JPWO2022004046A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022004046A5
JPWO2022004046A5 JP2022533673A JP2022533673A JPWO2022004046A5 JP WO2022004046 A5 JPWO2022004046 A5 JP WO2022004046A5 JP 2022533673 A JP2022533673 A JP 2022533673A JP 2022533673 A JP2022533673 A JP 2022533673A JP WO2022004046 A5 JPWO2022004046 A5 JP WO2022004046A5
Authority
JP
Japan
Prior art keywords
polarity face
group
face
nitride
growth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022533673A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022004046A1 (https=
JP7670716B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/006355 external-priority patent/WO2022004046A1/ja
Publication of JPWO2022004046A1 publication Critical patent/JPWO2022004046A1/ja
Publication of JPWO2022004046A5 publication Critical patent/JPWO2022004046A5/ja
Application granted granted Critical
Publication of JP7670716B2 publication Critical patent/JP7670716B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022533673A 2020-06-29 2021-02-19 エピタキシャル結晶成長用自立基板および機能素子 Active JP7670716B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020111783 2020-06-29
JP2020111783 2020-06-29
PCT/JP2021/006355 WO2022004046A1 (ja) 2020-06-29 2021-02-19 エピタキシャル結晶成長用自立基板および機能素子

Publications (3)

Publication Number Publication Date
JPWO2022004046A1 JPWO2022004046A1 (https=) 2022-01-06
JPWO2022004046A5 true JPWO2022004046A5 (https=) 2024-06-19
JP7670716B2 JP7670716B2 (ja) 2025-04-30

Family

ID=79315241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533673A Active JP7670716B2 (ja) 2020-06-29 2021-02-19 エピタキシャル結晶成長用自立基板および機能素子

Country Status (5)

Country Link
US (1) US12564023B2 (https=)
JP (1) JP7670716B2 (https=)
CN (1) CN115698394A (https=)
DE (1) DE112021003487B4 (https=)
WO (1) WO2022004046A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023105952A (ja) * 2022-01-20 2023-08-01 スタンレー電気株式会社 単結晶AlN基板、単結晶AlN基板を用いた半導体ウェハ、及びこれらの製造方法
WO2023181586A1 (ja) * 2022-03-25 2023-09-28 株式会社トクヤマ 窒化アルミニウム単結晶基板、及び窒化アルミニウム単結晶基板の製造方法
WO2025220294A1 (ja) * 2024-04-16 2025-10-23 パナソニックホールディングス株式会社 Iii族窒化物結晶の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356398A (ja) * 2001-06-01 2002-12-13 Sumitomo Electric Ind Ltd 窒化ガリウムウエハ
JP3534115B1 (ja) 2003-04-02 2004-06-07 住友電気工業株式会社 エッジ研磨した窒化物半導体基板とエッジ研磨したGaN自立基板及び窒化物半導体基板のエッジ加工方法
JP4232605B2 (ja) 2003-10-30 2009-03-04 住友電気工業株式会社 窒化物半導体基板の製造方法と窒化物半導体基板
TW200707799A (en) * 2005-04-21 2007-02-16 Aonex Technologies Inc Bonded intermediate substrate and method of making same
JP2006347776A (ja) * 2005-06-13 2006-12-28 Sumitomo Metal Mining Co Ltd サファイア基板およびその製造方法
JP4696935B2 (ja) 2006-01-27 2011-06-08 日立電線株式会社 Iii−v族窒化物系半導体基板及びiii−v族窒化物系発光素子
JP2007284283A (ja) * 2006-04-14 2007-11-01 Hitachi Cable Ltd GaN単結晶基板の加工方法及びGaN単結晶基板
FR2917232B1 (fr) * 2007-06-06 2009-10-09 Soitec Silicon On Insulator Procede de fabrication d'une structure pour epitaxie sans zone d'exclusion.
JP4794527B2 (ja) 2007-10-05 2011-10-19 株式会社フジクラ 半導体装置及びその製造方法
JP2009126727A (ja) 2007-11-20 2009-06-11 Sumitomo Electric Ind Ltd GaN基板の製造方法、GaN基板及び半導体デバイス
JP4404162B2 (ja) * 2008-02-27 2010-01-27 住友電気工業株式会社 窒化物半導体ウエハ−
JP4395812B2 (ja) * 2008-02-27 2010-01-13 住友電気工業株式会社 窒化物半導体ウエハ−加工方法
JP2011077508A (ja) * 2009-09-02 2011-04-14 Mitsubishi Chemicals Corp 窒化物半導体基板の製造方法
JP5146432B2 (ja) * 2009-09-29 2013-02-20 豊田合成株式会社 Iii族窒化物系化合物半導体のエピタキシャル成長方法及びiii族窒化物系化合物半導体素子の製造方法
JP2010045397A (ja) * 2009-11-17 2010-02-25 Sumitomo Electric Ind Ltd 窒化ガリウムウエハ
JP5737189B2 (ja) * 2010-01-15 2015-06-17 三菱化学株式会社 単結晶基板、それを用いて得られるiii族窒化物結晶及びiii族窒化物結晶の製造方法
JP5613072B2 (ja) * 2011-01-31 2014-10-22 新電元工業株式会社 半導体ウエハーのダイシング方法
DE102013210057A1 (de) * 2013-05-29 2014-12-04 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe

Similar Documents

Publication Publication Date Title
JPWO2022004046A5 (https=)
USD1096689S1 (en) Light element for a loudspeaker
Yoshida et al. Epitaxial growth of aluminum nitride films on sapphire by reactive evaporation
USD932339S1 (en) Combined bracelet and clasp
RU2009128751A (ru) Сапфировые подложки и способы их изготовления
TWD205258S (zh) 食品罐
JP2000228367A (ja) GaN膜の製造方法
USD783413S1 (en) Plastic can liner film with repeating surface pattern
WO2006099138A3 (en) Technique for the growth of planar semi-polar gallium nitride
TWD202743S (zh) 食品罐
WO2009035095A1 (ja) エピタキシャルSiC単結晶基板及びエピタキシャルSiC単結晶基板の製造方法
EP1975984A3 (en) Compound semiconductor device including ain layer of controlled skewness
CA2467318A1 (en) Fasteners for composite material
JP2006524427A5 (https=)
WO2017121232A1 (zh) 氮化物底层及其制作方法
USD928989S1 (en) Shingle
TWD224339S (zh) 植物用固定夾
US20120043528A1 (en) Homo-material heterophased quantum well
WO2015043099A1 (zh) 形成截面为多边形的具有辨识或倒角的晶棒、衬底方法及晶棒和衬底
EP4451489A3 (en) Monolithically integrated gain element
JP2008290919A5 (https=)
SE9702220D0 (sv) A semiconductor device with a junction termination and a method for production thereof
TW200603445A (en) Gallium nitride-based semiconductor stacked structure, production method thereof, and compound semiconductor and light-emitting device each using the stacked structure
JP2018170491A5 (https=)
TW200633266A (en) Gallium nitride-based semiconductor stacked structure, method for fabrication thereof, gallium nitride-based semiconductor device and lamp using the device