JPWO2022102489A5 - - Google Patents
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- Publication number
- JPWO2022102489A5 JPWO2022102489A5 JP2022544339A JP2022544339A JPWO2022102489A5 JP WO2022102489 A5 JPWO2022102489 A5 JP WO2022102489A5 JP 2022544339 A JP2022544339 A JP 2022544339A JP 2022544339 A JP2022544339 A JP 2022544339A JP WO2022102489 A5 JPWO2022102489 A5 JP WO2022102489A5
- Authority
- JP
- Japan
- Prior art keywords
- curable composition
- composition according
- resin
- para
- tertiary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 3
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 229920003986 novolac Polymers 0.000 claims 3
- 239000005011 phenolic resin Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 229920001568 phenolic resin Polymers 0.000 claims 2
- 239000003566 sealing material Substances 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020190382 | 2020-11-16 | ||
| JP2020190382 | 2020-11-16 | ||
| PCT/JP2021/040509 WO2022102489A1 (ja) | 2020-11-16 | 2021-11-04 | 樹脂組成物、硬化物、半導体封止材、及び、半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022102489A1 JPWO2022102489A1 (enrdf_load_stackoverflow) | 2022-05-19 |
| JPWO2022102489A5 true JPWO2022102489A5 (enrdf_load_stackoverflow) | 2022-10-24 |
| JP7205673B2 JP7205673B2 (ja) | 2023-01-17 |
Family
ID=81601242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022544339A Active JP7205673B2 (ja) | 2020-11-16 | 2021-11-04 | 樹脂組成物、硬化物、半導体封止材、及び、半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7205673B2 (enrdf_load_stackoverflow) |
| TW (1) | TW202225229A (enrdf_load_stackoverflow) |
| WO (1) | WO2022102489A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022151177A (ja) * | 2021-03-26 | 2022-10-07 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体素子の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07196767A (ja) * | 1993-12-28 | 1995-08-01 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物およびその硬化物 |
| JP3962935B2 (ja) * | 1998-01-19 | 2007-08-22 | 大日本インキ化学工業株式会社 | エポキシ樹脂組成物 |
| US7569260B2 (en) * | 2003-08-21 | 2009-08-04 | Asahi Kasei Chemicals Corporation | Photosensitive composition and cured products thereof |
| JP2010222390A (ja) * | 2009-03-19 | 2010-10-07 | Lintec Corp | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
| US20140228483A1 (en) * | 2013-02-13 | 2014-08-14 | Momentive Specialty Chemicals Inc. | Compositions useful for preparing composites and composites produced therewith |
| JP6469654B2 (ja) * | 2014-03-31 | 2019-02-13 | 明和化成株式会社 | フェノール樹脂、該フェノール樹脂を含むエポキシ樹脂組成物、該エポキシ樹脂組成物の硬化物、及び該硬化物を有する半導体装置 |
| TWI731986B (zh) * | 2016-06-29 | 2021-07-01 | 日商迪愛生股份有限公司 | 苯酚酚醛清漆樹脂、硬化性樹脂組成物及其硬化物 |
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2021
- 2021-11-04 JP JP2022544339A patent/JP7205673B2/ja active Active
- 2021-11-04 WO PCT/JP2021/040509 patent/WO2022102489A1/ja active Application Filing
- 2021-11-04 TW TW110141096A patent/TW202225229A/zh unknown