JPWO2022149450A5 - - Google Patents
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- Publication number
- JPWO2022149450A5 JPWO2022149450A5 JP2022573981A JP2022573981A JPWO2022149450A5 JP WO2022149450 A5 JPWO2022149450 A5 JP WO2022149450A5 JP 2022573981 A JP2022573981 A JP 2022573981A JP 2022573981 A JP2022573981 A JP 2022573981A JP WO2022149450 A5 JPWO2022149450 A5 JP WO2022149450A5
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- porous insulator
- insulator layer
- thickness
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 145
- 239000012212 insulator Substances 0.000 claims description 100
- 239000004020 conductor Substances 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 35
- 239000011229 interlayer Substances 0.000 claims description 18
- 239000003990 capacitor Substances 0.000 claims description 17
- 239000011148 porous material Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 5
- 238000013459 approach Methods 0.000 claims 3
- 230000006835 compression Effects 0.000 claims 3
- 238000007906 compression Methods 0.000 claims 3
- 238000003825 pressing Methods 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021001921 | 2021-01-08 | ||
| JP2021001921 | 2021-01-08 | ||
| PCT/JP2021/047015 WO2022149450A1 (ja) | 2021-01-08 | 2021-12-20 | 多層基板、電子機器及び多層基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022149450A1 JPWO2022149450A1 (https=) | 2022-07-14 |
| JPWO2022149450A5 true JPWO2022149450A5 (https=) | 2023-08-10 |
| JP7485090B2 JP7485090B2 (ja) | 2024-05-16 |
Family
ID=82357303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022573981A Active JP7485090B2 (ja) | 2021-01-08 | 2021-12-20 | 多層基板、電子機器及び多層基板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230345624A1 (https=) |
| JP (1) | JP7485090B2 (https=) |
| CN (1) | CN219718562U (https=) |
| WO (1) | WO2022149450A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158502A (en) * | 1980-05-12 | 1981-12-07 | Junkosha Co Ltd | Strip line |
| JP2003008233A (ja) * | 2001-06-19 | 2003-01-10 | Nitto Denko Corp | 多層配線基板 |
| JP4829028B2 (ja) * | 2006-07-31 | 2011-11-30 | 富士通株式会社 | 回路基板及び回路基板の製造方法 |
| JP2013084729A (ja) * | 2011-10-07 | 2013-05-09 | Fujitsu Ltd | 多層配線基板、電子装置、及び多層配線基板の製造方法 |
| US9402303B2 (en) * | 2013-06-03 | 2016-07-26 | Apple Inc. | Flexible printed circuit cables with slits |
| JP6090480B2 (ja) * | 2014-02-04 | 2017-03-08 | 株式会社村田製作所 | 高周波信号伝送線路及び電子機器 |
| WO2016181782A1 (ja) * | 2015-05-08 | 2016-11-17 | 株式会社村田製作所 | アンテナ素子およびその製造方法 |
| US9723714B2 (en) * | 2015-10-20 | 2017-08-01 | Flexterra, Inc. | Electronic circuit device having a protective backing for low-velocity impacts and high-velocity impacts |
| JP6912009B2 (ja) * | 2018-11-29 | 2021-07-28 | 株式会社村田製作所 | 樹脂基板および樹脂基板の製造方法 |
| KR20210085131A (ko) * | 2019-12-30 | 2021-07-08 | 엘지이노텍 주식회사 | 탄성 부재 |
-
2021
- 2021-12-20 WO PCT/JP2021/047015 patent/WO2022149450A1/ja not_active Ceased
- 2021-12-20 JP JP2022573981A patent/JP7485090B2/ja active Active
- 2021-12-20 CN CN202190000942.3U patent/CN219718562U/zh active Active
-
2023
- 2023-07-03 US US18/217,675 patent/US20230345624A1/en active Pending
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