JP7061736B1 - 熱伝導性シート及びその製造方法 - Google Patents

熱伝導性シート及びその製造方法 Download PDF

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JP7061736B1
JP7061736B1 JP2021573956A JP2021573956A JP7061736B1 JP 7061736 B1 JP7061736 B1 JP 7061736B1 JP 2021573956 A JP2021573956 A JP 2021573956A JP 2021573956 A JP2021573956 A JP 2021573956A JP 7061736 B1 JP7061736 B1 JP 7061736B1
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mass
heat conductive
inorganic particles
conductive sheet
matrix resin
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JPWO2022130666A1 (https=
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克之 鈴村
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Fuji Polymer Industries Co Ltd
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Fuji Polymer Industries Co Ltd
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
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    • H10W40/251Organics
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    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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    • C08J5/18Manufacture of films or sheets
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • C08K2003/282Binary compounds of nitrogen with aluminium
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • C08K2003/382Boron-containing compounds and nitrogen
    • C08K2003/385Binary compounds of nitrogen with boron
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
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    • C08K2201/005Additives being defined by their particle size in general
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • C08K3/14Carbides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
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    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021573956A 2020-12-16 2021-07-01 熱伝導性シート及びその製造方法 Active JP7061736B1 (ja)

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JP2020208575 2020-12-16
JP2020208575 2020-12-16
PCT/JP2021/025007 WO2022130666A1 (ja) 2020-12-16 2021-07-01 熱伝導性シート及びその製造方法

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JP7061736B1 true JP7061736B1 (ja) 2022-04-28
JPWO2022130666A1 JPWO2022130666A1 (https=) 2022-06-23
JPWO2022130666A5 JPWO2022130666A5 (https=) 2022-11-30

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US (1) US20230374235A1 (https=)
EP (1) EP4207270A4 (https=)
JP (1) JP7061736B1 (https=)
KR (1) KR20230120637A (https=)
CN (1) CN116419951A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024247493A1 (ja) 2023-05-29 2024-12-05 富士高分子工業株式会社 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019065211A (ja) * 2017-10-03 2019-04-25 信越化学工業株式会社 光透過性を有する熱伝導樹脂シート及びその製造方法
WO2020137086A1 (ja) * 2018-12-25 2020-07-02 富士高分子工業株式会社 熱伝導組成物及びこれを用いた熱伝導性シート
WO2020179115A1 (ja) * 2019-03-07 2020-09-10 富士高分子工業株式会社 熱伝導性シート及びその製造方法
JP6778846B1 (ja) * 2019-06-24 2020-11-04 富士高分子工業株式会社 耐熱性熱伝導性組成物及び耐熱性熱伝導性シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005344106A (ja) 2004-05-07 2005-12-15 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP2008143980A (ja) 2006-12-07 2008-06-26 Wacker Asahikasei Silicone Co Ltd 放熱性シリコーンゲル用組成物およびそれを硬化させてなる放熱性シリコーンシート
WO2016031212A1 (ja) * 2014-08-26 2016-03-03 バンドー化学株式会社 熱伝導性樹脂成形品
JP6684408B2 (ja) * 2016-04-28 2020-04-22 積水ポリマテック株式会社 熱伝導性組成物、熱伝導性シート、および熱伝導性シートの製造方法
WO2018070351A1 (ja) * 2016-10-14 2018-04-19 信越化学工業株式会社 熱伝導性複合シリコーンゴムシートおよびその製造方法
JP2020002236A (ja) 2018-06-27 2020-01-09 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019065211A (ja) * 2017-10-03 2019-04-25 信越化学工業株式会社 光透過性を有する熱伝導樹脂シート及びその製造方法
WO2020137086A1 (ja) * 2018-12-25 2020-07-02 富士高分子工業株式会社 熱伝導組成物及びこれを用いた熱伝導性シート
WO2020179115A1 (ja) * 2019-03-07 2020-09-10 富士高分子工業株式会社 熱伝導性シート及びその製造方法
JP6778846B1 (ja) * 2019-06-24 2020-11-04 富士高分子工業株式会社 耐熱性熱伝導性組成物及び耐熱性熱伝導性シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024247493A1 (ja) 2023-05-29 2024-12-05 富士高分子工業株式会社 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

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CN116419951A (zh) 2023-07-11
EP4207270A1 (en) 2023-07-05
JPWO2022130666A1 (https=) 2022-06-23
KR20230120637A (ko) 2023-08-17
US20230374235A1 (en) 2023-11-23
EP4207270A4 (en) 2024-10-09

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