JPWO2022016124A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022016124A5
JPWO2022016124A5 JP2023502905A JP2023502905A JPWO2022016124A5 JP WO2022016124 A5 JPWO2022016124 A5 JP WO2022016124A5 JP 2023502905 A JP2023502905 A JP 2023502905A JP 2023502905 A JP2023502905 A JP 2023502905A JP WO2022016124 A5 JPWO2022016124 A5 JP WO2022016124A5
Authority
JP
Japan
Prior art keywords
optionally substituted
tantalum
deposition
based precursor
organometallic compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023502905A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023534961A5 (https=
JP7774611B2 (ja
JP2023534961A (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/042104 external-priority patent/WO2022016124A1/en
Publication of JP2023534961A publication Critical patent/JP2023534961A/ja
Publication of JP2023534961A5 publication Critical patent/JP2023534961A5/ja
Publication of JPWO2022016124A5 publication Critical patent/JPWO2022016124A5/ja
Application granted granted Critical
Publication of JP7774611B2 publication Critical patent/JP7774611B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023502905A 2020-07-17 2021-07-16 被膜を形成するための方法 Active JP7774611B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062705853P 2020-07-17 2020-07-17
US62/705,853 2020-07-17
PCT/US2021/042104 WO2022016124A1 (en) 2020-07-17 2021-07-16 Photoresists containing tantalum

Publications (4)

Publication Number Publication Date
JP2023534961A JP2023534961A (ja) 2023-08-15
JP2023534961A5 JP2023534961A5 (https=) 2024-07-19
JPWO2022016124A5 true JPWO2022016124A5 (https=) 2024-07-19
JP7774611B2 JP7774611B2 (ja) 2025-11-21

Family

ID=79555033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023502905A Active JP7774611B2 (ja) 2020-07-17 2021-07-16 被膜を形成するための方法

Country Status (6)

Country Link
US (1) US20230288798A1 (https=)
JP (1) JP7774611B2 (https=)
KR (1) KR102846049B1 (https=)
CN (1) CN116134381A (https=)
TW (1) TWI912334B (https=)
WO (1) WO2022016124A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10796912B2 (en) 2017-05-16 2020-10-06 Lam Research Corporation Eliminating yield impact of stochastics in lithography
KR102678588B1 (ko) 2018-11-14 2024-06-27 램 리써치 코포레이션 차세대 리소그래피에서 유용한 하드 마스크들을 제조하기 위한 방법들
US12211691B2 (en) 2018-12-20 2025-01-28 Lam Research Corporation Dry development of resists
TW202514246A (zh) 2019-03-18 2025-04-01 美商蘭姆研究公司 基板處理方法與設備
US12062538B2 (en) 2019-04-30 2024-08-13 Lam Research Corporation Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
TWI910974B (zh) 2019-06-26 2026-01-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
JP7618601B2 (ja) 2019-06-28 2025-01-21 ラム リサーチ コーポレーション 複数のパターニング放射吸収元素および/または垂直組成勾配を備えたフォトレジスト
CN114200776A (zh) 2020-01-15 2022-03-18 朗姆研究公司 用于光刻胶粘附和剂量减少的底层
CN115244664A (zh) 2020-02-28 2022-10-25 朗姆研究公司 用于减少euv图案化缺陷的多层硬掩模
WO2022010809A1 (en) 2020-07-07 2022-01-13 Lam Research Corporation Integrated dry processes for patterning radiation photoresist patterning
WO2022103764A1 (en) 2020-11-13 2022-05-19 Lam Research Corporation Process tool for dry removal of photoresist
US12577466B2 (en) * 2020-12-08 2026-03-17 Lam Research Corporation Photoresist development with organic vapor
WO2023239628A1 (en) * 2022-06-06 2023-12-14 Inpria Corporation Gas-based development of organometallic resist in an oxidizing halogen-donating environment
KR102725782B1 (ko) 2022-07-01 2024-11-05 램 리써치 코포레이션 에칭 정지 억제 (etch stop deterrence) 를 위한 금속 옥사이드 기반 포토레지스트의 순환적 현상
US20240141497A1 (en) * 2022-10-26 2024-05-02 Applied Materials, Inc. Dielectric film surface restoration with reductive plasma
KR20250140553A (ko) * 2023-01-27 2025-09-25 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 시스템
US20240393684A1 (en) * 2023-05-23 2024-11-28 Samsung Sdi Co., Ltd. Method of forming patterns
KR20260012803A (ko) * 2023-05-24 2026-01-27 도오꾜오까고오교 가부시끼가이샤 패턴 형성 방법 및 금속 화합물 함유막용 처리액
JPWO2024242120A1 (https=) * 2023-05-24 2024-11-28
KR20250009842A (ko) * 2023-07-11 2025-01-20 광주과학기술원 건식 현상이 가능한 포토레지스트 조성물
KR20250034920A (ko) 2023-07-27 2025-03-11 램 리써치 코포레이션 금속-함유 포토레지스트에 대한 올-인-원 건식 현상
US20260099096A1 (en) * 2024-10-07 2026-04-09 Applied Materials, Inc. Batch processing tool for dry develop of extreme ultra violet (euv) resist layer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101589777B1 (ko) * 2008-08-01 2016-01-28 레르 리키드 쏘시에떼 아노님 뿌르 레?드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 기재 상에 탄탈-함유 층의 형성 방법
US9176377B2 (en) * 2010-06-01 2015-11-03 Inpria Corporation Patterned inorganic layers, radiation based patterning compositions and corresponding methods
CN108594599B (zh) * 2011-07-08 2022-04-22 Asml荷兰有限公司 抗蚀剂材料、光刻图案化方法和氧化物的用途
US8703386B2 (en) * 2012-02-27 2014-04-22 International Business Machines Corporation Metal peroxo compounds with organic co-ligands for electron beam, deep UV and extreme UV photoresist applications
US9324606B2 (en) * 2014-01-09 2016-04-26 Taiwan Semiconductor Manufacturing Co., Ltd. Self-aligned repairing process for barrier layer
TWI639179B (zh) * 2014-01-31 2018-10-21 美商蘭姆研究公司 真空整合硬遮罩製程及設備
US9922839B2 (en) * 2015-06-23 2018-03-20 Lam Research Corporation Low roughness EUV lithography
US9996004B2 (en) * 2015-11-20 2018-06-12 Lam Research Corporation EUV photopatterning of vapor-deposited metal oxide-containing hardmasks
WO2017209176A1 (ja) * 2016-06-02 2017-12-07 富士フイルム株式会社 積層体の製造方法、半導体素子の製造方法および積層体
JP2018017780A (ja) * 2016-07-25 2018-02-01 Jsr株式会社 感放射線性組成物及びパターン形成方法
US10494715B2 (en) * 2017-04-28 2019-12-03 Lam Research Corporation Atomic layer clean for removal of photoresist patterning scum
EP3791231A4 (en) * 2018-05-11 2022-01-26 Lam Research Corporation PROCESS FOR THE MANUFACTURE OF EUV SAMPLE HARD MASKS
KR102207893B1 (ko) * 2018-05-25 2021-01-25 삼성에스디아이 주식회사 반도체 레지스트용 조성물 및 이를 이용한 패턴 형성 방법

Similar Documents

Publication Publication Date Title
JPWO2022016124A5 (https=)
US11705332B2 (en) Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern
US20240134274A1 (en) Halogen-and aliphatic-containing organotin photoresists and methods thereof
TW202223538A (zh) 利用有機共反應物的乾式沉積光阻
US20250323038A1 (en) Photoresist layer outgassing prevention
US12585185B2 (en) Acid for reactive development of metal oxide resists
US12057315B2 (en) Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern
WO2023114724A1 (en) Development of hybrid organotin oxide photoresists
JPWO2022016127A5 (https=)
US12222643B2 (en) Method of manufacturing a semiconductor device and pattern formation method
KR102499934B1 (ko) 반도체 디바이스를 제조하는 방법
US20210305047A1 (en) Method of manufacturing a semiconductor device
US12272554B2 (en) Method of manufacturing a semiconductor device
JP7849665B2 (ja) 半導体基板の製造方法
JPH06194836A (ja) フォトレジスト組成物及びこれを用いたパターン形成方法
US20240385523A1 (en) Method of manufacturing a semiconductor device
US20230418156A1 (en) Method of manufacturing a semiconductor device and semiconductor device manufacturing tool
US20240353755A1 (en) Method of manufacturing a semiconductor device
KR20260033585A (ko) 유기주석 포토레지스트 및 포토리소그래피 패턴 현상 방법
JP2024538251A (ja) 多色露光のための局所的シャドウマスキング
TW202430712A (zh) 用於沉積euv敏感性膜的方法及相關系統