JPWO2022018561A1 - - Google Patents
Info
- Publication number
- JPWO2022018561A1 JPWO2022018561A1 JP2022538486A JP2022538486A JPWO2022018561A1 JP WO2022018561 A1 JPWO2022018561 A1 JP WO2022018561A1 JP 2022538486 A JP2022538486 A JP 2022538486A JP 2022538486 A JP2022538486 A JP 2022538486A JP WO2022018561 A1 JPWO2022018561 A1 JP WO2022018561A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
- G06F7/38—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
- G06F7/48—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
- G06F7/544—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices for evaluating functions by calculation
- G06F7/5443—Sum of products
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Optimization (AREA)
- Mathematical Analysis (AREA)
- Computing Systems (AREA)
- Pure & Applied Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computational Mathematics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Thin Film Transistor (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025084797A JP2025113384A (ja) | 2020-07-24 | 2025-05-21 | 撮像装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020125984 | 2020-07-24 | ||
| JP2020125984 | 2020-07-24 | ||
| PCT/IB2021/056222 WO2022018561A1 (ja) | 2020-07-24 | 2021-07-12 | 撮像装置および電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025084797A Division JP2025113384A (ja) | 2020-07-24 | 2025-05-21 | 撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022018561A1 true JPWO2022018561A1 (https=) | 2022-01-27 |
| JP7686648B2 JP7686648B2 (ja) | 2025-06-02 |
Family
ID=79728640
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022538486A Active JP7686648B2 (ja) | 2020-07-24 | 2021-07-12 | 撮像装置および電子機器 |
| JP2025084797A Pending JP2025113384A (ja) | 2020-07-24 | 2025-05-21 | 撮像装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025084797A Pending JP2025113384A (ja) | 2020-07-24 | 2025-05-21 | 撮像装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US12120446B2 (https=) |
| JP (2) | JP7686648B2 (https=) |
| KR (1) | KR20230047331A (https=) |
| CN (1) | CN116018818A (https=) |
| DE (1) | DE112021003951T5 (https=) |
| TW (2) | TW202549590A (https=) |
| WO (1) | WO2022018561A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12413876B2 (en) * | 2022-12-21 | 2025-09-09 | Meta Platforms Technologies, Llc | Multi-mode sensor assembly for light detection |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012222649A (ja) * | 2011-04-11 | 2012-11-12 | Sony Corp | 固体撮像素子およびカメラシステム |
| JP2016123087A (ja) * | 2014-12-10 | 2016-07-07 | 株式会社半導体エネルギー研究所 | 半導体装置および電子機器 |
| WO2017168665A1 (ja) * | 2016-03-30 | 2017-10-05 | 株式会社ニコン | 特徴抽出素子、特徴抽出システム、および判定装置 |
| JP2018041943A (ja) * | 2015-12-28 | 2018-03-15 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0519105B1 (en) | 1991-06-20 | 1995-08-02 | Hewlett-Packard GmbH | Photodiode array |
| US6919551B2 (en) | 2002-08-29 | 2005-07-19 | Micron Technology Inc. | Differential column readout scheme for CMOS APS pixels |
| JP4743007B2 (ja) | 2006-06-16 | 2011-08-10 | ソニー株式会社 | 画像処理装置および画像処理方法、記録媒体、並びに、プログラム |
| JP2009193429A (ja) * | 2008-02-15 | 2009-08-27 | Mitsubishi Electric Corp | 画像読取装置 |
| JP5642344B2 (ja) | 2008-11-21 | 2014-12-17 | オリンパスイメージング株式会社 | 画像処理装置、画像処理方法、および、画像処理プログラム |
| KR101645680B1 (ko) | 2009-11-06 | 2016-08-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5526840B2 (ja) | 2010-02-09 | 2014-06-18 | ソニー株式会社 | 画像信号処理装置、撮像装置、画像信号処理方法、およびプログラム |
| KR101303868B1 (ko) | 2011-10-13 | 2013-09-04 | 한국과학기술연구원 | 컬러 이미지 센서 |
| JP2013258675A (ja) | 2012-05-16 | 2013-12-26 | Canon Inc | 画像処理装置、画像処理方法およびプログラム、並びに撮像装置 |
| WO2016046685A1 (en) | 2014-09-26 | 2016-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
| US9940533B2 (en) | 2014-09-30 | 2018-04-10 | Qualcomm Incorporated | Scanning window for isolating pixel values in hardware for computer vision operations |
| WO2017009944A1 (ja) | 2015-07-14 | 2017-01-19 | オリンパス株式会社 | 固体撮像装置 |
| US11403833B2 (en) | 2017-05-18 | 2022-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Image detection module and information management system |
| CN114628425A (zh) * | 2017-05-26 | 2022-06-14 | 株式会社半导体能源研究所 | 摄像装置及电子设备 |
| JP6956784B2 (ja) | 2017-06-08 | 2021-11-02 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| WO2018229594A1 (ja) | 2017-06-14 | 2018-12-20 | 株式会社半導体エネルギー研究所 | 撮像装置、及び電子機器 |
| WO2019069614A1 (ja) * | 2017-10-03 | 2019-04-11 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子及び電子機器 |
| KR20220003568A (ko) | 2019-04-29 | 2022-01-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치, 그 동작 방법, 및 전자 기기 |
| US12080736B2 (en) | 2019-08-22 | 2024-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
| WO2021130590A1 (ja) | 2019-12-27 | 2021-07-01 | 株式会社半導体エネルギー研究所 | 撮像装置、および電子機器 |
| DE112021002375T5 (de) | 2020-04-17 | 2023-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Abbildungsvorrichtung und elektronisches Gerät |
-
2021
- 2021-07-12 WO PCT/IB2021/056222 patent/WO2022018561A1/ja not_active Ceased
- 2021-07-12 DE DE112021003951.2T patent/DE112021003951T5/de active Pending
- 2021-07-12 JP JP2022538486A patent/JP7686648B2/ja active Active
- 2021-07-12 KR KR1020227045104A patent/KR20230047331A/ko active Pending
- 2021-07-12 CN CN202180043372.0A patent/CN116018818A/zh active Pending
- 2021-07-12 US US18/008,302 patent/US12120446B2/en active Active
- 2021-07-16 TW TW114131377A patent/TW202549590A/zh unknown
- 2021-07-16 TW TW110126178A patent/TWI897996B/zh active
-
2024
- 2024-10-09 US US18/910,318 patent/US20250088769A1/en active Pending
-
2025
- 2025-05-21 JP JP2025084797A patent/JP2025113384A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012222649A (ja) * | 2011-04-11 | 2012-11-12 | Sony Corp | 固体撮像素子およびカメラシステム |
| JP2016123087A (ja) * | 2014-12-10 | 2016-07-07 | 株式会社半導体エネルギー研究所 | 半導体装置および電子機器 |
| JP2018041943A (ja) * | 2015-12-28 | 2018-03-15 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
| WO2017168665A1 (ja) * | 2016-03-30 | 2017-10-05 | 株式会社ニコン | 特徴抽出素子、特徴抽出システム、および判定装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021003951T5 (de) | 2023-06-07 |
| TW202209659A (zh) | 2022-03-01 |
| JP7686648B2 (ja) | 2025-06-02 |
| US20230179888A1 (en) | 2023-06-08 |
| TW202549590A (zh) | 2025-12-16 |
| WO2022018561A1 (ja) | 2022-01-27 |
| US12120446B2 (en) | 2024-10-15 |
| US20250088769A1 (en) | 2025-03-13 |
| JP2025113384A (ja) | 2025-08-01 |
| TWI897996B (zh) | 2025-09-21 |
| CN116018818A (zh) | 2023-04-25 |
| KR20230047331A (ko) | 2023-04-07 |
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