JPWO2022065257A5 - - Google Patents
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- Publication number
- JPWO2022065257A5 JPWO2022065257A5 JP2022551967A JP2022551967A JPWO2022065257A5 JP WO2022065257 A5 JPWO2022065257 A5 JP WO2022065257A5 JP 2022551967 A JP2022551967 A JP 2022551967A JP 2022551967 A JP2022551967 A JP 2022551967A JP WO2022065257 A5 JPWO2022065257 A5 JP WO2022065257A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- package
- semiconductor
- information
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 458
- 239000004020 conductor Substances 0.000 claims description 125
- 239000003351 stiffener Substances 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 34
- 239000002335 surface treatment layer Substances 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 26
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 description 46
- 239000003990 capacitor Substances 0.000 description 25
- 238000001816 cooling Methods 0.000 description 15
- 239000007788 liquid Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000008439 repair process Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000004519 grease Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020159895 | 2020-09-24 | ||
| JP2020159895 | 2020-09-24 | ||
| PCT/JP2021/034411 WO2022065257A1 (ja) | 2020-09-24 | 2021-09-17 | 半導体パッケージ、電子機器、及び電子機器の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022065257A1 JPWO2022065257A1 (https=) | 2022-03-31 |
| JPWO2022065257A5 true JPWO2022065257A5 (https=) | 2023-06-08 |
| JP7504214B2 JP7504214B2 (ja) | 2024-06-21 |
Family
ID=80845377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022551967A Active JP7504214B2 (ja) | 2020-09-24 | 2021-09-17 | 半導体パッケージ、電子機器、及び電子機器の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230298963A1 (https=) |
| EP (1) | EP4220703A4 (https=) |
| JP (1) | JP7504214B2 (https=) |
| CN (1) | CN116157913A (https=) |
| TW (1) | TW202220064A (https=) |
| WO (1) | WO2022065257A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI879409B (zh) * | 2024-01-30 | 2025-04-01 | 矽品精密工業股份有限公司 | 半導體封裝結構及其製法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4594263A (en) * | 1984-12-17 | 1986-06-10 | Motorola, Inc. | Laser marking method and ablative coating for use therein |
| JPH01216558A (ja) * | 1988-02-24 | 1989-08-30 | Hitachi Ltd | 半導体装置 |
| JP3437369B2 (ja) * | 1996-03-19 | 2003-08-18 | 松下電器産業株式会社 | チップキャリアおよびこれを用いた半導体装置 |
| JP2002016102A (ja) * | 2000-06-28 | 2002-01-18 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| US6984876B2 (en) * | 2004-05-27 | 2006-01-10 | Semiconductor Components Industries, L.L.C. | Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof |
| JP4589269B2 (ja) | 2006-06-16 | 2010-12-01 | ソニー株式会社 | 半導体装置およびその製造方法 |
| US7667949B2 (en) * | 2006-08-05 | 2010-02-23 | John Maxwell | Capacitor having improved surface breakdown voltage performance and method for marking same |
| US7489033B2 (en) * | 2006-11-10 | 2009-02-10 | Intel Corporation | Electronic assembly with hot spot cooling |
| JP5184003B2 (ja) * | 2007-08-28 | 2013-04-17 | 川崎マイクロエレクトロニクス株式会社 | 半導体集積回路およびダミーパターンの配置方法 |
| JP2009194321A (ja) * | 2008-02-18 | 2009-08-27 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、半導体パッケージ |
| US8187897B2 (en) * | 2008-08-19 | 2012-05-29 | International Business Machines Corporation | Fabricating product chips and die with a feature pattern that contains information relating to the product chip |
| US8522569B2 (en) * | 2009-10-27 | 2013-09-03 | Industrial Idea Partners, Inc. | Utilization of data center waste heat for heat driven engine |
| US20110259951A1 (en) * | 2010-04-26 | 2011-10-27 | Medtronic, Inc. | Method for Tracing Individual Dies |
| JP5609680B2 (ja) | 2010-08-27 | 2014-10-22 | ソニー株式会社 | 放熱構造及び電子機器 |
| US9589900B2 (en) * | 2014-02-27 | 2017-03-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal pad for laser marking |
| US9832860B2 (en) * | 2014-09-26 | 2017-11-28 | Intel Corporation | Panel level fabrication of package substrates with integrated stiffeners |
| JP6542891B2 (ja) * | 2014-12-05 | 2019-07-10 | ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． | 低い熱インピーダンスを有する高性能熱界面材料 |
| CN107112250B (zh) * | 2014-12-16 | 2019-11-05 | 德卡技术股份有限公司 | 标记半导体封装的方法 |
| JP2016192444A (ja) * | 2015-03-30 | 2016-11-10 | 株式会社東芝 | 半導体装置 |
| US20220262759A1 (en) * | 2019-02-04 | 2022-08-18 | Sony Interactive Entertainment Inc. | Electronic apparatus, semiconductor device, insulating sheet, and semiconductor device manufacturing method |
-
2021
- 2021-09-16 TW TW110134544A patent/TW202220064A/zh unknown
- 2021-09-17 CN CN202180058888.2A patent/CN116157913A/zh active Pending
- 2021-09-17 EP EP21872386.4A patent/EP4220703A4/en active Pending
- 2021-09-17 WO PCT/JP2021/034411 patent/WO2022065257A1/ja not_active Ceased
- 2021-09-17 JP JP2022551967A patent/JP7504214B2/ja active Active
- 2021-09-17 US US18/044,847 patent/US20230298963A1/en active Pending
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