JPWO2021245907A5 - - Google Patents

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Publication number
JPWO2021245907A5
JPWO2021245907A5 JP2022528369A JP2022528369A JPWO2021245907A5 JP WO2021245907 A5 JPWO2021245907 A5 JP WO2021245907A5 JP 2022528369 A JP2022528369 A JP 2022528369A JP 2022528369 A JP2022528369 A JP 2022528369A JP WO2021245907 A5 JPWO2021245907 A5 JP WO2021245907A5
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JP
Japan
Prior art keywords
substrate
optical
electric
integrated module
housing
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JP2022528369A
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English (en)
Japanese (ja)
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JP7372576B2 (ja
JPWO2021245907A1 (https=
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Priority claimed from PCT/JP2020/022253 external-priority patent/WO2021245907A1/ja
Publication of JPWO2021245907A1 publication Critical patent/JPWO2021245907A1/ja
Publication of JPWO2021245907A5 publication Critical patent/JPWO2021245907A5/ja
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Publication of JP7372576B2 publication Critical patent/JP7372576B2/ja
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JP2022528369A 2020-06-05 2020-06-05 光電子集積モジュール Active JP7372576B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/022253 WO2021245907A1 (ja) 2020-06-05 2020-06-05 光電子集積モジュール

Publications (3)

Publication Number Publication Date
JPWO2021245907A1 JPWO2021245907A1 (https=) 2021-12-09
JPWO2021245907A5 true JPWO2021245907A5 (https=) 2022-12-02
JP7372576B2 JP7372576B2 (ja) 2023-11-01

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ID=78830744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022528369A Active JP7372576B2 (ja) 2020-06-05 2020-06-05 光電子集積モジュール

Country Status (3)

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US (1) US12332489B2 (https=)
JP (1) JP7372576B2 (https=)
WO (1) WO2021245907A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114899182B (zh) * 2022-04-25 2026-01-23 深圳市思坦科技有限公司 微型led器件的封装结构及方法以及显示装置
CN116344629B (zh) * 2023-02-24 2025-09-30 深南电路股份有限公司 一种基于玻璃波导的光电混合器件及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073651A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd 半導体装置
JP4766087B2 (ja) * 2007-12-14 2011-09-07 株式会社デンソー 電子装置
US8111730B2 (en) * 2009-08-20 2012-02-07 International Business Machines Corporation 3D optoelectronic packaging
JP2012114334A (ja) * 2010-11-26 2012-06-14 Nec Casio Mobile Communications Ltd キャビティ基板を備える半導体モジュール、その不良解析方法、及び該半導体モジュールの製造方法
WO2014020787A1 (ja) * 2012-08-03 2014-02-06 パナソニック株式会社 電子部品モジュールとその実装体
JP2015029043A (ja) * 2013-06-26 2015-02-12 京セラ株式会社 電子装置および光モジュール
US9543226B1 (en) * 2015-10-07 2017-01-10 Coriant Advanced Technology, LLC Heat sink for a semiconductor chip device

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