CN116157913A - 半导体封装、电子设备和电子设备制造方法 - Google Patents

半导体封装、电子设备和电子设备制造方法 Download PDF

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Publication number
CN116157913A
CN116157913A CN202180058888.2A CN202180058888A CN116157913A CN 116157913 A CN116157913 A CN 116157913A CN 202180058888 A CN202180058888 A CN 202180058888A CN 116157913 A CN116157913 A CN 116157913A
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CN
China
Prior art keywords
semiconductor chip
semiconductor
package
semiconductor package
written
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Pending
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CN202180058888.2A
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English (en)
Chinese (zh)
Inventor
菅原信之
神林明日香
铃木凉
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Sony Interactive Entertainment Inc
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Sony Interactive Entertainment Inc
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Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of CN116157913A publication Critical patent/CN116157913A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/103—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols alphanumeric information, e.g. words, letters or serial numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/106—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols digital information, e.g. bar codes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/603—Formed on wafers or substrates before dicing and remaining on chips after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
CN202180058888.2A 2020-09-24 2021-09-17 半导体封装、电子设备和电子设备制造方法 Pending CN116157913A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020159895 2020-09-24
JP2020-159895 2020-09-24
PCT/JP2021/034411 WO2022065257A1 (ja) 2020-09-24 2021-09-17 半導体パッケージ、電子機器、及び電子機器の製造方法

Publications (1)

Publication Number Publication Date
CN116157913A true CN116157913A (zh) 2023-05-23

Family

ID=80845377

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180058888.2A Pending CN116157913A (zh) 2020-09-24 2021-09-17 半导体封装、电子设备和电子设备制造方法

Country Status (6)

Country Link
US (1) US20230298963A1 (https=)
EP (1) EP4220703A4 (https=)
JP (1) JP7504214B2 (https=)
CN (1) CN116157913A (https=)
TW (1) TW202220064A (https=)
WO (1) WO2022065257A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI879409B (zh) * 2024-01-30 2025-04-01 矽品精密工業股份有限公司 半導體封裝結構及其製法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594263A (en) * 1984-12-17 1986-06-10 Motorola, Inc. Laser marking method and ablative coating for use therein
JPH01216558A (ja) * 1988-02-24 1989-08-30 Hitachi Ltd 半導体装置
JP3437369B2 (ja) * 1996-03-19 2003-08-18 松下電器産業株式会社 チップキャリアおよびこれを用いた半導体装置
JP2002016102A (ja) * 2000-06-28 2002-01-18 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US6984876B2 (en) * 2004-05-27 2006-01-10 Semiconductor Components Industries, L.L.C. Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
JP4589269B2 (ja) 2006-06-16 2010-12-01 ソニー株式会社 半導体装置およびその製造方法
US7667949B2 (en) * 2006-08-05 2010-02-23 John Maxwell Capacitor having improved surface breakdown voltage performance and method for marking same
US7489033B2 (en) * 2006-11-10 2009-02-10 Intel Corporation Electronic assembly with hot spot cooling
JP5184003B2 (ja) * 2007-08-28 2013-04-17 川崎マイクロエレクトロニクス株式会社 半導体集積回路およびダミーパターンの配置方法
JP2009194321A (ja) * 2008-02-18 2009-08-27 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、半導体パッケージ
US8187897B2 (en) * 2008-08-19 2012-05-29 International Business Machines Corporation Fabricating product chips and die with a feature pattern that contains information relating to the product chip
US8522569B2 (en) * 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
US20110259951A1 (en) * 2010-04-26 2011-10-27 Medtronic, Inc. Method for Tracing Individual Dies
JP5609680B2 (ja) 2010-08-27 2014-10-22 ソニー株式会社 放熱構造及び電子機器
US9589900B2 (en) * 2014-02-27 2017-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Metal pad for laser marking
US9832860B2 (en) * 2014-09-26 2017-11-28 Intel Corporation Panel level fabrication of package substrates with integrated stiffeners
JP6542891B2 (ja) * 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 低い熱インピーダンスを有する高性能熱界面材料
CN107112250B (zh) * 2014-12-16 2019-11-05 德卡技术股份有限公司 标记半导体封装的方法
JP2016192444A (ja) * 2015-03-30 2016-11-10 株式会社東芝 半導体装置
US20220262759A1 (en) * 2019-02-04 2022-08-18 Sony Interactive Entertainment Inc. Electronic apparatus, semiconductor device, insulating sheet, and semiconductor device manufacturing method

Also Published As

Publication number Publication date
EP4220703A4 (en) 2025-01-08
JP7504214B2 (ja) 2024-06-21
JPWO2022065257A1 (https=) 2022-03-31
US20230298963A1 (en) 2023-09-21
TW202220064A (zh) 2022-05-16
EP4220703A1 (en) 2023-08-02
WO2022065257A1 (ja) 2022-03-31

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