JPWO2022130666A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2022130666A5 JPWO2022130666A5 JP2021573956A JP2021573956A JPWO2022130666A5 JP WO2022130666 A5 JPWO2022130666 A5 JP WO2022130666A5 JP 2021573956 A JP2021573956 A JP 2021573956A JP 2021573956 A JP2021573956 A JP 2021573956A JP WO2022130666 A5 JPWO2022130666 A5 JP WO2022130666A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- mass
- inorganic particles
- conductive sheet
- matrix resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010954 inorganic particle Substances 0.000 claims description 23
- 239000011159 matrix material Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 14
- 229920002545 silicone oil Polymers 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000003814 drug Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005121 nitriding Methods 0.000 claims 1
- 239000003921 oil Substances 0.000 claims 1
- 230000001568 sexual effect Effects 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- YGUFXEJWPRRAEK-UHFFFAOYSA-N dodecyl(triethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OCC)(OCC)OCC YGUFXEJWPRRAEK-UHFFFAOYSA-N 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- -1 silane compound Chemical class 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- HILHCDFHSDUYNX-UHFFFAOYSA-N trimethoxy(pentyl)silane Chemical compound CCCCC[Si](OC)(OC)OC HILHCDFHSDUYNX-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020208575 | 2020-12-16 | ||
| JP2020208575 | 2020-12-16 | ||
| PCT/JP2021/025007 WO2022130666A1 (ja) | 2020-12-16 | 2021-07-01 | 熱伝導性シート及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7061736B1 JP7061736B1 (ja) | 2022-04-28 |
| JPWO2022130666A1 JPWO2022130666A1 (https=) | 2022-06-23 |
| JPWO2022130666A5 true JPWO2022130666A5 (https=) | 2022-11-30 |
Family
ID=81448185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021573956A Active JP7061736B1 (ja) | 2020-12-16 | 2021-07-01 | 熱伝導性シート及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230374235A1 (https=) |
| EP (1) | EP4207270A4 (https=) |
| JP (1) | JP7061736B1 (https=) |
| KR (1) | KR20230120637A (https=) |
| CN (1) | CN116419951A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024247493A1 (ja) | 2023-05-29 | 2024-12-05 | 富士高分子工業株式会社 | 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005344106A (ja) | 2004-05-07 | 2005-12-15 | Shin Etsu Chem Co Ltd | シリコーンゲル組成物 |
| JP2008143980A (ja) | 2006-12-07 | 2008-06-26 | Wacker Asahikasei Silicone Co Ltd | 放熱性シリコーンゲル用組成物およびそれを硬化させてなる放熱性シリコーンシート |
| WO2016031212A1 (ja) * | 2014-08-26 | 2016-03-03 | バンドー化学株式会社 | 熱伝導性樹脂成形品 |
| JP6684408B2 (ja) * | 2016-04-28 | 2020-04-22 | 積水ポリマテック株式会社 | 熱伝導性組成物、熱伝導性シート、および熱伝導性シートの製造方法 |
| WO2018070351A1 (ja) * | 2016-10-14 | 2018-04-19 | 信越化学工業株式会社 | 熱伝導性複合シリコーンゴムシートおよびその製造方法 |
| JP6939364B2 (ja) * | 2017-10-03 | 2021-09-22 | 信越化学工業株式会社 | 光透過性を有する熱伝導樹脂シート及びその製造方法 |
| JP2020002236A (ja) | 2018-06-27 | 2020-01-09 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法 |
| EP3753993B1 (en) * | 2018-12-25 | 2024-10-16 | Fuji Polymer Industries Co., Ltd. | Heat-conductive composition and heat-conductive sheet employing same |
| CN111919292B (zh) * | 2019-03-07 | 2024-05-17 | 富士高分子工业株式会社 | 导热性片材及其制造方法 |
| JP6778846B1 (ja) * | 2019-06-24 | 2020-11-04 | 富士高分子工業株式会社 | 耐熱性熱伝導性組成物及び耐熱性熱伝導性シート |
-
2021
- 2021-07-01 KR KR1020237017241A patent/KR20230120637A/ko active Pending
- 2021-07-01 JP JP2021573956A patent/JP7061736B1/ja active Active
- 2021-07-01 EP EP21906033.2A patent/EP4207270A4/en not_active Withdrawn
- 2021-07-01 CN CN202180072624.2A patent/CN116419951A/zh active Pending
- 2021-07-01 US US18/246,972 patent/US20230374235A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8324313B2 (en) | Thermally conductive resin composition | |
| CN106751904B (zh) | 一种导热有机硅凝胶及其制备方法 | |
| JP6613462B2 (ja) | 熱伝導性シート | |
| US20160130492A1 (en) | Heat-storage composition | |
| KR102400549B1 (ko) | 방열 패드용 열전도성 조성물 및 이를 포함하는 방열 패드 | |
| JP5353379B2 (ja) | 異方性形状の窒化アルミニウムフィラーを含有する熱硬化性樹脂組成物 | |
| WO2019098290A1 (ja) | 二段階硬化型熱伝導性シリコーン組成物及びその製造方法 | |
| JP2016503236A (ja) | 電子デバイスの製造方法 | |
| KR20200098778A (ko) | 전기자동차 배터리 패키징용 방열패드의 제조방법 | |
| CN114127196A (zh) | 导热性树脂组合物和使用其的导热性片 | |
| WO2020179115A1 (ja) | 熱伝導性シート及びその製造方法 | |
| WO2020129335A1 (ja) | 熱伝導性シリコーンゴム組成物とそのシート及びその製造方法 | |
| KR20230059675A (ko) | 열전도성 실리콘 겔 조성물, 열전도성 실리콘 시트 및 그 제조 방법 | |
| JPWO2022130666A5 (https=) | ||
| CN104530713A (zh) | 一种导热硅脂 | |
| KR101084687B1 (ko) | 유·무기 하이브리드형 액상 방열 코팅 조성물 및 상기 조성물을 이용한 도막층이 형성된 전자부품 | |
| CN104530714A (zh) | 一种导热硅脂组合物 | |
| TWI868233B (zh) | 耐熱性聚矽氧樹脂組成物 | |
| JP6705067B1 (ja) | 熱伝導性シート及びその製造方法 | |
| WO2022049815A1 (ja) | 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンシート及びその製造方法 | |
| TWI891652B (zh) | 導熱性聚矽氧凝膠組成物 | |
| US20200071489A1 (en) | Thermally-conductive material, production method therefor, and thermally-conductive composition | |
| CN111253752A (zh) | 一种硅胶绝缘垫片及制备方法 | |
| KR20230120637A (ko) | 열전도성 시트 및 그 제조 방법 | |
| TWI800807B (zh) | 絕緣性填充料及其製造方法，包含該絕緣性填充料的絕緣材及其製造方法 |