JPWO2022075144A5 - - Google Patents
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- Publication number
- JPWO2022075144A5 JPWO2022075144A5 JP2022555398A JP2022555398A JPWO2022075144A5 JP WO2022075144 A5 JPWO2022075144 A5 JP WO2022075144A5 JP 2022555398 A JP2022555398 A JP 2022555398A JP 2022555398 A JP2022555398 A JP 2022555398A JP WO2022075144 A5 JPWO2022075144 A5 JP WO2022075144A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- protective film
- composition
- solvent
- film according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002904 solvent Substances 0.000 claims description 17
- 238000009835 boiling Methods 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims 23
- 239000000758 substrate Substances 0.000 claims 7
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 150000002170 ethers Chemical class 0.000 claims 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- -1 glycol monoalkyl ether acetates Chemical class 0.000 claims 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 claims 1
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- 150000002148 esters Chemical group 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- ZMFWEWMHABZQNB-UHFFFAOYSA-N 6-acetyloxyhexyl acetate Chemical compound CC(=O)OCCCCCCOC(C)=O ZMFWEWMHABZQNB-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020170483 | 2020-10-08 | ||
| JP2020170483 | 2020-10-08 | ||
| PCT/JP2021/035840 WO2022075144A1 (ja) | 2020-10-08 | 2021-09-29 | 保護膜形成用組成物、保護膜、保護膜の形成方法、及び基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022075144A1 JPWO2022075144A1 (https=) | 2022-04-14 |
| JPWO2022075144A5 true JPWO2022075144A5 (https=) | 2023-06-26 |
| JP7601107B2 JP7601107B2 (ja) | 2024-12-17 |
Family
ID=81125829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022555398A Active JP7601107B2 (ja) | 2020-10-08 | 2021-09-29 | 保護膜形成用組成物、保護膜、保護膜の形成方法、及び基板の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12312487B2 (https=) |
| JP (1) | JP7601107B2 (https=) |
| KR (1) | KR102842408B1 (https=) |
| CN (1) | CN116209715A (https=) |
| WO (1) | WO2022075144A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202337929A (zh) * | 2021-11-15 | 2023-10-01 | 日商日產化學股份有限公司 | 多環芳香族烴系光硬化性樹脂組成物 |
| JP7752098B2 (ja) * | 2022-08-10 | 2025-10-09 | 信越化学工業株式会社 | ウェハエッジ保護膜形成方法、パターン形成方法、及びウェハエッジ保護膜形成用組成物 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4295937B2 (ja) * | 2000-12-05 | 2009-07-15 | 株式会社Ｋｒｉ | 活性成分及びそれを用いた感光性樹脂組成物 |
| JP3914493B2 (ja) | 2002-11-27 | 2007-05-16 | 東京応化工業株式会社 | 多層レジストプロセス用下層膜形成材料およびこれを用いた配線形成方法 |
| JP2007115834A (ja) * | 2005-10-19 | 2007-05-10 | Toshiba Corp | 半導体製造方法及び半導体製造装置 |
| JP5297182B2 (ja) * | 2008-12-25 | 2013-09-25 | 日東電工株式会社 | クリーニング機能付搬送部材およびその製造方法 |
| JP5988438B2 (ja) * | 2012-08-02 | 2016-09-07 | 東京エレクトロン株式会社 | 塗布処理方法及び塗布処理装置 |
| JP5779168B2 (ja) * | 2012-12-04 | 2015-09-16 | 東京エレクトロン株式会社 | 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体 |
| JP6352824B2 (ja) | 2015-01-23 | 2018-07-04 | 東芝メモリ株式会社 | 基板処理装置、制御プログラムおよび制御方法 |
| US9482957B1 (en) * | 2015-06-15 | 2016-11-01 | I-Shan Ke | Solvent for reducing resist consumption and method using solvent for reducing resist consumption |
| TWI743143B (zh) * | 2016-08-10 | 2021-10-21 | 日商Ｊｓｒ股份有限公司 | 半導體用抗蝕劑底層膜形成組成物、抗蝕劑底層膜、抗蝕劑底層膜的形成方法及圖案化基板的製造方法 |
| JP2018124354A (ja) * | 2017-01-30 | 2018-08-09 | Jsr株式会社 | レジスト膜形成方法及び保護膜形成用組成物 |
| US10073347B1 (en) * | 2017-08-24 | 2018-09-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor method of protecting wafer from bevel contamination |
| JP6950662B2 (ja) * | 2018-10-30 | 2021-10-13 | 信越化学工業株式会社 | 基板保護膜形成用材料及びパターン形成方法 |
| US11605538B2 (en) * | 2018-10-31 | 2023-03-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Protective composition and method of forming photoresist pattern |
-
2021
- 2021-09-29 JP JP2022555398A patent/JP7601107B2/ja active Active
- 2021-09-29 KR KR1020237011601A patent/KR102842408B1/ko active Active
- 2021-09-29 CN CN202180065028.1A patent/CN116209715A/zh active Pending
- 2021-09-29 WO PCT/JP2021/035840 patent/WO2022075144A1/ja not_active Ceased
-
2023
- 2023-03-28 US US18/127,066 patent/US12312487B2/en active Active
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