TW202220064A - 半導體封裝、電子機器及電子機器的製造方法 - Google Patents

半導體封裝、電子機器及電子機器的製造方法 Download PDF

Info

Publication number
TW202220064A
TW202220064A TW110134544A TW110134544A TW202220064A TW 202220064 A TW202220064 A TW 202220064A TW 110134544 A TW110134544 A TW 110134544A TW 110134544 A TW110134544 A TW 110134544A TW 202220064 A TW202220064 A TW 202220064A
Authority
TW
Taiwan
Prior art keywords
semiconductor
package
semiconductor wafer
aforementioned
semiconductor package
Prior art date
Application number
TW110134544A
Other languages
English (en)
Chinese (zh)
Inventor
菅原信之
神林明日香
鈴木涼
Original Assignee
日商索尼互動娛樂股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商索尼互動娛樂股份有限公司 filed Critical 日商索尼互動娛樂股份有限公司
Publication of TW202220064A publication Critical patent/TW202220064A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/103—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols alphanumeric information, e.g. words, letters or serial numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/106—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols digital information, e.g. bar codes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/603—Formed on wafers or substrates before dicing and remaining on chips after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
TW110134544A 2020-09-24 2021-09-16 半導體封裝、電子機器及電子機器的製造方法 TW202220064A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020159895 2020-09-24
JP2020-159895 2020-09-24

Publications (1)

Publication Number Publication Date
TW202220064A true TW202220064A (zh) 2022-05-16

Family

ID=80845377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110134544A TW202220064A (zh) 2020-09-24 2021-09-16 半導體封裝、電子機器及電子機器的製造方法

Country Status (6)

Country Link
US (1) US20230298963A1 (https=)
EP (1) EP4220703A4 (https=)
JP (1) JP7504214B2 (https=)
CN (1) CN116157913A (https=)
TW (1) TW202220064A (https=)
WO (1) WO2022065257A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI879409B (zh) * 2024-01-30 2025-04-01 矽品精密工業股份有限公司 半導體封裝結構及其製法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594263A (en) * 1984-12-17 1986-06-10 Motorola, Inc. Laser marking method and ablative coating for use therein
JPH01216558A (ja) * 1988-02-24 1989-08-30 Hitachi Ltd 半導体装置
JP3437369B2 (ja) * 1996-03-19 2003-08-18 松下電器産業株式会社 チップキャリアおよびこれを用いた半導体装置
JP2002016102A (ja) * 2000-06-28 2002-01-18 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US6984876B2 (en) * 2004-05-27 2006-01-10 Semiconductor Components Industries, L.L.C. Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
JP4589269B2 (ja) 2006-06-16 2010-12-01 ソニー株式会社 半導体装置およびその製造方法
US7667949B2 (en) * 2006-08-05 2010-02-23 John Maxwell Capacitor having improved surface breakdown voltage performance and method for marking same
US7489033B2 (en) * 2006-11-10 2009-02-10 Intel Corporation Electronic assembly with hot spot cooling
JP5184003B2 (ja) * 2007-08-28 2013-04-17 川崎マイクロエレクトロニクス株式会社 半導体集積回路およびダミーパターンの配置方法
JP2009194321A (ja) * 2008-02-18 2009-08-27 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、半導体パッケージ
US8187897B2 (en) * 2008-08-19 2012-05-29 International Business Machines Corporation Fabricating product chips and die with a feature pattern that contains information relating to the product chip
US8522569B2 (en) * 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
US20110259951A1 (en) * 2010-04-26 2011-10-27 Medtronic, Inc. Method for Tracing Individual Dies
JP5609680B2 (ja) 2010-08-27 2014-10-22 ソニー株式会社 放熱構造及び電子機器
US9589900B2 (en) * 2014-02-27 2017-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Metal pad for laser marking
US9832860B2 (en) * 2014-09-26 2017-11-28 Intel Corporation Panel level fabrication of package substrates with integrated stiffeners
JP6542891B2 (ja) * 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 低い熱インピーダンスを有する高性能熱界面材料
CN107112250B (zh) * 2014-12-16 2019-11-05 德卡技术股份有限公司 标记半导体封装的方法
JP2016192444A (ja) * 2015-03-30 2016-11-10 株式会社東芝 半導体装置
US20220262759A1 (en) * 2019-02-04 2022-08-18 Sony Interactive Entertainment Inc. Electronic apparatus, semiconductor device, insulating sheet, and semiconductor device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI879409B (zh) * 2024-01-30 2025-04-01 矽品精密工業股份有限公司 半導體封裝結構及其製法

Also Published As

Publication number Publication date
EP4220703A4 (en) 2025-01-08
JP7504214B2 (ja) 2024-06-21
JPWO2022065257A1 (https=) 2022-03-31
US20230298963A1 (en) 2023-09-21
EP4220703A1 (en) 2023-08-02
CN116157913A (zh) 2023-05-23
WO2022065257A1 (ja) 2022-03-31

Similar Documents

Publication Publication Date Title
JP7311540B2 (ja) 電子機器、半導体装置、絶縁シート、及び半導体装置の製造方法
JP5096782B2 (ja) 半導体装置
US7704798B2 (en) Electronic assemblies with hot spot cooling and methods relating thereto
JP5983032B2 (ja) 半導体パッケージ及び配線基板ユニット
US7629684B2 (en) Adjustable thickness thermal interposer and electronic package utilizing same
JP5899768B2 (ja) 半導体パッケージ、配線基板ユニット、及び電子機器
TWI618205B (zh) 薄膜覆晶封裝體及其散熱方法
JPH0758254A (ja) マルチチップモジュール及びその製造方法
WO2011121779A1 (ja) マルチチップモジュール、プリント配線基板ユニット、マルチチップモジュールの製造方法およびプリント配線基板ユニットの製造方法
US12278150B2 (en) Semiconductor package with annular package lid structure
TWI658549B (zh) 散熱型封裝結構
CN215266269U (zh) 一种电路板组件、散热器和电子设备
US20220199429A1 (en) Structural thermal interfacing for lidded semiconductor packages
US12543570B2 (en) Cooling package structure applied to integrated circuit
TW202220064A (zh) 半導體封裝、電子機器及電子機器的製造方法
JPWO2022065257A5 (https=)
JPH1168360A (ja) 半導体素子の冷却構造
EP4456128A1 (en) Thermal management systems and methods for semiconductor devices
JP4430451B2 (ja) 半導体素子の放熱装置
JP7152544B2 (ja) 半導体放熱パッケージ構造
TWI624217B (zh) 熱擴散式電子裝置
CN121171992A (zh) 芯片封装结构、电子设备以及制备方法
TW202508402A (zh) 電子組件
CN115763383A (zh) 半导体安装结构体