JPWO2021193514A1 - - Google Patents
Info
- Publication number
- JPWO2021193514A1 JPWO2021193514A1 JP2022510469A JP2022510469A JPWO2021193514A1 JP WO2021193514 A1 JPWO2021193514 A1 JP WO2021193514A1 JP 2022510469 A JP2022510469 A JP 2022510469A JP 2022510469 A JP2022510469 A JP 2022510469A JP WO2021193514 A1 JPWO2021193514 A1 JP WO2021193514A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5027—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
- H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020050950 | 2020-03-23 | ||
| JP2020050950 | 2020-03-23 | ||
| PCT/JP2021/011673 WO2021193514A1 (ja) | 2020-03-23 | 2021-03-22 | 半導体基板の洗浄方法、加工された半導体基板の製造方法及び剥離用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021193514A1 true JPWO2021193514A1 (https=) | 2021-09-30 |
| JP7640937B2 JP7640937B2 (ja) | 2025-03-06 |
Family
ID=77892171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022510469A Active JP7640937B2 (ja) | 2020-03-23 | 2021-03-22 | 半導体基板の洗浄方法、加工された半導体基板の製造方法及び剥離用組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230151307A1 (https=) |
| EP (1) | EP4130222A4 (https=) |
| JP (1) | JP7640937B2 (https=) |
| KR (1) | KR20220157423A (https=) |
| CN (1) | CN115335971B (https=) |
| TW (1) | TW202146594A (https=) |
| WO (1) | WO2021193514A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4535403A4 (en) * | 2022-06-02 | 2026-05-06 | Nissan Chemical Corp | Photoradiation-releasable adhesive composition, laminate, and method for producing processed semiconductor substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013520009A (ja) * | 2010-02-12 | 2013-05-30 | ダウ コーニング コーポレーション | 半導体加工のための一時的ウェハー接着方法 |
| JP2013232459A (ja) * | 2012-04-27 | 2013-11-14 | Shin Etsu Chem Co Ltd | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP2014241399A (ja) * | 2013-05-14 | 2014-12-25 | 信越化学工業株式会社 | ウエハ用仮接着材料、それらを用いた仮接着用フィルム、及びウエハ加工体並びにそれらを使用した薄型ウエハの製造方法 |
| WO2015190438A1 (ja) * | 2014-06-10 | 2015-12-17 | 日産化学工業株式会社 | 仮接着剤を用いた積層体 |
| WO2016152598A1 (ja) * | 2015-03-23 | 2016-09-29 | 富士フイルム株式会社 | キットおよび積層体 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3479648B2 (ja) * | 2001-12-27 | 2003-12-15 | クラリアント インターナショナル リミテッド | ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法 |
| US6818608B2 (en) | 2002-02-01 | 2004-11-16 | John C. Moore | Cured polymers dissolving compositions |
| US8940104B2 (en) * | 2011-08-02 | 2015-01-27 | Brewer Science Inc. | Cleaning composition for temporary wafer bonding materials |
| JP2014133855A (ja) | 2012-12-11 | 2014-07-24 | Fujifilm Corp | シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法 |
| KR20150011072A (ko) * | 2013-07-22 | 2015-01-30 | 삼성전자주식회사 | 임시 접착제 조성물 및 이를 이용한 반도체 소자의 제조 방법 |
| US9976037B2 (en) * | 2015-04-01 | 2018-05-22 | Versum Materials Us, Llc | Composition for treating surface of substrate, method and device |
| JP6536464B2 (ja) * | 2016-04-26 | 2019-07-03 | 信越化学工業株式会社 | 洗浄剤組成物及び薄型基板の製造方法 |
| JP6674628B2 (ja) * | 2016-04-26 | 2020-04-01 | 信越化学工業株式会社 | 洗浄剤組成物及び薄型基板の製造方法 |
| US10319605B2 (en) * | 2016-05-10 | 2019-06-11 | Jsr Corporation | Semiconductor treatment composition and treatment method |
| JP6623132B2 (ja) * | 2016-08-31 | 2019-12-18 | 富士フイルム株式会社 | 仮接着用組成物、硬化膜および半導体素子の製造方法 |
| KR102636988B1 (ko) | 2016-12-09 | 2024-02-15 | 동우 화인켐 주식회사 | 경화 고분자 세정액 조성물 |
| JP7680366B2 (ja) * | 2019-04-09 | 2025-05-20 | ビーエーエスエフ ソシエタス・ヨーロピア | ５０ｎｍ以下のライン間寸法を有するパターン化材料を処理する際のパターンの崩壊を回避するための、アンモニア活性化シロキサンを含む組成物 |
-
2021
- 2021-03-22 JP JP2022510469A patent/JP7640937B2/ja active Active
- 2021-03-22 US US17/912,979 patent/US20230151307A1/en active Pending
- 2021-03-22 WO PCT/JP2021/011673 patent/WO2021193514A1/ja not_active Ceased
- 2021-03-22 KR KR1020227035910A patent/KR20220157423A/ko active Pending
- 2021-03-22 CN CN202180024052.0A patent/CN115335971B/zh active Active
- 2021-03-22 EP EP21776961.1A patent/EP4130222A4/en active Pending
- 2021-03-23 TW TW110110433A patent/TW202146594A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013520009A (ja) * | 2010-02-12 | 2013-05-30 | ダウ コーニング コーポレーション | 半導体加工のための一時的ウェハー接着方法 |
| JP2013232459A (ja) * | 2012-04-27 | 2013-11-14 | Shin Etsu Chem Co Ltd | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP2014241399A (ja) * | 2013-05-14 | 2014-12-25 | 信越化学工業株式会社 | ウエハ用仮接着材料、それらを用いた仮接着用フィルム、及びウエハ加工体並びにそれらを使用した薄型ウエハの製造方法 |
| WO2015190438A1 (ja) * | 2014-06-10 | 2015-12-17 | 日産化学工業株式会社 | 仮接着剤を用いた積層体 |
| WO2016152598A1 (ja) * | 2015-03-23 | 2016-09-29 | 富士フイルム株式会社 | キットおよび積層体 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021193514A1 (ja) | 2021-09-30 |
| KR20220157423A (ko) | 2022-11-29 |
| EP4130222A4 (en) | 2024-04-10 |
| US20230151307A1 (en) | 2023-05-18 |
| CN115335971B (zh) | 2026-01-09 |
| CN115335971A (zh) | 2022-11-11 |
| JP7640937B2 (ja) | 2025-03-06 |
| TW202146594A (zh) | 2021-12-16 |
| EP4130222A1 (en) | 2023-02-08 |
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