JPWO2021193530A1 - - Google Patents

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Publication number
JPWO2021193530A1
JPWO2021193530A1 JP2021516713A JP2021516713A JPWO2021193530A1 JP WO2021193530 A1 JPWO2021193530 A1 JP WO2021193530A1 JP 2021516713 A JP2021516713 A JP 2021516713A JP 2021516713 A JP2021516713 A JP 2021516713A JP WO2021193530 A1 JPWO2021193530 A1 JP WO2021193530A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021516713A
Other versions
JPWO2021193530A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021193530A1 publication Critical patent/JPWO2021193530A1/ja
Publication of JPWO2021193530A5 publication Critical patent/JPWO2021193530A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
JP2021516713A 2020-03-24 2021-03-22 Pending JPWO2021193530A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020052296 2020-03-24
PCT/JP2021/011710 WO2021193530A1 (ja) 2020-03-24 2021-03-22 樹脂膜、その製造方法、樹脂組成物、ディスプレイおよびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021193530A1 true JPWO2021193530A1 (ja) 2021-09-30
JPWO2021193530A5 JPWO2021193530A5 (ja) 2024-02-20

Family

ID=77892131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021516713A Pending JPWO2021193530A1 (ja) 2020-03-24 2021-03-22

Country Status (5)

Country Link
US (1) US20230167252A1 (ja)
JP (1) JPWO2021193530A1 (ja)
KR (1) KR20220157949A (ja)
CN (1) CN115315462A (ja)
WO (1) WO2021193530A1 (ja)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2619515B2 (ja) * 1989-02-02 1997-06-11 チッソ株式会社 シリコンポリイミド前駆体組成物
JPH05310934A (ja) * 1992-05-11 1993-11-22 Chisso Corp 接着性ポリイミドフィルムの製造方法
JPH06235922A (ja) * 1993-02-09 1994-08-23 Japan Synthetic Rubber Co Ltd 液晶配向剤
CN1135418C (zh) * 1999-11-30 2004-01-21 株式会社日立制作所 液晶显示器和塑料组合物
JP2012149196A (ja) * 2011-01-21 2012-08-09 Jnc Corp 熱硬化性組成物、硬化膜、及び表示素子
JPWO2014123045A1 (ja) * 2013-02-07 2017-02-02 株式会社カネカ アルコキシシラン変性ポリアミド酸溶液、それを用いた積層体およびフレキシブルデバイス、並びに積層体の製造方法
KR102164313B1 (ko) * 2013-12-02 2020-10-13 삼성전자주식회사 폴리(이미드-아미드) 코폴리머, 상기 폴리(이미드-아미드) 코폴리머를 포함하는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치
JP6413434B2 (ja) * 2014-07-25 2018-10-31 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体の製造方法、ポリイミド成形体、及びポリイミド成形体の製造方法
KR102502596B1 (ko) 2015-03-27 2023-02-22 삼성전자주식회사 조성물, 이로부터 제조된 복합체, 및 이를 포함하는 필름 및 전자 소자
JP6491742B2 (ja) * 2015-04-17 2019-03-27 旭化成株式会社 樹脂組成物、ポリイミド樹脂膜、及びその製造方法
KR101916647B1 (ko) 2015-12-11 2018-11-07 도레이 카부시키가이샤 수지 조성물, 수지의 제조 방법, 수지막의 제조 방법 및 전자 디바이스의 제조 방법
CN105601964A (zh) * 2015-12-30 2016-05-25 西北工业大学 超低介电常数、低介电损耗聚酰亚胺薄膜的制备方法
JP6754607B2 (ja) * 2016-04-27 2020-09-16 株式会社カネカ アルコキシシラン変性ポリイミド前駆体溶液、積層体およびフレキシブルデバイスの製造方法
JP6292351B1 (ja) 2016-06-24 2018-03-14 東レ株式会社 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法
CN111601840A (zh) * 2018-01-18 2020-08-28 东丽株式会社 显示器基板用树脂组合物、显示器基板用树脂膜及包含其的层叠体、图像显示装置、有机el显示器、以及它们的制造方法
JP2020033540A (ja) * 2018-08-28 2020-03-05 日立化成株式会社 シルセスキオキサン含有ポリイミド
CN110229332A (zh) * 2019-06-15 2019-09-13 深圳市创智成功科技有限公司 耐等离子蚀刻的笼型倍半硅氧烷聚酰胺酸聚合物及其制备方法

Also Published As

Publication number Publication date
WO2021193530A1 (ja) 2021-09-30
CN115315462A (zh) 2022-11-08
US20230167252A1 (en) 2023-06-01
KR20220157949A (ko) 2022-11-29

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