CN116419951A - 导热性片材及其制造方法 - Google Patents
导热性片材及其制造方法 Download PDFInfo
- Publication number
- CN116419951A CN116419951A CN202180072624.2A CN202180072624A CN116419951A CN 116419951 A CN116419951 A CN 116419951A CN 202180072624 A CN202180072624 A CN 202180072624A CN 116419951 A CN116419951 A CN 116419951A
- Authority
- CN
- China
- Prior art keywords
- thermally conductive
- mass
- conductive sheet
- inorganic particles
- oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2391/00—Characterised by the use of oils, fats or waxes; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020208575 | 2020-12-16 | ||
| JP2020-208575 | 2020-12-16 | ||
| PCT/JP2021/025007 WO2022130666A1 (ja) | 2020-12-16 | 2021-07-01 | 熱伝導性シート及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116419951A true CN116419951A (zh) | 2023-07-11 |
Family
ID=81448185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180072624.2A Pending CN116419951A (zh) | 2020-12-16 | 2021-07-01 | 导热性片材及其制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230374235A1 (https=) |
| EP (1) | EP4207270A4 (https=) |
| JP (1) | JP7061736B1 (https=) |
| KR (1) | KR20230120637A (https=) |
| CN (1) | CN116419951A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024247493A1 (ja) | 2023-05-29 | 2024-12-05 | 富士高分子工業株式会社 | 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005344106A (ja) | 2004-05-07 | 2005-12-15 | Shin Etsu Chem Co Ltd | シリコーンゲル組成物 |
| JP2008143980A (ja) | 2006-12-07 | 2008-06-26 | Wacker Asahikasei Silicone Co Ltd | 放熱性シリコーンゲル用組成物およびそれを硬化させてなる放熱性シリコーンシート |
| WO2016031212A1 (ja) * | 2014-08-26 | 2016-03-03 | バンドー化学株式会社 | 熱伝導性樹脂成形品 |
| JP6684408B2 (ja) * | 2016-04-28 | 2020-04-22 | 積水ポリマテック株式会社 | 熱伝導性組成物、熱伝導性シート、および熱伝導性シートの製造方法 |
| WO2018070351A1 (ja) * | 2016-10-14 | 2018-04-19 | 信越化学工業株式会社 | 熱伝導性複合シリコーンゴムシートおよびその製造方法 |
| JP6939364B2 (ja) * | 2017-10-03 | 2021-09-22 | 信越化学工業株式会社 | 光透過性を有する熱伝導樹脂シート及びその製造方法 |
| JP2020002236A (ja) | 2018-06-27 | 2020-01-09 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法 |
| EP3753993B1 (en) * | 2018-12-25 | 2024-10-16 | Fuji Polymer Industries Co., Ltd. | Heat-conductive composition and heat-conductive sheet employing same |
| CN111919292B (zh) * | 2019-03-07 | 2024-05-17 | 富士高分子工业株式会社 | 导热性片材及其制造方法 |
| JP6778846B1 (ja) * | 2019-06-24 | 2020-11-04 | 富士高分子工業株式会社 | 耐熱性熱伝導性組成物及び耐熱性熱伝導性シート |
-
2021
- 2021-07-01 KR KR1020237017241A patent/KR20230120637A/ko active Pending
- 2021-07-01 JP JP2021573956A patent/JP7061736B1/ja active Active
- 2021-07-01 EP EP21906033.2A patent/EP4207270A4/en not_active Withdrawn
- 2021-07-01 CN CN202180072624.2A patent/CN116419951A/zh active Pending
- 2021-07-01 US US18/246,972 patent/US20230374235A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP4207270A1 (en) | 2023-07-05 |
| JPWO2022130666A1 (https=) | 2022-06-23 |
| KR20230120637A (ko) | 2023-08-17 |
| US20230374235A1 (en) | 2023-11-23 |
| JP7061736B1 (ja) | 2022-04-28 |
| EP4207270A4 (en) | 2024-10-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102896173B1 (ko) | 고열전도성 실리콘 조성물 및 그 경화물 | |
| WO2020137086A1 (ja) | 熱伝導組成物及びこれを用いた熱伝導性シート | |
| JP7794946B2 (ja) | 熱伝導性シリコーン組成物分野 | |
| TW201700616A (zh) | 熱傳導性聚矽氧組成物及硬化物以及複合薄片 | |
| JP2022060339A (ja) | 熱伝導性シリコーン組成物 | |
| CN114667319A (zh) | 导热性有机硅凝胶组合物、导热性有机硅片材及其制造方法 | |
| JP2023183384A (ja) | 熱伝導性シリコーン組成物および該組成物を使用する熱伝導性部材の製造方法 | |
| EP4437044A1 (en) | Curable thermally conductive composition containing diamond particles | |
| JPWO2018020862A1 (ja) | 熱伝導性シート | |
| CN114729192B (zh) | 导热性有机硅凝胶组合物、导热性有机硅凝胶片材及其制造方法 | |
| TW202214816A (zh) | 導熱性聚矽氧凝膠組成物、導熱性聚矽氧凝膠片及其製造方法 | |
| CN116419951A (zh) | 导热性片材及其制造方法 | |
| WO2023188491A1 (ja) | 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法 | |
| JP7012197B1 (ja) | 熱伝導性液状組成物 | |
| TWI868378B (zh) | 熱傳導性液狀組成物 | |
| CN115397944A (zh) | 导热性有机硅润滑脂组合物及其制造方法 | |
| JP2006143978A (ja) | 熱伝導性シリコーン組成物 | |
| TWI878566B (zh) | 熱傳導性片及其製造方法 | |
| CN121511689A (zh) | 导热性硅脂组合物及其制造方法 | |
| JP7041793B1 (ja) | シリコーンゲル組成物及びシリコーンゲルシート | |
| CN113454165A (zh) | 导热性硅胶组合物 | |
| JP7690705B1 (ja) | 熱伝導性シート及びその製造方法 | |
| JP7426545B1 (ja) | 熱伝導性組成物 | |
| JP7650410B1 (ja) | 耐熱性樹脂組成物及びこれを用いた耐熱性樹脂シートとその製造方法 | |
| JP2025167953A (ja) | 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |