CN115335971B - 半导体基板的清洗方法、经加工的半导体基板的制造方法以及剥离用组合物 - Google Patents

半导体基板的清洗方法、经加工的半导体基板的制造方法以及剥离用组合物

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Publication number
CN115335971B
CN115335971B CN202180024052.0A CN202180024052A CN115335971B CN 115335971 B CN115335971 B CN 115335971B CN 202180024052 A CN202180024052 A CN 202180024052A CN 115335971 B CN115335971 B CN 115335971B
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CN
China
Prior art keywords
semiconductor substrate
adhesive
unit
adhesive layer
composition
Prior art date
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Application number
CN202180024052.0A
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English (en)
Chinese (zh)
Other versions
CN115335971A (zh
Inventor
荻野浩司
奥野贵久
柳井昌树
福田拓也
绪方裕斗
森谷俊介
新城彻也
泽田和宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
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Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of CN115335971A publication Critical patent/CN115335971A/zh
Application granted granted Critical
Publication of CN115335971B publication Critical patent/CN115335971B/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/24—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5027—Hydrocarbons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
CN202180024052.0A 2020-03-23 2021-03-22 半导体基板的清洗方法、经加工的半导体基板的制造方法以及剥离用组合物 Active CN115335971B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-050950 2020-03-23
JP2020050950 2020-03-23
PCT/JP2021/011673 WO2021193514A1 (ja) 2020-03-23 2021-03-22 半導体基板の洗浄方法、加工された半導体基板の製造方法及び剥離用組成物

Publications (2)

Publication Number Publication Date
CN115335971A CN115335971A (zh) 2022-11-11
CN115335971B true CN115335971B (zh) 2026-01-09

Family

ID=77892171

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180024052.0A Active CN115335971B (zh) 2020-03-23 2021-03-22 半导体基板的清洗方法、经加工的半导体基板的制造方法以及剥离用组合物

Country Status (7)

Country Link
US (1) US20230151307A1 (https=)
EP (1) EP4130222A4 (https=)
JP (1) JP7640937B2 (https=)
KR (1) KR20220157423A (https=)
CN (1) CN115335971B (https=)
TW (1) TW202146594A (https=)
WO (1) WO2021193514A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4535403A4 (en) * 2022-06-02 2026-05-06 Nissan Chemical Corp Photoradiation-releasable adhesive composition, laminate, and method for producing processed semiconductor substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107406748A (zh) * 2015-03-23 2017-11-28 富士胶片株式会社 套组及层叠体

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JP3479648B2 (ja) * 2001-12-27 2003-12-15 クラリアント インターナショナル リミテッド ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法
US6818608B2 (en) 2002-02-01 2004-11-16 John C. Moore Cured polymers dissolving compositions
KR20120132624A (ko) * 2010-02-12 2012-12-06 다우 코닝 코포레이션 반도체 가공을 위한 임시 웨이퍼 접합 방법
US8940104B2 (en) * 2011-08-02 2015-01-27 Brewer Science Inc. Cleaning composition for temporary wafer bonding materials
JP5767159B2 (ja) * 2012-04-27 2015-08-19 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP2014133855A (ja) 2012-12-11 2014-07-24 Fujifilm Corp シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法
JP6224509B2 (ja) * 2013-05-14 2017-11-01 信越化学工業株式会社 ウエハ用仮接着材料、それらを用いた仮接着用フィルム、及びウエハ加工体並びにそれらを使用した薄型ウエハの製造方法
KR20150011072A (ko) * 2013-07-22 2015-01-30 삼성전자주식회사 임시 접착제 조성물 및 이를 이용한 반도체 소자의 제조 방법
JP6583639B2 (ja) * 2014-06-10 2019-10-02 日産化学株式会社 仮接着剤を用いた積層体
US9976037B2 (en) * 2015-04-01 2018-05-22 Versum Materials Us, Llc Composition for treating surface of substrate, method and device
JP6536464B2 (ja) * 2016-04-26 2019-07-03 信越化学工業株式会社 洗浄剤組成物及び薄型基板の製造方法
JP6674628B2 (ja) * 2016-04-26 2020-04-01 信越化学工業株式会社 洗浄剤組成物及び薄型基板の製造方法
US10319605B2 (en) * 2016-05-10 2019-06-11 Jsr Corporation Semiconductor treatment composition and treatment method
JP6623132B2 (ja) * 2016-08-31 2019-12-18 富士フイルム株式会社 仮接着用組成物、硬化膜および半導体素子の製造方法
KR102636988B1 (ko) 2016-12-09 2024-02-15 동우 화인켐 주식회사 경화 고분자 세정액 조성물
JP7680366B2 (ja) * 2019-04-09 2025-05-20 ビーエーエスエフ ソシエタス・ヨーロピア ５０ｎｍ以下のライン間寸法を有するパターン化材料を処理する際のパターンの崩壊を回避するための、アンモニア活性化シロキサンを含む組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
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CN107406748A (zh) * 2015-03-23 2017-11-28 富士胶片株式会社 套组及层叠体

Also Published As

Publication number Publication date
WO2021193514A1 (ja) 2021-09-30
KR20220157423A (ko) 2022-11-29
EP4130222A4 (en) 2024-04-10
US20230151307A1 (en) 2023-05-18
CN115335971A (zh) 2022-11-11
JP7640937B2 (ja) 2025-03-06
JPWO2021193514A1 (https=) 2021-09-30
TW202146594A (zh) 2021-12-16
EP4130222A1 (en) 2023-02-08

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