JPWO2022202729A5 - - Google Patents

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Publication number
JPWO2022202729A5
JPWO2022202729A5 JP2023509158A JP2023509158A JPWO2022202729A5 JP WO2022202729 A5 JPWO2022202729 A5 JP WO2022202729A5 JP 2023509158 A JP2023509158 A JP 2023509158A JP 2023509158 A JP2023509158 A JP 2023509158A JP WO2022202729 A5 JPWO2022202729 A5 JP WO2022202729A5
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JP
Japan
Prior art keywords
atomic
layer
elements
nitride
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509158A
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English (en)
Japanese (ja)
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JPWO2022202729A1 (https=
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Publication date
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Priority claimed from PCT/JP2022/012943 external-priority patent/WO2022202729A1/ja
Publication of JPWO2022202729A1 publication Critical patent/JPWO2022202729A1/ja
Publication of JPWO2022202729A5 publication Critical patent/JPWO2022202729A5/ja
Pending legal-status Critical Current

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JP2023509158A 2021-03-24 2022-03-22 Pending JPWO2022202729A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021049708 2021-03-24
PCT/JP2022/012943 WO2022202729A1 (ja) 2021-03-24 2022-03-22 被覆切削工具

Publications (2)

Publication Number Publication Date
JPWO2022202729A1 JPWO2022202729A1 (https=) 2022-09-29
JPWO2022202729A5 true JPWO2022202729A5 (https=) 2024-03-04

Family

ID=83397411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509158A Pending JPWO2022202729A1 (https=) 2021-03-24 2022-03-22

Country Status (6)

Country Link
US (1) US20230390829A1 (https=)
EP (1) EP4316707A4 (https=)
JP (1) JPWO2022202729A1 (https=)
KR (1) KR102813021B1 (https=)
CN (1) CN116490638A (https=)
WO (1) WO2022202729A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025002715A (ja) * 2023-06-23 2025-01-09 株式会社Moldino 被覆切削工具
JP2025002719A (ja) * 2023-06-23 2025-01-09 株式会社Moldino 被覆切削工具
CN117305986B (zh) * 2023-11-29 2024-03-29 北京青禾晶元半导体科技有限责任公司 单晶碳化硅长晶原料、单晶碳化硅长晶方法及单晶碳化硅

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4373897B2 (ja) 2004-11-25 2009-11-25 日立ツール株式会社 硬質皮膜被覆部材及びその被覆方法
JP4388582B2 (ja) * 2008-06-09 2009-12-24 株式会社神戸製鋼所 硬質皮膜層及びその形成方法
JP5303816B2 (ja) * 2009-10-01 2013-10-02 日立ツール株式会社 硬質皮膜被覆工具
JP4753144B2 (ja) * 2009-12-21 2011-08-24 住友電工ハードメタル株式会社 表面被覆切削工具
JP2011235393A (ja) * 2010-05-11 2011-11-24 Mitsubishi Materials Corp 表面被覆切削工具
WO2015141743A1 (ja) * 2014-03-18 2015-09-24 日立金属株式会社 被覆切削工具及びその製造方法
CN108883481B (zh) * 2016-03-30 2020-01-14 三菱日立工具株式会社 包覆切削工具
US11014167B2 (en) * 2016-08-01 2021-05-25 Mitsubishi Materials Corporation Multilayer hard film-coated cutting tool
WO2018100849A1 (ja) * 2016-11-29 2018-06-07 住友電工ハードメタル株式会社 表面被覆切削工具
JP6705565B2 (ja) * 2017-11-20 2020-06-03 株式会社Moldino 被覆切削工具
US11524339B2 (en) * 2018-08-24 2022-12-13 Sumitomo Electric Hardmetal Corp. Cutting tool
CN111575660B (zh) * 2019-02-18 2022-01-25 中国石油化工股份有限公司 一种纳米多层膜及其制备方法
JP7341821B2 (ja) 2019-09-25 2023-09-11 日東電工株式会社 透明導電性フィルムおよびその製造方法

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