JPWO2022065257A1 - - Google Patents
Info
- Publication number
- JPWO2022065257A1 JPWO2022065257A1 JP2022551967A JP2022551967A JPWO2022065257A1 JP WO2022065257 A1 JPWO2022065257 A1 JP WO2022065257A1 JP 2022551967 A JP2022551967 A JP 2022551967A JP 2022551967 A JP2022551967 A JP 2022551967A JP WO2022065257 A1 JPWO2022065257 A1 JP WO2022065257A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/258—Metallic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
- H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
- H10W46/103—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols alphanumeric information, e.g. words, letters or serial numbers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
- H10W46/106—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols digital information, e.g. bar codes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
- H10W46/603—Formed on wafers or substrates before dicing and remaining on chips after dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
- H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
- H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
- H10W76/42—Fillings
- H10W76/47—Solid or gel fillings
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020159895 | 2020-09-24 | ||
| JP2020159895 | 2020-09-24 | ||
| PCT/JP2021/034411 WO2022065257A1 (ja) | 2020-09-24 | 2021-09-17 | 半導体パッケージ、電子機器、及び電子機器の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022065257A1 true JPWO2022065257A1 (https=) | 2022-03-31 |
| JPWO2022065257A5 JPWO2022065257A5 (https=) | 2023-06-08 |
| JP7504214B2 JP7504214B2 (ja) | 2024-06-21 |
Family
ID=80845377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022551967A Active JP7504214B2 (ja) | 2020-09-24 | 2021-09-17 | 半導体パッケージ、電子機器、及び電子機器の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230298963A1 (https=) |
| EP (1) | EP4220703A4 (https=) |
| JP (1) | JP7504214B2 (https=) |
| CN (1) | CN116157913A (https=) |
| TW (1) | TW202220064A (https=) |
| WO (1) | WO2022065257A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI879409B (zh) * | 2024-01-30 | 2025-04-01 | 矽品精密工業股份有限公司 | 半導體封裝結構及其製法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002016102A (ja) * | 2000-06-28 | 2002-01-18 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| JP2007335742A (ja) * | 2006-06-16 | 2007-12-27 | Sony Computer Entertainment Inc | 半導体装置およびその製造方法 |
| JP2009194321A (ja) * | 2008-02-18 | 2009-08-27 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、半導体パッケージ |
| US20160172306A1 (en) * | 2014-12-16 | 2016-06-16 | Deca Technologies Inc. | Method of marking a semiconductor package |
| JP2016192444A (ja) * | 2015-03-30 | 2016-11-10 | 株式会社東芝 | 半導体装置 |
| WO2020162417A1 (ja) * | 2019-02-04 | 2020-08-13 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器、半導体装置、絶縁シート、及び半導体装置の製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4594263A (en) * | 1984-12-17 | 1986-06-10 | Motorola, Inc. | Laser marking method and ablative coating for use therein |
| JPH01216558A (ja) * | 1988-02-24 | 1989-08-30 | Hitachi Ltd | 半導体装置 |
| JP3437369B2 (ja) * | 1996-03-19 | 2003-08-18 | 松下電器産業株式会社 | チップキャリアおよびこれを用いた半導体装置 |
| US6984876B2 (en) * | 2004-05-27 | 2006-01-10 | Semiconductor Components Industries, L.L.C. | Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof |
| US7667949B2 (en) * | 2006-08-05 | 2010-02-23 | John Maxwell | Capacitor having improved surface breakdown voltage performance and method for marking same |
| US7489033B2 (en) * | 2006-11-10 | 2009-02-10 | Intel Corporation | Electronic assembly with hot spot cooling |
| JP5184003B2 (ja) * | 2007-08-28 | 2013-04-17 | 川崎マイクロエレクトロニクス株式会社 | 半導体集積回路およびダミーパターンの配置方法 |
| US8187897B2 (en) * | 2008-08-19 | 2012-05-29 | International Business Machines Corporation | Fabricating product chips and die with a feature pattern that contains information relating to the product chip |
| US8522569B2 (en) * | 2009-10-27 | 2013-09-03 | Industrial Idea Partners, Inc. | Utilization of data center waste heat for heat driven engine |
| US20110259951A1 (en) * | 2010-04-26 | 2011-10-27 | Medtronic, Inc. | Method for Tracing Individual Dies |
| JP5609680B2 (ja) | 2010-08-27 | 2014-10-22 | ソニー株式会社 | 放熱構造及び電子機器 |
| US9589900B2 (en) * | 2014-02-27 | 2017-03-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal pad for laser marking |
| US9832860B2 (en) * | 2014-09-26 | 2017-11-28 | Intel Corporation | Panel level fabrication of package substrates with integrated stiffeners |
| JP6542891B2 (ja) * | 2014-12-05 | 2019-07-10 | ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． | 低い熱インピーダンスを有する高性能熱界面材料 |
-
2021
- 2021-09-16 TW TW110134544A patent/TW202220064A/zh unknown
- 2021-09-17 CN CN202180058888.2A patent/CN116157913A/zh active Pending
- 2021-09-17 EP EP21872386.4A patent/EP4220703A4/en active Pending
- 2021-09-17 WO PCT/JP2021/034411 patent/WO2022065257A1/ja not_active Ceased
- 2021-09-17 JP JP2022551967A patent/JP7504214B2/ja active Active
- 2021-09-17 US US18/044,847 patent/US20230298963A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002016102A (ja) * | 2000-06-28 | 2002-01-18 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| JP2007335742A (ja) * | 2006-06-16 | 2007-12-27 | Sony Computer Entertainment Inc | 半導体装置およびその製造方法 |
| JP2009194321A (ja) * | 2008-02-18 | 2009-08-27 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、半導体パッケージ |
| US20160172306A1 (en) * | 2014-12-16 | 2016-06-16 | Deca Technologies Inc. | Method of marking a semiconductor package |
| JP2016192444A (ja) * | 2015-03-30 | 2016-11-10 | 株式会社東芝 | 半導体装置 |
| WO2020162417A1 (ja) * | 2019-02-04 | 2020-08-13 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器、半導体装置、絶縁シート、及び半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4220703A4 (en) | 2025-01-08 |
| JP7504214B2 (ja) | 2024-06-21 |
| US20230298963A1 (en) | 2023-09-21 |
| TW202220064A (zh) | 2022-05-16 |
| EP4220703A1 (en) | 2023-08-02 |
| CN116157913A (zh) | 2023-05-23 |
| WO2022065257A1 (ja) | 2022-03-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230330 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230330 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240227 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240430 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240514 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240611 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7504214 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |