JPWO2021250182A5 - - Google Patents
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- JPWO2021250182A5 JPWO2021250182A5 JP2022576342A JP2022576342A JPWO2021250182A5 JP WO2021250182 A5 JPWO2021250182 A5 JP WO2021250182A5 JP 2022576342 A JP2022576342 A JP 2022576342A JP 2022576342 A JP2022576342 A JP 2022576342A JP WO2021250182 A5 JPWO2021250182 A5 JP WO2021250182A5
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- JP
- Japan
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- group
- compounds
- alkyl
- hydrogen
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20179696.8A EP3922755A1 (en) | 2020-06-12 | 2020-06-12 | An aqueous basic etching composition for the treatment of surfaces of metal substrates |
| EP20179696.8 | 2020-06-12 | ||
| PCT/EP2021/065663 WO2021250182A1 (en) | 2020-06-12 | 2021-06-10 | An aqueous basic etching composition for the treatment of surfaces of metal substrates |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2023529004A JP2023529004A (ja) | 2023-07-06 |
| JPWO2021250182A5 true JPWO2021250182A5 (https=) | 2024-06-11 |
| JP2023529004A5 JP2023529004A5 (https=) | 2024-06-11 |
| JP7757324B2 JP7757324B2 (ja) | 2025-10-21 |
Family
ID=71094162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022576342A Active JP7757324B2 (ja) | 2020-06-12 | 2021-06-10 | 金属基材表面処理用の塩基性水系エッチング組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230220558A1 (https=) |
| EP (2) | EP3922755A1 (https=) |
| JP (1) | JP7757324B2 (https=) |
| KR (1) | KR20230024301A (https=) |
| CN (1) | CN115702261A (https=) |
| WO (1) | WO2021250182A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230243041A1 (en) * | 2022-01-28 | 2023-08-03 | Texas Instruments Incorporated | Etching compositions |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3668131A (en) * | 1968-08-09 | 1972-06-06 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
| US3809588A (en) * | 1969-11-03 | 1974-05-07 | R Zeblisky | Peroxy containing compositions |
| US4311551A (en) * | 1979-04-12 | 1982-01-19 | Philip A. Hunt Chemical Corp. | Composition and method for etching copper substrates |
| JPS5928035Y2 (ja) * | 1979-10-09 | 1984-08-14 | 凸版印刷株式会社 | 残渣回収装置 |
| US4784785A (en) * | 1987-12-29 | 1988-11-15 | Macdermid, Incorporated | Copper etchant compositions |
| JPH0718472A (ja) * | 1993-07-06 | 1995-01-20 | Ebara Yuujiraito Kk | 銅・銅合金材のための浸漬エッチング液 |
| JP3252186B2 (ja) * | 1993-07-19 | 2002-01-28 | 大塚化学株式会社 | エッチング剤 |
| DE10066028C2 (de) | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
| CN101392376A (zh) | 2007-09-19 | 2009-03-25 | 长瀬化成株式会社 | 蚀刻组合物 |
| JP4521460B2 (ja) * | 2008-02-20 | 2010-08-11 | メック株式会社 | エッチング液及びこれを用いた銅配線の形成方法 |
| EP2099268A1 (en) | 2008-03-07 | 2009-09-09 | Atotech Deutschland Gmbh | Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate |
| JP6101421B2 (ja) * | 2010-08-16 | 2017-03-22 | インテグリス・インコーポレーテッド | 銅または銅合金用エッチング液 |
| JP6599322B2 (ja) * | 2013-10-21 | 2019-10-30 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 表面の残留物を除去するための洗浄配合物 |
| KR20230129193A (ko) | 2013-12-06 | 2023-09-06 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 표면 잔류물 제거용 세정 제형 |
| EP3159432B1 (en) | 2015-10-23 | 2020-08-05 | ATOTECH Deutschland GmbH | Surface treatment agent for copper and copper alloy surfaces |
| CN109778194A (zh) * | 2019-03-22 | 2019-05-21 | 深圳市祺鑫天正环保科技有限公司 | 碱性蚀刻再生液的添加剂和碱性蚀刻再生液 |
-
2020
- 2020-06-12 EP EP20179696.8A patent/EP3922755A1/en active Pending
-
2021
- 2021-06-10 US US18/000,480 patent/US20230220558A1/en active Pending
- 2021-06-10 CN CN202180041538.5A patent/CN115702261A/zh active Pending
- 2021-06-10 WO PCT/EP2021/065663 patent/WO2021250182A1/en not_active Ceased
- 2021-06-10 KR KR1020227046318A patent/KR20230024301A/ko active Pending
- 2021-06-10 JP JP2022576342A patent/JP7757324B2/ja active Active
- 2021-06-10 EP EP21731175.2A patent/EP4165228A1/en active Pending
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