846 WO2022235914A1 (en) | 2021-05-07 | 2022-05-05 | Microelectronics package assemblies and processes for making |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024516742A JP2024516742A (ja) | 2024-04-16 |
| JPWO2022235914A5 true JPWO2022235914A5 (enrdf_load_stackoverflow) | 2025-05-07 |
Family
ID=81927461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023568590A Pending JP2024516742A (ja) | 2021-05-07 | 2022-05-05 | マイクロエレクトロニクスパッケージアセンブリおよび作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12074099B2 (enrdf_load_stackoverflow) |
| JP (1) | JP2024516742A (enrdf_load_stackoverflow) |
| KR (1) | KR20240006626A (enrdf_load_stackoverflow) |
| CN (1) | CN117280457A (enrdf_load_stackoverflow) |
| TW (1) | TW202249583A (enrdf_load_stackoverflow) |
| WO (1) | WO2022235914A1 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12224218B2 (en) * | 2022-02-11 | 2025-02-11 | Wolfspeed, Inc. | Semiconductor packages with increased power handling |
| USD1056862S1 (en) | 2022-08-24 | 2025-01-07 | Wolfspeed, Inc. | Semiconductor package |
| GB2635648A (en) * | 2023-10-17 | 2025-05-28 | Trak Microwave Ltd | Radio frequency components and manufacturing of radio-frequency components |
| TWI866712B (zh) * | 2023-12-21 | 2024-12-11 | 矽品精密工業股份有限公司 | 散熱結構及其電子封裝件 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819385B2 (ja) * | 1974-09-04 | 1983-04-18 | 日本電気株式会社 | ロウヅケホウホウ |
| WO1982003294A1 (en) * | 1981-03-23 | 1982-09-30 | Inc Motorola | Semiconductor device including plateless package |
| US6903013B2 (en) * | 2003-05-16 | 2005-06-07 | Chartered Semiconductor Manufacturing Ltd. | Method to fill a trench and tunnel by using ALD seed layer and electroless plating |
| JP2006196810A (ja) * | 2005-01-17 | 2006-07-27 | Kyocera Corp | セラミック回路基板および電子部品モジュール |
| US8617926B2 (en) * | 2010-09-09 | 2013-12-31 | Advanced Micro Devices, Inc. | Semiconductor chip device with polymeric filler trench |
| EP2973672B1 (en) | 2013-03-15 | 2018-07-11 | Materion Corporation | Method of spot-welding a die bond sheet preform containing gold and tin to a die bond area on a semiconductor package |
| US10211115B2 (en) | 2014-05-21 | 2019-02-19 | Materion Corporation | Method of making a ceramic combo lid with selective and edge metallizations |
| US20170069560A1 (en) | 2014-05-23 | 2017-03-09 | Materion Corporation | Air cavity package |
| US10163743B2 (en) | 2016-05-20 | 2018-12-25 | Materion Corporation | Copper flanged air cavity packages for high frequency devices |
| US11646255B2 (en) * | 2021-03-18 | 2023-05-09 | Taiwan Semiconductor Manufacturing Company Limited | Chip package structure including a silicon substrate interposer and methods for forming the same |
-
2022
- 2022-05-05 CN CN202280033171.7A patent/CN117280457A/zh active Pending
- 2022-05-05 WO PCT/US2022/027846 patent/WO2022235914A1/en not_active Ceased
- 2022-05-05 US US17/737,564 patent/US12074099B2/en active Active
- 2022-05-05 JP JP2023568590A patent/JP2024516742A/ja active Pending
- 2022-05-05 KR KR1020237042365A patent/KR20240006626A/ko active Pending
- 2022-05-09 TW TW111117271A patent/TW202249583A/zh unknown
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