JPWO2022070310A1 - - Google Patents

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Publication number
JPWO2022070310A1
JPWO2022070310A1 JP2022553304A JP2022553304A JPWO2022070310A1 JP WO2022070310 A1 JPWO2022070310 A1 JP WO2022070310A1 JP 2022553304 A JP2022553304 A JP 2022553304A JP 2022553304 A JP2022553304 A JP 2022553304A JP WO2022070310 A1 JPWO2022070310 A1 JP WO2022070310A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022553304A
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JP7362940B2 (ja
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Publication of JPWO2022070310A1 publication Critical patent/JPWO2022070310A1/ja
Application granted granted Critical
Publication of JP7362940B2 publication Critical patent/JP7362940B2/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Health & Medical Sciences (AREA)
JP2022553304A 2020-09-30 2020-09-30 基板処理装置、温度制御プログラム、半導体装置の製造方法及び温度制御方法 Active JP7362940B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/037162 WO2022070310A1 (ja) 2020-09-30 2020-09-30 基板処理装置、温度制御プログラム、半導体装置の製造方法及び温度制御方法

Publications (2)

Publication Number Publication Date
JPWO2022070310A1 true JPWO2022070310A1 (ja) 2022-04-07
JP7362940B2 JP7362940B2 (ja) 2023-10-17

Family

ID=80951259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022553304A Active JP7362940B2 (ja) 2020-09-30 2020-09-30 基板処理装置、温度制御プログラム、半導体装置の製造方法及び温度制御方法

Country Status (6)

Country Link
US (1) US20230257883A1 (ja)
JP (1) JP7362940B2 (ja)
KR (1) KR20230053689A (ja)
CN (1) CN116157902A (ja)
TW (1) TWI777677B (ja)
WO (1) WO2022070310A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463276A (ja) * 1990-07-03 1992-02-28 Hitachi Ltd 真空内被処理物の温度測定方法並びに温度制御方法及び装置
JPH10193062A (ja) * 1997-01-08 1998-07-28 Kawasaki Steel Corp 表面性状の優れた連続鋳造鋳片の製造方法
JP2002130961A (ja) * 2000-10-27 2002-05-09 Tokyo Electron Ltd 熱処理装置の校正方法及び熱処理装置の数学モデル生成・校正方法
JP2012182310A (ja) * 2011-03-01 2012-09-20 Tokyo Electron Ltd 熱処理装置およびその制御方法
JP2013062361A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体
WO2018100826A1 (ja) * 2016-11-30 2018-06-07 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
WO2018105113A1 (ja) * 2016-12-09 2018-06-14 株式会社日立国際電気 基板処理装置、クーリングユニット及び断熱構造体
JP2019048322A (ja) * 2017-09-11 2019-03-28 新日鐵住金株式会社 連続鋳造機の２次冷却制御装置、連続鋳造機の２次冷却制御方法、およびプログラム
JP2019145730A (ja) * 2018-02-23 2019-08-29 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、温度制御方法、半導体装置の製造方法及び温度制御プログラム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5698059B2 (ja) * 2011-04-08 2015-04-08 株式会社日立国際電気 基板処理装置、及び、太陽電池の製造方法
JP6186000B2 (ja) * 2013-08-27 2017-08-23 株式会社日立国際電気 基板処理装置のメンテナンス方法、半導体装置の製造方法、基板処理装置、及び基板処理装置のメンテナンスプログラム
WO2018100850A1 (ja) * 2016-12-01 2018-06-07 株式会社日立国際電気 基板処理装置、天井ヒータおよび半導体装置の製造方法
JP6615153B2 (ja) * 2017-06-16 2019-12-04 東京エレクトロン株式会社 基板処理装置、基板載置機構、および基板処理方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463276A (ja) * 1990-07-03 1992-02-28 Hitachi Ltd 真空内被処理物の温度測定方法並びに温度制御方法及び装置
JPH10193062A (ja) * 1997-01-08 1998-07-28 Kawasaki Steel Corp 表面性状の優れた連続鋳造鋳片の製造方法
JP2002130961A (ja) * 2000-10-27 2002-05-09 Tokyo Electron Ltd 熱処理装置の校正方法及び熱処理装置の数学モデル生成・校正方法
JP2012182310A (ja) * 2011-03-01 2012-09-20 Tokyo Electron Ltd 熱処理装置およびその制御方法
JP2013062361A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体
WO2018100826A1 (ja) * 2016-11-30 2018-06-07 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
WO2018105113A1 (ja) * 2016-12-09 2018-06-14 株式会社日立国際電気 基板処理装置、クーリングユニット及び断熱構造体
JP2019048322A (ja) * 2017-09-11 2019-03-28 新日鐵住金株式会社 連続鋳造機の２次冷却制御装置、連続鋳造機の２次冷却制御方法、およびプログラム
JP2019145730A (ja) * 2018-02-23 2019-08-29 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、温度制御方法、半導体装置の製造方法及び温度制御プログラム

Also Published As

Publication number Publication date
WO2022070310A1 (ja) 2022-04-07
JP7362940B2 (ja) 2023-10-17
CN116157902A (zh) 2023-05-23
TWI777677B (zh) 2022-09-11
US20230257883A1 (en) 2023-08-17
KR20230053689A (ko) 2023-04-21
TW202218070A (zh) 2022-05-01

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